Patents by Inventor Ashutosh Y. Shukla
Ashutosh Y. Shukla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11070655Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.Type: GrantFiled: January 13, 2020Date of Patent: July 20, 2021Assignee: APPLE INC.Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
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Patent number: 11063338Abstract: An antenna system comprises a combination of a loop antenna and a non-loop antenna. The loop antenna and the non-loop antenna is connected in common to a transceiver mechanism or signal feed mechanism. The non-loop antenna is in some embodiments provided by a dipole conductor. An eyewear device incorporates the antenna system, a loop conductor and a dipole conductor of the antenna system being integrated in a body of the eyewear device. The loop conductor may be provided by a lens ring that extends around a lens held by the body. The lens ring may serve both as loop conductor and as a lens retention mechanism.Type: GrantFiled: January 24, 2019Date of Patent: July 13, 2021Assignee: Snap Inc.Inventors: Mathias Andreas Hintermann, Pat Kusbel, Douglas Wayne Moskowitz, Ugur Olgun, Russell Douglas Patton, Patrick Timothy McSweeney Simons, John Bernard Ardisana, II, Teodor Dabov, Ashutosh Y. Shukla
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Patent number: 10928658Abstract: Apparatuses and systems are disclosed and can include a case for eyewear having an eyewear body carrying onboard electronic components that comprise a heat source that generates heat during electrically powered operation is disclosed. The case can hold the eyewear when the eyewear are in a stowed position. The case can further include one or more supports to support the eyewear in the stowed position within the holding space. One or more heat sinks are integrated with the one or more supports. Each of the one or more heat sinks are thermally conductive coupled with a corresponding heat sink of the eyewear. A first heat conduction pathway is thermally connected to the one or more heat sinks and can extend into the case body to conduct heat from the heat source into the case with the eyewear supported in the stowed position.Type: GrantFiled: July 17, 2018Date of Patent: February 23, 2021Assignee: Snap Inc.Inventors: Andrea Ashwood, Ashutosh Y. Shukla, Stephen Andrew Steger
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Patent number: 10877293Abstract: An eyewear device has a lens retention mechanism that establishes electrical contact between onboard electronics and a lens ring by a resiliently compressible electrical contact member, such as a spring washer, located within a housing defined by a body of the eyewear device. The retention mechanism can further include a lock screw that is selectively engageable with the lens ring to allow disposal between retention and release of a lens by the lens ring, the lock ring being captured in the housing such as to resist removal of the lock screw from the housing when the lens ring is released for lens removal.Type: GrantFiled: January 24, 2019Date of Patent: December 29, 2020Assignee: Snap Inc.Inventors: John Bernard Ardisana, II, Teodor Dabov, Mathias Andreas Hintermann, Douglas Wayne Moskowitz, Ashutosh Y. Shukla
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Patent number: 10695852Abstract: An assembly of mechanical components includes a solder joint between two metal components. A mounted component is retained on one side of a support structure by a solder joint on the other side of the support structure between a retainer and a connector that is fast with the mounted component and extends through the support structure. The retainer is of sheet metal construction, so that a height of the solder joint is no more than the thickness of the retainer, thus providing a low-profile joint.Type: GrantFiled: December 26, 2019Date of Patent: June 30, 2020Assignee: Snap Inc.Inventors: Teodor Dabov, John Bernard Ardisana, II, Ashutosh Y. Shukla
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Publication number: 20200204787Abstract: Three-dimensional image calibration and presentation for eyewear including a pair of image capture devices is described. Calibration and presentation includes obtaining a calibration offset to accommodate flexure in the support structure for the eyewear, adjusting a three dimensional rendering offset by the obtained calibration offset, and presenting the stereoscopic images using the three dimension rendering offset.Type: ApplicationFiled: November 19, 2019Publication date: June 25, 2020Inventors: JOHN BERNARD ARDISANA, II, DAVID BEN EZRA, NIR DAUBE, MATHIAS HINTERMANN, SAGI KATZ, NATI KLIGLER, MICHAEL RYNER, ASHUTOSH Y. SHUKLA
