Patents by Inventor Asao Isobe
Asao Isobe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 5441849Abstract: Electrical charge accumulation caused by exposure to a charged particle beam during the formation of latent image pattern can be reduced and thus the positional deviation of the pattern by using a bottom-resist layer comprising a radiation-induced conductive composition. Highly integrated semiconductor device can be made easily and in high yields. The positional deviation can further be reduced by exposing a charge particle beam patterning apparatus substantially simultaneously with an actinic radiation such as ultraviolet light, X-ray, and infrared light.Type: GrantFiled: September 8, 1993Date of Patent: August 15, 1995Assignees: Hitachi, Ltd., Hitachi Chemical CompanyInventors: Hiroshi Shiraishi, Takumi Ueno, Fumio Murai, Hajime Hayakawa, Asao Isobe
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Patent number: 5314783Abstract: A photosensitive resin composition comprising (A) an alkaline aqueous solution-soluble novolak resin, (B) a photosensitizer obtained by reacting a polyhydroxy compound with 1,2-naphthoquinone-(2)-diazido-5(or 4)-sulfonyl chloride, and (C) an ultraviolet absorber such as 2-(2'-hydroxy-5'-methylphenyl)-benzotriazole, has a strong absorption against a light of a wavelength of 365 nm and is suitable for producing semiconductor elements, etc.Type: GrantFiled: November 2, 1992Date of Patent: May 24, 1994Assignees: Hitachi Chemical Co., Ltd., Hitachi, Ltd.Inventors: Shigeru Koibuchi, Asao Isobe, Michiaki Hashimoto
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Patent number: 5215858Abstract: A photosensitive resin composition comprising (A) an alkaline aqueous solution-soluble novolak resin, (B) a photosensitizer obtained by reacting a polyhydroxy compound with 1,2-naphthoquinone-(2)-diazido-5(or 4)-sulfonyl chloride, and (C) an ultraviolet absorber such as 2-(2'-hydroxy-5'-methylphenyl)-benzotriazole, has a strong absorption against a light of a wavelength of 365 nm and is suitable for producing semiconductor elements, etc.Type: GrantFiled: March 21, 1989Date of Patent: June 1, 1993Assignees: Hitachi Chemical Company, Ltd., Hitachi, Ltd.Inventors: Shigeru Koibuchi, Asao Isobe, Michiaki Hashimoto
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Patent number: 4801519Abstract: A developing solution comprising at least two compounds selected from choline and quaternary ammonium salts is suitable for developing a negative-type photosensitive resin composition with exposure to a smaller light amount.Type: GrantFiled: April 13, 1987Date of Patent: January 31, 1989Assignees: Hitachi Chemical Company Ltd., Hitachi, Ltd.Inventors: Shigeru Koibuchi, Asao Isobe, Daisuke Makino, Yutaka Takeda
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Patent number: 4722883Abstract: Fine patterns with high degree of resolution and high resistance to etching can be produced by coating a solution of a photosensitive composition comprising (a) an aromatic azide compound and (b) an alkaline-aqueous-solution-soluble polymer on a substrate, exposing predetermined portions of the coated photosensitive composition to ultraviolet light, developing with an alkaline aqueous solution to form a resist pattern, and etching the substrate using said resist pattern as a mask.Type: GrantFiled: August 7, 1986Date of Patent: February 2, 1988Assignee: Hitachi, Ltd.Inventors: Shigeru Koibuchi, Asao Isobe, Daisuke Makino
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Patent number: 4698291Abstract: 4'-Azidobenzal-2-methoxyacetophenone is an excellent photosensitive compound and can give a photosensitive composition together with an alkaline-aqueous-solution-soluble polymer which can be insolubilized in an alkaline aqueous solution by photochemical curing with 4'-azidobenzal-2-methoxyacetophenone, and if necessary together with an organic solvent, said composition showing a very small change in viscosity with the lapse of long time.Type: GrantFiled: July 17, 1986Date of Patent: October 6, 1987Assignees: Hitachi Chemical Co., Ltd., Hitachi, Ltd.Inventors: Shigeru Koibuchi, Asao Isobe, Daisuke Makino
