Patents by Inventor Ashish Asthana
Ashish Asthana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240009666Abstract: A flow apparatus for measuring at least one biophysical property of one or more components is provided. The apparatus comprises one or more microfluidic devices. Each microfluidic device comprises: a sample channel having a sample inlet port for introducing a sample fluid flow comprising one or more components at a first flow rate into an elongate distribution channel, an auxiliary channel having an auxiliary inlet port for introducing an auxiliary fluid flow at a second flow rate into the elongate distribution channel. The distribution channel is configured to enable a lateral distribution of the components from the sample fluid flow into the auxiliary fluid flow. Each microfluidic device further comprises two or more capillary channels provided downstream and in fluid communication with the distribution channel, at least one outlet port provided downstream of each of the capillary channels.Type: ApplicationFiled: August 20, 2021Publication date: January 11, 2024Applicant: Fluidic Analytics LimitedInventors: Ashish Asthana, Jean-Paul Delport, Sean Devenish, Anthony Douglas, Hannah Kenyon, Maren Butz, Viola Denninger, Simon Morling, Thomas Mueller, Laurence Young, Simon Chandler
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Publication number: 20220187242Abstract: A method of separating and analysing a plurality of components in a heterogeneous sample is provided. The method comprising the steps of: introducing a separation fluid into a separation channel that is elongate in a first direction; introducing the heterogeneous sample into said channel; separating, in the first direction, the components in the sample; introducing an auxiliary fluid into said channel; creating a lateral distribution of the components in a second direction substantially perpendicular to the first direction; and determining, sequentially, a property of each of the components based on the regimen by which the lateral distribution was created. An apparatus for separating and analysing a plurality of components in a heterogeneous sample is also provided.Type: ApplicationFiled: March 27, 2020Publication date: June 16, 2022Applicant: Fluidic Analytics LimitedInventors: Thomas Mueller, Philipp Hahn, Sean Devenish, Ashish Asthana, Tuomas Pertti Jonathan Knowles
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Publication number: 20170141720Abstract: Photovoltaic modules including a plurality of solar cells bonded to a module back sheet are described herein, wherein each solar cell includes a superstrate bonded to a front side of a photovoltaic device to facilitate handling of very thin photovoltaic devices during fabrication of the module. Modules may also include module front sheets and the solar cells may include bottom sheets. The modules may be made of flexible materials, and may be foldable. Fabrication processes include tabbing photovoltaic devices prior to attaching the individual superstrates.Type: ApplicationFiled: October 8, 2015Publication date: May 18, 2017Inventors: Kramadhati V. Ravi, Tirunelveli S. Ravi, Ashish Asthana, Somnath Nag
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Patent number: 9455360Abstract: Methods of fabricating metal wrap through solar cells and modules for thin silicon solar cells, including epitaxial silicon solar cells, are described. These metal wrap through solar cells have a planar back contact geometry for the base and emitter contacts. Fabrication of a metal wrap through solar cell may comprise: providing a photovoltaic device attached at the emitter side of the device to a solar glass by an encapsulant, the device including busbars on the device emitter; forming vias through the device base and emitter, the vias terminating in the busbars; depositing a conformal dielectric film over the surface of the vias and the back surface of the base; removing portions of the conformal dielectric film from the ends of the vias for exposing the busbars and from field areas of the base; and forming separate electrical contacts to the busbars and the field areas on the back surface of the solar cell.Type: GrantFiled: November 7, 2014Date of Patent: September 27, 2016Assignee: Crystal Solar, Inc.Inventors: Ashish Asthana, Tirunelveli S. Ravi, Kramadhati V. Ravi, Somnath Nag
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Publication number: 20160233824Abstract: Photovoltaic modules including a plurality of solar cells bonded to a module back sheet are described herein, wherein each solar cell includes a superstrate bonded to a front side of a photovoltaic device to facilitate handling of very thin photovoltaic devices during fabrication of the module. Modules may also include module front sheets and the solar cells may include bottom sheets. The modules may be made of flexible materials, and may be foldable. Fabrication processes include tabbing photovoltaic devices prior to attaching the individual superstrates.Type: ApplicationFiled: October 8, 2015Publication date: August 11, 2016Inventors: Kramadhati V. Ravi, Tirunelveli S. Ravi, Ashish Asthana, Somnath Nag
