Abstract: In accordance with one or more embodiments of the present disclosure, a host-guest lost circulation material (LCM) composition for sealing lost circulation zones in wellbores includes an aqueous solution; one or more linear polymer chains, the linear polymer chains comprising polyethylene glycols (PEG) with molecular weights greater than 2500 g/mol, polypropylene glycols (PPG), polydimethylsiloxanes (PDMS), or combinations thereof; and one or more cyclic molecules comprising alpha cyclodextrin, beta cyclodextrin, gamma cyclodextrin, or combinations thereof, and wherein the one or more cyclic molecules form a host-guest structure around the one or more linear polymer chains utilizing van der Waals forces.

Abstract: Synthetic functionalized additives may comprise a layered magnesium silicate. The layered magnesium silicate may comprise a first functionalized silicate layer comprising a first tetrahedral silicate layer covalently bonded to at least two different functional groups, an octahedral brucite layer, and a second functionalized silicate layer comprising a second tetrahedral silicate layer covalently bonded to at least two different functional groups. A drilling fluid may comprise the synthetic functionalized additive.

Abstract: A profile cutting tool includes a base, a clamp mounted to the base configured to hold an elongate workpiece, a pivotable frame pivotally mounted to the base, and a workpiece cutting assembly mounted to the pivotable frame and comprising a cutter configured to cut the elongate workpiece held in the clamp. When the pivotable frame pivots with respect to the base, the cutter is configured to move along an arcuate profile cutting path having a first radius.

Abstract: A light emitting device having first, second and third dimensions that are orthogonal may include a light emitting semiconductor device configured to emit light via a first surface in a plane formed by the first and second dimensions. The light emitting device may further include a wavelength converting structure disposed on the first surface of the light emitting semiconductor device, the wavelength converting structure extending beyond the light emitting semiconductor device in the first dimension and the light emitting semiconductor device extending beyond the wavelength converting structure in the second dimension. The light emitting device may further include one or more optical extraction features in at least one gap formed by the wavelength converting structure extending beyond the light emitting semiconductor structure in the first dimension and/or formed by the light emitting semiconductor structure extending beyond the wavelength converting structure in the second dimension.

Abstract: A device may include a wavelength converting layer on an epitaxial layer. The wavelength converting layer may include a first surface having a width that is equal to a width of the epitaxial layer, a second surface having a width that is less than the width of the first surface, and angled sidewalls. A conformal non-emission layer may be formed on the angled sidewalls and sidewalls of the epitaxial layer, such that the second surface of the wavelength converting layer is exposed.

Abstract: A power tool assembly includes a base having a work surface, which is configured to receive a workpiece. A workpiece clamp assembly is moveably mountable on the work surface. The workpiece clamp assembly has a moveable clamp mount configured to fix the workpiece claim assembly in a plurality of different positions on the work surface, a clamp arm being operatively engageable with the moveable clamp mount and configured to move in a direction towards the fence, and at least one locking pin moveable between a first position and a second with respect to the moveable clamp mount wherein in the first position the at least one locking pin is configured to fix the workpiece clamp assembly to the base and in the second position the at least one locking pin is configured to release the workpiece clamp assembly from the base.

Abstract: Disclosed herein is an anticaking agent for cheese, comprising one or more dairy ingredients; and one or more non-dairy ingredients. When applied the anticaking agent is applied to a divided cheese, it has low visibility on the divided cheese, prevents caking of the divided cheese, and browns similarly to divided cheese without the anticaking agent when baked in an impinger oven at between 425° F. and 450° F. for 5 minutes. Also disclosed are food products containing an anticaking agent described herein, and methods for treating divided cheese for anticaking using an anticaking agent described herein.

Abstract: A device may include a wavelength converting layer on an epitaxial layer. The wavelength converting layer may include a first surface having a width that is equal to a width of the epitaxial layer, a second surface having a width that is less than the width of the first surface, and angled sidewalls. A conformal non-emission layer may be formed on the angled sidewalls and sidewalls of the epitaxial layer, such that the second surface of the wavelength converting layer is exposed.

Abstract: A device may include a wavelength converting layer on an epitaxial layer. The wavelength converting layer may include a first surface having a width that is equal to a width of the epitaxial layer, a second surface having a width that is less than the width of the first surface, and angled sidewalls. A conformal non-emission layer may be formed on the angled sidewalls and sidewalls of the epitaxial layer, such that the second surface of the wavelength converting layer is exposed.

Abstract: A light emitting device having first, second and third dimensions that are orthogonal may include a light emitting semiconductor device configured to emit light via a first surface in a plane formed by the first and second dimensions. The light emitting device may further include a wavelength converting structure disposed on the first surface of the light emitting semiconductor device, the wavelength converting structure extending beyond the light emitting semiconductor device in the first dimension and the light emitting semiconductor device extending beyond the wavelength converting structure in the second dimension. The light emitting device may further include one or more optical extraction features in at least one gap formed by the wavelength converting structure extending beyond the light emitting semiconductor structure in the first dimension and/or formed by the light emitting semiconductor structure extending beyond the wavelength converting structure in the second dimension.