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Publication number: 20200147708Abstract: An assembly of mechanical components includes a solder joint between two metal components. A mounted component is retained on one side of a support structure by a solder joint on the other side of the support structure between a retainer and a connector that is fast with the mounted component and extends through the support structure. The retainer is of sheet metal construction, so that a height of the solder joint is no more than the thickness of the retainer, thus providing a low-profile joint.Type: ApplicationFiled: December 26, 2019Publication date: May 14, 2020Inventors: Teodor Dabov, John Bernard Ardisana, II, Ashutosh Y. Shukla
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Publication number: 20200153950Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.Type: ApplicationFiled: January 13, 2020Publication date: May 14, 2020Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
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Patent number: 10547717Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.Type: GrantFiled: January 7, 2019Date of Patent: January 28, 2020Assignee: APPLE INC.Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
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Patent number: 10543547Abstract: An assembly of mechanical components includes a solder joint between two metal components. A mounted component is retained on one side of a support structure by a solder joint on the other side of the support structure between a retainer and a connector that is fast with the mounted component and extends through the support structure. The retainer is of sheet metal construction, so that a height of the solder joint is no more than the thickness of the retainer, thus providing a low-profile joint. The assembly may be in the form of a movable push button for control of an electronic device.Type: GrantFiled: March 5, 2019Date of Patent: January 28, 2020Assignee: Snap Inc.Inventors: Teodor Dabov, John Bernard Ardisana, II, Ashutosh Y. Shukla
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Publication number: 20190229395Abstract: An antenna system comprises a combination of a loop antenna and a non-loop antenna. The loop antenna and the non-loop antenna is connected in common to a transceiver mechanism or signal feed mechanism. The non-loop antenna is in some embodiments provided by a dipole conductor. An eyewear device incorporates the antenna system, a loop conductor and a dipole conductor of the antenna system being integrated in a body of the eyewear device. The loop conductor may be provided by a lens ring that extends around a lens held by the body. The lens ring may serve both as loop conductor and as a lens retention mechanism.Type: ApplicationFiled: January 24, 2019Publication date: July 25, 2019Inventors: Mathias Andreas Hintermann, Pat Kusbel, Douglas Wayne Moskowitz, Ugur Olgun, Russell Douglas Patton, Patrick Timothy McSweeney Simons, John Bernard Ardisana, II, Teodor Dabov, Ashutosh Y. Shukla
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Publication number: 20190193179Abstract: An assembly of mechanical components includes a solder joint between two metal components. A mounted component is retained on one side of a support structure by a solder joint on the other side of the support structure between a retainer and a connector that is fast with the mounted component and extends through the support structure. The retainer is of sheet metal construction, so that a height of the solder joint is no more than the thickness of the retainer, thus providing a low-profile joint.Type: ApplicationFiled: March 5, 2019Publication date: June 27, 2019Inventors: Teodor Dabov, John Bernard Ardisana, II, Ashutosh Y. Shukla
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Patent number: 10300545Abstract: An assembly of mechanical components includes a solder joint between two metal components. A mounted component is retained on one side of a support structure by a solder joint on the other side of the support structure between a retainer and a connector that is fast with the mounted component and extends through the support structure. The retainer is of sheet metal construction, so that a height of the solder joint is no more than the thickness of the retainer, thus providing a low-profile joint. The assembly may be in the form of a movable push button for control of an electronic device.Type: GrantFiled: October 12, 2017Date of Patent: May 28, 2019Assignee: Snap Inc.Inventors: Teodor Dabov, John Bernard Ardisana, II, Ashutosh Y. Shukla
