Patents by Inventor Asaei Takabayashi

Asaei Takabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible printed wiring board
    Patent number: 6835442
    Abstract: A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm2, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer.
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: December 28, 2004
    Assignees: Sony Chemicals Corp., Circuit Foil Japan Co., Ltd.
    Inventors: Noriaki Kudo, Asaei Takabayashi, Akitoshi Suzuki, Shin Fukuda
  • Flexible printed wiring board
    Publication number: 20030132192
    Abstract: A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm2, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer.
    Type: Application
    Filed: September 12, 2002
    Publication date: July 17, 2003
    Inventors: Noriaki Kudo, Asaei Takabayashi, Akitoshi Suzuki, Shin Fukuda