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Patent number: 4554237Abstract: Disclosed are photosensitive resin composition useful for formation of fine patterns on semiconductor devices, magnetic bubble devices, etc. which is highly sensitive and is excellent in developability and which has no problem such as precipitation of azide compounds and remaining azide particles after development and a method for forming fine patterns with said composition.Said photosensitive resin composition comprises (a) at least one polymer compound selected from the group consisting of a novolak resin and a polyhydroxystyrene resin and (b) an azide compound represented by the general formula (1): ##STR1## [wherein X is --N.sub.3 or --SO.sub.2 N.sub.3, Y is ##STR2## R.sup.1 is a lower alkylene such as --CH.sub.2 CH.sub.2 --, --CH.sub.2 CH.sub.2 CH.sub.2 --, or --CH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 CH.sub.2 --, a hydroxyalkylene or an aminoalkylene such as ##STR3## (wherein R.sup.4 and R.sup.5 are lower alkyl or hydrogen, R.sup.6 -R.sup.8 are lower alkyl groups, R.sup.Type: GrantFiled: December 22, 1982Date of Patent: November 19, 1985Assignees: Hitach, Ltd., Hitachi Chemical Company, Ltd.Inventors: Fumio Kataoka, Fusaji Shoji, Hitoshi Yokono, Daisuke Makino, Shigeru Koibuchi, Asao Isobe
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Patent number: 4513077Abstract: There is disclosed an image-formable resinous composition comprising a poly(olefinsulfone) and a matrix polymer, in which the matrix polymer being a novolac phenol resin obtained from:(1) m-cresol and p-cresol as main components, the molar ratio of m-cresol/p-cresol being within the range from 40/60 to 55/45, and(2) formaldehyde, the molar ratio of formaldehyde/(phenol or phenol derivatives) being within the range from 5/10 to 8/10.The image-formable resinous composition has a high sensitivity and a high dissolution.Type: GrantFiled: June 13, 1983Date of Patent: April 23, 1985Assignees: Hitachi Chemical Company, Ltd., Hitachi, Ltd.Inventors: Asao Isobe, Daisuke Makino, Hiroshi Shiraishi
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Patent number: 4499163Abstract: A photosensitive resin composition comprising (a) 20 to 75 parts by weight of a urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate and/or isophorone diisocynate dihydric alcohol and an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.Type: GrantFiled: July 11, 1983Date of Patent: February 12, 1985Assignee: Hitachi Chemical Company, Ltd.Inventors: Toshiaki Ishimaru, Katsushige Tsukada, Nobuyuki Hayashi, Shigeru Koibuchi, Asao Isobe
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Patent number: 4295947Abstract: A photo-curable coating composition for building materials which comprises(a) an isocyanate-modified epoxy ester obtained by the reaction of an acrylic or methacrylic ester of an epoxy compound having not less than two epoxy groups in the molecule with a polyisocyanate;(b) a photopolymerizable monomer being copolymerizable with the epoxy ester (a);(c) a ketone resin;(d) a photo-sensitizer; and(e) a sensitizing auxiliary.Type: GrantFiled: September 12, 1979Date of Patent: October 20, 1981Assignee: Hitachi Chemical Company, Ltd.Inventors: Eiichi Ohtani, Kengo Kobayashi, Asao Isobe, Shigeyoshi Tanaka
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Patent number: 4154709Abstract: A water-dispersible epoxy modified alkyd resin produced by reacting (A) 0-50 parts by weight of oil or oil fatty acid, (B) 10-50 parts by weight of polyhydric alcohol, (C) 0-25 parts by weight of monobasic acid having 6 to 18 carbon atoms, (D) 15-70 parts by weight of polybasic acid having 4 to 10 carbon atoms or its anhydride, (E) 5-25 parts by weight of polyoxyalkylene glycol having a molecular weight of 600 to 20,000, and (F) an epoxy compound, wherein the ratio of the hydroxyl groups to the carboxyl groups in the components (A) through (E) is 0.625-1.8 and the amount of the component (F) is 3-50 parts by weight per 100 parts by weight of the total weight of the components (A) through (E), can provide water-dispersible coatings having improved drying characteristics and water resistance as well as corrosion resistance.Type: GrantFiled: March 6, 1978Date of Patent: May 15, 1979Assignee: Hitachi Chemical Company, Ltd.Inventors: Ryoji Ukita, Asao Isobe, Takao Hirayama, Shigeyoshi Tanaka
