Patents by Inventor Aseem Wahi

Aseem Wahi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular power semiconductor module
    Patent number: 7190070
    Abstract: A modular power semiconductor module for mounting on a heat sink comprises a plurality of partial modules, each having a base plate and a framelike housing as well as terminal elements for load terminals and auxiliary terminals. Adjacent partial modules are assembled into a complete power semiconductor module by means of a cap that fixes the partial modules relative to one another and/or by means of connections that fix the various partial modules relative to one another.
    Type: Grant
    Filed: April 9, 2004
    Date of Patent: March 13, 2007
    Assignee: Semikron Elektronik GmbH & Co. KG
    Inventors: Yvone Manz, Markus Gruber, Aseem Wahi
  • Modular power semiconductor module
    Publication number: 20050093122
    Abstract: A modular power semiconductor module for mounting on a heat sink comprises a plurality of partial modules, each having a base plate and a framelike housing as well as terminal elements for load terminals and auxiliary terminals. Adjacent partial modules are assembled into a complete power semiconductor module by means of a cap that fixes the partial modules relative to one another and/or by means of connections that fix the various partial modules relative to one another.
    Type: Application
    Filed: April 9, 2004
    Publication date: May 5, 2005
    Inventors: Yvone Manz, Markus Gruber, Aseem Wahi
  • Modular power semiconductor module
    Publication number: 20050012190
    Abstract: A modular power semiconductor module for mounting on a heat sink comprises a plurality of partial modules, each having a base plate and a framelike housing as well as terminal elements for load terminals and auxiliary terminals. Adjacent partial modules are assembled into a complete power semiconductor module by means of a cap that fixes the partial modules relative to one another and/or by means of connections that fix the various partial modules relative to one another.
    Type: Application
    Filed: August 19, 2004
    Publication date: January 20, 2005
    Inventors: Yvone Manz, Markus Gruber, Aseem Wahi