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Patent number: 9397239Abstract: Fabrication of a single crystal silicon solar cell with an insitu epitaxially deposited very highly doped p-type silicon back surface field obviates the need for the conventional aluminum screen printing step, thus enabling a thinner silicon solar cell because of no aluminum induced bow in the cell. Furthermore, fabrication of a single crystal silicon solar cell with insitu epitaxial p-n junction formation and very highly doped n-type silicon front surface field completely avoids the conventional dopant diffusion step and one screen printing step, thus enabling a cheaper manufacturing process.Type: GrantFiled: December 17, 2013Date of Patent: July 19, 2016Assignee: Crystal Solar, IncorporatedInventors: Tirunelveli S. Ravi, Ashish Asthana
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Publication number: 20150187966Abstract: Methods of fabricating metal wrap through solar cells and modules for thin silicon solar cells, including epitaxial silicon solar cells, are described. These metal wrap through solar cells have a planar back contact geometry for the base and emitter contacts. Fabrication of a metal wrap through solar cell may comprise: providing a photovoltaic device attached at the emitter side of the device to a solar glass by an encapsulant, the device including busbars on the device emitter; forming vias through the device base and emitter, the vias terminating in the busbars; depositing a conformal dielectric film over the surface of the vias and the back surface of the base; removing portions of the conformal dielectric film from the ends of the vias for exposing the busbars and from field areas of the base; and forming separate electrical contacts to the busbars and the field areas on the back surface of the solar cell.Type: ApplicationFiled: November 7, 2014Publication date: July 2, 2015Inventors: Ashish Asthana, Tirunelveli S. Ravi, Kramadhati V. Ravi, Somnath Nag
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Patent number: 9006028Abstract: This document describes the fabrication and use of multilayer ceramic substrates, having one or more levels of internal thick film metal conductor patterns, wherein any or all of the metal vias intersecting one or both of the major surface planes of the substrates, extend out of the surface to be used for making flexible, temporary or permanent interconnections, to terminals of an electronic component. Such structures are useful for wafer probing, and for packaging, of semiconductor devices.Type: GrantFiled: September 11, 2009Date of Patent: April 14, 2015Inventors: Ananda H. Kumar, Ashish Asthana, Farooq Quadri
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Patent number: 8900399Abstract: An anodic etching system for simultaneously etching a multiplicity of substrates comprises: an etching tank for containing therein an etchant solution; a power supply connected between a first electrode and a second electrode, the first electrode and the second electrode being immersible in the etchant solution and positioned at opposite ends of the tank; and a plurality of support plates serially arranged between the first electrode and the second electrode and sealed to walls of the tank, wherein each of the plurality of support plates is configured to support at least one of the multiplicity of substrates, and wherein any consecutive pair of the plurality of support plates defines an isolated volume of the tank for containing a portion of the etchant solution. The plurality of support plates may be susceptors configured for holding the multiplicity of substrates in a chemical vapor deposition tool.Type: GrantFiled: March 17, 2011Date of Patent: December 2, 2014Assignee: Crystal Solar, Inc.Inventors: Tirunelveli S. Ravi, Ananda H. Kumar, Ashish Asthana, Kyle Ross Tantiwong, Visweswaren Sivaramakrishnan
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Patent number: 8883552Abstract: Methods of fabricating metal wrap through solar cells and modules for thin silicon solar cells, including epitaxial silicon solar cells, are described. These metal wrap through solar cells have a planar back contact geometry for the base and emitter contacts. Fabrication of a metal wrap through solar cell may comprise: providing a photovoltaic device attached at the emitter side of the device to a solar glass by an encapsulant, the device including busbars on the device emitter; forming vias through the device base and emitter, the vias terminating in the busbars; depositing a conformal dielectric film over the surface of the vias and the back surface of the base; removing portions of the conformal dielectric film from the ends of the vias for exposing the busbars and from field areas of the base; and forming separate electrical contacts to the busbars and the field areas on the back surface of the solar cell.Type: GrantFiled: August 11, 2011Date of Patent: November 11, 2014Assignee: Crystal Solar Inc.Inventors: Ashish Asthana, Tirunelveli S. Ravi, Kramadhati V. Ravi, Somnath Nag