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Publication number: 20190141171Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.Type: ApplicationFiled: January 7, 2019Publication date: May 9, 2019Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
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Patent number: 10271127Abstract: This disclosure describes a speaker assembly suitable for use in a portable electronic device utilizing water resistant ports. The speaker assembly can have an open back that subjects a back volume of the speaker to pressure differentials within a device housing of the portable electronic device. The speaker assembly can utilize a speaker surround having a varying thickness. The varying thickness speaker surround allows the speaker to maintain an acceptable frequency response profile while limiting the travel of the diaphragm it is coupled with. The disclosure also describes how electrically conductive pathways can be integrated within a housing of the speaker assembly.Type: GrantFiled: July 12, 2017Date of Patent: April 23, 2019Assignee: Apple Inc.Inventors: David A. Hurrell, Tyler B. Cater, Scott P. Porter, Salome Bavetta, Anthony P. Grazian, Benjamin J. Pope, Scott A. Myers, Ashutosh Y. Shukla, Benjamin M. Russo, Christopher Wilk, David MacNeil, Eric N. Nyland, Ihtesham H. Chowdhury, Joseph F. Maldonado, Kevin M. Froese, Richard Hung Minh Dinh, Ruchir M. Dave, Teemu P. Sipila, Yang Liu
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Publication number: 20190111508Abstract: An assembly of mechanical components includes a solder joint between two metal components. A mounted component is retained on one side of a support structure by a solder joint on the other side of the support structure between a retainer and a connector that is fast with the mounted component and extends through the support structure. The retainer is of sheet metal construction, so that a height of the solder joint is no more than the thickness of the retainer, thus providing a low-profile joint. The assembly may be in the form of a movable push button for control of an electronic device.Type: ApplicationFiled: October 12, 2017Publication date: April 18, 2019Inventors: Teodor Dabov, John Bernard Ardisana, II, Ashutosh Y. Shukla
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Patent number: 10218827Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.Type: GrantFiled: March 3, 2017Date of Patent: February 26, 2019Assignee: APPLE INC.Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
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Publication number: 20190020943Abstract: This disclosure describes a speaker assembly suitable for use in a portable electronic device utilizing water resistant ports. The speaker assembly can have an open back that subjects a back volume of the speaker to pressure differentials within a device housing of the portable electronic device. The speaker assembly can utilize a speaker surround having a varying thickness. The varying thickness speaker surround allows the speaker to maintain an acceptable frequency response profile while limiting the travel of the diaphragm it is coupled with. The disclosure also describes how electrically conductive pathways can be integrated within a housing of the speaker assembly.Type: ApplicationFiled: July 12, 2017Publication date: January 17, 2019Applicant: Apple Inc.Inventors: David A. Hurrell, Tyler B. Cater, Scott P. Porter, Salome Bavetta, Anthony P. Grazian, Benjamin J. Pope, Scott A. Myers, Ashutosh Y. Shukla, Benjamin M. Russo, Christopher Wilk, David MacNeil, Eric N. Nyland, Ihtesham H. Chowdhury, Joseph F. Maldonado, Kevin M. Froese, Richard Hung Minh Dinh, Ruchir M. Dave, Teemu P. Sipila, Yang Liu
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Patent number: D854000Type: GrantFiled: September 2, 2016Date of Patent: July 16, 2019Assignee: Apple Inc.Inventors: Jody Akana, Bartley K. Andre, Jeremy Bataillou, Sawyer Isaac Cohen, Daniel J. Coster, Daniele De Iuliis, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Duncan Robert Kerr, Shin Nishibori, David A. Pakula, Matthew Dean Rohrbach, Peter Russell-Clarke, Ashutosh Y. Shukla, Christopher J. Stringer, Eugene Antony Whang, Michael Benjamin Wittenberg, Rico Zörkendörfer
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Patent number: D903643Type: GrantFiled: September 8, 2014Date of Patent: December 1, 2020Assignee: Apple Inc.Inventors: Jody Akana, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Jeremy Bataillou, Daniel J. Coster, Daniele De Iuliis, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Duncan Robert Kerr, Scott A. Myers, David A. Pakula, Rasamy Phouthavong, Matthew Dean Rohrbach, Peter Russell-Clarke, Benjamin Andrew Shaffer, Ashutosh Y. Shukla, Mikael Silvanto, Christopher J. Stringer, Eugene Antony Whang, Rico Zörkendörfer