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Patent number: 4108666Abstract: A photosensitive composition for a photoresist, which comprises (A) a compound having the following general formula: ##STR1## wherein Z is a cyclic dibasic acid anhydride moiety, R.sup.1 is an alkylene group having 1 to 3 carbon atoms, R.sup.2 is hydrogen or methyl, and R.sup.3 is hydrogen, methyl, ethyl or -CH.sub.2 X in which X is chlorine or bromine, (B) a photopolymerization sensitizer, (C) a polymer being capable of giving a film-forming property, (D) a chain transfer agent and (E) a thermal polymerization inhibitor; and a laminated photosensitive element which has a substantially dry photosensitive layer of the photosensitive composition. The composition and element are capable of giving a minute resist pattern which is excellent as an etching resist or metal plating resist and can be readily removed after etching or metal plating.Type: GrantFiled: March 11, 1976Date of Patent: August 22, 1978Assignee: Hitachi Chemical Co., Ltd.Inventors: Nobuyuki Hayashi, Asao Isobe, Katsushige Tsukada, Toshiaki Ishimaru
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Patent number: 4101364Abstract: It is herein proposed to laminate a film onto a convex-concaved solid surface in a vacuum to accomplish tight contact between the film and the solid surface. The apparatus includes an air tight housing in which lamination press rolls are arranged, wherein feeding-in and feeding-out of materials such as a base plate and a film for lamination are effected through air tight roll assemblies incorporated in the wall structure of the air tight housing.Type: GrantFiled: July 28, 1976Date of Patent: July 18, 1978Assignee: Hitachi Chemical Company, Ltd.Inventors: Katsushige Tsukada, Nobuyuki Hayashi, Hideo Yamada, Toshiaki Ishimaru, Asao Isobe, Tadazi Sato
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Patent number: 4035189Abstract: A resist image, which is excellent in adhesiveness and high in physicochemical strengths, can be obtained by using as a resist material a resin composition having such properties that when it is exposed to actinic rays, a latent image (cure-precursor) is formed therein, and when it is subjected to subsequent heating, only the latent image portion is selectively cured.An example of the above-mentioned resin composition is a latently curable epoxy resin composition composed essentially of (A) an epoxy resin prepolymer and (B) a compound having in the molecule at least two groups represented by the formulas (I) and/or (II), ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 are individually a hydrogen atom, an alkyl group or aryl group.Type: GrantFiled: July 10, 1975Date of Patent: July 12, 1977Assignee: Hitachi Chemical Company, Ltd.Inventors: Nobuyuki Hayashi, Asao Isobe, Katsushige Tsukada, Ken Ogawa, Masahiro Abo
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Patent number: 4025348Abstract: A photosensitive resin composition consisting essentially of (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a reactive linear high molecular weight compound having in its side chain one or two functional groups selected from the class consisting of tetrahydrofurfuryl group and N-alkoxymethylcarbamoyl group, (C) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (D) a compound having at least two epoxy groups, and (E) a potential or latent curing agent for epoxy resins. The photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence can be used in the production of printed circuit boards and the precision-processing of metals.Type: GrantFiled: May 5, 1975Date of Patent: May 24, 1977Assignee: Hitachi Chemical Company, Ltd.Inventors: Katsushige Tsukada, Asao Isobe, Toshiaki Ishimaru, Nobuyuki Hayashi, Masahiro Abo
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Patent number: 3989610Abstract: A photosensitive resin composition consisting of, or comprising as the essential components, (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (C) a compound containing at least two epoxy groups, and (D) a compound selected from the group consisting of dicyandiamide, p,p'-diaminodiphenyl compounds, polycarboxylic acids having at least two carboxyl groups, polycarboxylic anhydrides and mixtures of the polycarboxylic acids and the polycarboxlic anhydrides. The above photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence, can be used in the production of printed circuit boards, precision-processing of metals and as materials for adhesives, paints, plastic relief and the like.Type: GrantFiled: February 12, 1974Date of Patent: November 2, 1976Assignee: Hitachi Chemical Company, Ltd.Inventors: Katsushige Tsukada, Asao Isobe, Nobuyuki Hayashi, Masahiro Abo, Ken Ogawa