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Publication number: 20140318442Abstract: An epitaxial reactor enabling simultaneous deposition of thin films on a multiplicity of wafers is disclosed. During deposition, a number of wafers are contained within a wafer sleeve comprising a number of wafer carrier plates spaced closely apart. Process gases flow preferentially into the interior volume of the wafer sleeve, which is heated by one or more lamp modules. To improve uniformity, the direction of process gas flow may be varied in a cross-flow configuration and the wafers may be mounted at a small angle to the plane of the wafer carrier plates, wherein the wafers are configured in pairs along the direction of gas flow and wherein along the direction of gas flow the angular mounting of the wafers provides a smaller gap between opposed wafer surfaces on said parallel wafer carrier plates in the center of said wafer sleeve than at the periphery of said wafer sleeve.Type: ApplicationFiled: March 17, 2014Publication date: October 30, 2014Applicant: Crystal Solar IncorporatedInventors: Visweswaren Sivaramakrishnan, Jean Vatus, Andrzej Kaszuba, Vicente Lim, Ashish Asthana
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Publication number: 20140182673Abstract: Fabrication of a single crystal silicon solar cell with an insitu epitaxially deposited very highly doped p-type silicon back surface field obviates the need for the conventional aluminum screen printing step, thus enabling a thinner silicon solar cell because of no aluminum induced bow in the cell. Furthermore, fabrication of a single crystal silicon solar cell with insitu epitaxial p-n junction formation and very highly doped n-type silicon front surface field completely avoids the conventional dopant diffusion step and one screen printing step, thus enabling a cheaper manufacturing process.Type: ApplicationFiled: December 17, 2013Publication date: July 3, 2014Applicant: Crystal Solar, Inc.Inventors: Tirunelveli S. Ravi, Ashish Asthana
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Patent number: 8609451Abstract: Fabrication of a single crystal silicon solar cell with an insitu epitaxially deposited very highly doped p-type silicon back surface field obviates the need for the conventional aluminum screen printing step, thus enabling a thinner silicon solar cell because of no aluminum induced bow in the cell. Furthermore, fabrication of a single crystal silicon solar cell with insitu epitaxial p-n junction formation and very highly doped n-type silicon front surface field completely avoids the conventional dopant diffusion step and one screen printing step, thus enabling a cheaper manufacturing process.Type: GrantFiled: March 19, 2012Date of Patent: December 17, 2013Assignee: Crystal Solar Inc.Inventors: Tirunelveli S. Ravi, Ashish Asthana
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Publication number: 20130056044Abstract: Photovoltaic modules including a plurality of solar cells bonded to a module back sheet are described herein, wherein each solar cell includes a superstrate bonded to a front side of a photovoltaic device to facilitate handling of very thin photovoltaic devices during fabrication of the module. Modules may also include module front sheets and the solar cells may include bottom sheets. The modules may be made of flexible materials, and may be foldable. Fabrication processes include tabbing photovoltaic devices prior to attaching the individual superstrates.Type: ApplicationFiled: August 3, 2012Publication date: March 7, 2013Applicant: Crystal Solar, Inc.Inventors: Kramadhati V. Ravi, Tirunelveli S. Ravi, Ashish Asthana, Somnath Nag
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Publication number: 20120288990Abstract: Fabrication of a single crystal silicon solar cell with an insitu epitaxially deposited very highly doped p-type silicon back surface field obviates the need for the conventional aluminum screen printing step, thus enabling a thinner silicon solar cell because of no aluminum induced bow in the cell. Furthermore, fabrication of a single crystal silicon solar cell with insitu epitaxial p-n junction formation and very highly doped n-type silicon front surface field completely avoids the conventional dopant diffusion step and one screen printing step, thus enabling a cheaper manufacturing process.Type: ApplicationFiled: March 19, 2012Publication date: November 15, 2012Applicant: Crystal Solar, Inc.Inventors: Tirunelveli S. Ravi, Ashish Asthana
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Publication number: 20120040487Abstract: Methods of fabricating metal wrap through solar cells and modules for thin silicon solar cells, including epitaxial silicon solar cells, are described. These metal wrap through solar cells have a planar back contact geometry for the base and emitter contacts. Fabrication of a metal wrap through solar cell may comprise: providing a photovoltaic device attached at the emitter side of the device to a solar glass by an encapsulant, the device including busbars on the device emitter; forming vias through the device base and emitter, the vias terminating in the busbars; depositing a conformal dielectric film over the surface of the vias and the back surface of the base; removing portions of the conformal dielectric film from the ends of the vias for exposing the busbars and from field areas of the base; and forming separate electrical contacts to the busbars and the field areas on the back surface of the solar cell.Type: ApplicationFiled: August 11, 2011Publication date: February 16, 2012Applicant: Crystal Solar, Inc.Inventors: Ashish Asthana, Tirunelveli S. Ravi, Kramadhati V. Ravi, Somnath Nag