Abstract: A light emitting device having first, second and third dimensions that are orthogonal may include a light emitting semiconductor device configured to emit light via a first surface in a plane formed by the first and second dimensions. The light emitting device may further include a wavelength converting structure disposed on the first surface of the light emitting semiconductor device, the wavelength converting structure extending beyond the light emitting semiconductor device in the first dimension and the light emitting semiconductor device extending beyond the wavelength converting structure in the second dimension. The light emitting device may further include one or more optical extraction features in at least one gap formed by the wavelength converting structure extending beyond the light emitting semiconductor structure in the first dimension and/or formed by the light emitting semiconductor structure extending beyond the wavelength converting structure in the second dimension.

Abstract: Disclosed herein is an anticaking agent for cheese, comprising one or more dairy ingredients; and one or more non-dairy ingredients. When applied the anticaking agent is applied to a divided cheese, it has low visibility on the divided cheese, prevents caking of the divided cheese, and browns similarly to divided cheese without the anticaking agent when baked in an impinger oven at between 425° F. and 450° F. for 5 minutes. Also disclosed are food products containing an anticaking agent described herein, and methods for treating divided cheese for anticaking using an anticaking agent described herein.

Abstract: Disclosed herein is an anticaking agent for cheese, comprising one or more dairy ingredients; and one or more non-dairy ingredients. When applied the anticaking agent is applied to a divided cheese, it has low visibility on the divided cheese, prevents caking of the divided cheese, and browns similarly to divided cheese without the anticaking agent when baked in an impinger oven at between 425° F. and 450° F. for 5 minutes. Also disclosed are food products containing an anticaking agent described herein, and methods for treating divided cheese for anticaking using an anticaking agent described herein.

Abstract: An adapter for use with a display includes an interface for communicating with a server; a processor; and a sensor portion for retrieving impression information wherein the processor retrieves the user content via the interface for display by the display and the sensor portion retrieves impression information associated with the user content being displayed.

Abstract: A light emitting device having first, second and third dimensions that are orthogonal may include a light emitting semiconductor device configured to emit light via a first surface in a plane formed by the first and second dimensions. The light emitting device may further include a wavelength converting structure disposed on the first surface of the light emitting semiconductor device, the wavelength converting structure extending beyond the light emitting semiconductor device in the first dimension and the light emitting semiconductor device extending beyond the wavelength converting structure in the second dimension. The light emitting device may further include one or more optical extraction features in at least one gap formed by the wavelength converting structure extending beyond the light emitting semiconductor structure in the first dimension and/or formed by the light emitting semiconductor structure extending beyond the wavelength converting structure in the second dimension.

Abstract: A mechanical transmission system is provided for a barrier operator system for positioning a garage door between open and closed positions. The transmission system includes a rail having a channel to receive a drive sprocket and a return pulley. A drive element is trained around the drive sprocket and return pulley. The system further includes a tensioning system disposed within the channel and includes a return pulley support member and a bracket disposed on an end of the rail for supporting the return pulley support member. In addition, an adjusting screw is interfaced with and extends between the return pulley support member and the bracket, the adjusting screw movable to adjust the position of the return pulley support member relative to the bracket to increase or decrease the tension of the drive element.

Abstract: A combination cutting and straining apparatus includes a cutting board that includes a planar configuration having opposed top and bottom surfaces, the cutting board having opposed front and rear edges and having first and second side edges extending between ends of the front and rear edges, respectively. The bottom surface of the cutting board defines first and second grooves that are proximate to and extend parallel to the first and second side edges, respectively, and extend between the front and rear edges, respectively. A strainer basket includes a bottom wall and a plurality of walls extending upwardly from peripheral edges of the bottom wall, respectively, for collectively defining an interior straining area. Side walls of the strainer basket include upper edges received in respective grooves for slidable movement of the cutting board atop the strainer basket. Cutting board legs are pivotally coupled to a bottom surface of the cutting board.

Abstract: A device may include a wavelength converting layer on an epitaxial layer. The wavelength converting layer may include a first surface having a width that is equal to a width of the epitaxial layer, a second surface having a width that is less than the width of the first surface, and angled sidewalls. A conformal non-emission layer may be formed on the angled sidewalls and sidewalls of the epitaxial layer, such that the second surface of the wavelength converting layer is exposed.

Abstract: Disclosed herein is an anticaking agent for cheese, comprising one or more dairy ingredients; and one or more non-dairy ingredients. When applied the anticaking agent is applied to a divided cheese, it has low visibility on the divided cheese, prevents caking of the divided cheese, and browns similarly to divided cheese without the anticaking agent when baked in an impinger oven at between 425° F. and 450° F. for 5 minutes. Also disclosed are food products containing an anticaking agent described herein, and methods for treating divided cheese for anticaking using an anticaking agent described herein.

Abstract: Disclosed herein is an anticaking agent for cheese, comprising one or more dairy ingredients; and one or more non-dairy ingredients; wherein the anticaking agent can be applied to divided cheese to prevent caking. Also disclosed are food products containing an anticaking agent described herein, and methods for treating divided cheese for anticaking using an anticaking agent described herein.