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Publication number: 20110300715Abstract: A method for fabricating a photovoltaic (PV) cell panel wherein all PV cells are formed simultaneously on a two-dimensional array of monocrystalline silicon mother wafers affixed to a susceptor is disclosed. Porous silicon separation layers are anodized in the surfaces of the mother wafers. The porous film is then smoothed to form a suitable surface for epitaxial film growth. An epitaxial reactor is used to grow n- and p-type films forming the PV cell structures. Contacts to the n- and p-layers are deposited, followed by gluing of a glass layer to the PV cell array. The porous silicon film is then separated by exfoliation in a peeling motion across all the cells attached together above, followed by attaching a strengthening layer on the PV cell array. The array of mother wafers may be reused multiple times, thereby reducing materials costs for the completed solar panels.Type: ApplicationFiled: March 17, 2011Publication date: December 8, 2011Applicant: Crystal Solar, IncorporatedInventors: Tirunelveli S. Ravi, Ananda H. Kumar, Ashish Asthana, Visweswaren Sivaramakrishnan
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Patent number: 8030119Abstract: A method for fabricating a photovoltaic (PV) cell panel wherein all PV cells are formed simultaneously on a two-dimensional array of monocrystalline silicon mother wafers affixed to a susceptor is disclosed. Porous silicon separation layers are anodized in the surfaces of the mother wafers. The porous film is then smoothed to form a suitable surface for epitaxial film growth. An epitaxial reactor is used to grow n- and p-type films forming the PV cell structures. Contacts to the n- and p-layers are deposited, followed by gluing of a glass layer to the PV cell array. The porous silicon film is then separated by exfoliation in a peeling motion across all the cells attached together above, followed by attaching a strengthening layer on the PV cell array. The array of mother wafers may be reused multiple times, thereby reducing materials costs for the completed solar panels.Type: GrantFiled: March 6, 2009Date of Patent: October 4, 2011Assignee: Crystal Solar, Inc.Inventors: Tirunelveli S. Ravi, Ananda H. Kumar, Ashish Asthana
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Publication number: 20100090339Abstract: This document describes the fabrication and use of multilayer ceramic substrates, having one or more levels of internal thick film metal conductor patterns, wherein any or all of the metal vias intersecting one or both of the major surface planes of the substrates, extend out of the surface to be used for making flexible, temporary or permanent interconnections, to terminals of an electronic component. Such structures are useful for wafer probing, and for packaging, of semiconductor devices. In some embodiments, such structures are shown to be useful for simultaneously testing multiple devices on a semiconductor wafer, or for assembling multiple substrates on to a wafer, to accomplish both testing and packaging of the dies on the wafer. In yet another embodiment of the invention, single or multilevel ceramic interconnect structures with thick film metal conductors, are fabricated right on the product wafer to facilitate economical testing and packaging of the dies on the wafer.Type: ApplicationFiled: September 11, 2009Publication date: April 15, 2010Inventors: Ananda H. Kumar, Ashish Asthana, Farooq Quadri
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Publication number: 20100068837Abstract: This document describes the fabrication and use of multilayer ceramic substrates, having one or more levels of internal thick film metal conductor patterns, wherein any or all of the metal vias intersecting one or both of the major surface planes of the substrates, extend out of the surface to be used for making flexible, temporary or permanent interconnections, to terminals of an electronic component. Such structures are useful for wafer probing, and for packaging, of semiconductor devices. In some embodiments, such structures are shown to be useful for simultaneously testing multiple devices on a semiconductor wafer, or for assembling multiple substrates on to a wafer, to accomplish both testing and packaging of the dies on the wafer. In yet another embodiment of the invention, single or multilevel ceramic interconnect structures with thick film metal conductors, are fabricated right on the product wafer to facilitate economical testing and packaging of the dies on the wafer.Type: ApplicationFiled: September 11, 2009Publication date: March 18, 2010Inventors: Ananda H. Kumar, Ashish Asthana, Farooq Quadri