Patents by Inventor Ashwin CHOCKALINGAM

Ashwin CHOCKALINGAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11072050
    Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: July 27, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Boyi Fu, Sivapackia Ganapathiappan, Daniel Redfield, Rajeev Bajaj, Ashwin Chockalingam, Dominic J. Benvegnu, Mario Dagio Cornejo, Mayu Yamamura, Nag B. Patibandla, Ankit Vora
  • Publication number: 20210205951
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Application
    Filed: March 22, 2021
    Publication date: July 8, 2021
    Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
  • Publication number: 20210107116
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Application
    Filed: December 8, 2020
    Publication date: April 15, 2021
    Inventors: Rajeev BAJAJ, Daniel REDFIELD, Mahendra C. ORILALL, Boyi FU, Aniruddh Jagdish KHANNA, Jason G. FUNG, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Veera Raghava Reddy KAKIREDDY, Gregory E. MENK, Nag B. PATIBANDLA
  • Patent number: 10953515
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: March 23, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
  • Patent number: 10875145
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: December 29, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
  • Patent number: 10875153
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: December 29, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Ashwin Chockalingam
  • Patent number: 10821573
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: November 3, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
  • Publication number: 20200325353
    Abstract: Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.
    Type: Application
    Filed: October 30, 2019
    Publication date: October 15, 2020
    Inventors: Uma SRIDHAR, Sivapackia GANAPATHIAPPAN, Ashwin CHOCKALINGAM, Yingdong LUO, Daniel REDFIELD, Rajeev BAJAJ, Nag B. PATIBANDLA, Hou T. NG, Sudhakar MADHUSOODHANAN
  • Patent number: 10773509
    Abstract: A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: September 15, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Hou T. Ng, Nag B. Patibandla, Rajeev Bajaj, Daniel Redfield, Ashwin Chockalingam, Mayu Yamamura, Mario Cornejo
  • Publication number: 20200230781
    Abstract: Embodiments of the present disclosure generally relate to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process in the manufacture of semiconductor devices. The polishing pads described herein feature a continuous polymer phase of polishing pad material comprising one or more first material domains and a plurality of second material domains. The one or more first material domains are formed of a polymerized reaction product of a first pre-polymer composition, the plurality of second material domains are formed of a polymerized reaction product of a second pre-polymer composition, the second pre-polymer composition is different from the first pre-polymer composition, and interfacial regions between the one or more first material domains and the plurality of second material are formed of a co-polymerized reaction product of the first pre-polymer composition and the second pre-polymer composition.
    Type: Application
    Filed: March 4, 2019
    Publication date: July 23, 2020
    Inventors: Ashwin CHOCKALINGAM, Jason G. FUNG, Sivapackia GANAPATHIAPPAN, Rajeev BAJAJ, Daniel REDFIELD
  • Patent number: 10618141
    Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: April 14, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Ashwin Chockalingam, Mahendra C. Orilall, Mayu Yamamura, Boyi Fu, Rajeev Bajaj, Daniel Redfield
  • Publication number: 20200001433
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Application
    Filed: August 15, 2019
    Publication date: January 2, 2020
    Inventors: Rajeev BAJAJ, Daniel REDFIELD, Mahendra C. ORILALL, Boyi FU, Ashwin CHOCKALINGAM, Ashavani KUMAR, Fred C. REDEKER, Nag B. PATIBANDLA
  • Publication number: 20190337117
    Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.
    Type: Application
    Filed: April 4, 2019
    Publication date: November 7, 2019
    Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Ankit VORA, Daniel REDFIELD, Rajeev BAJAJ, Nag B. PATIBANDLA, Hou T. NG, Sudhakar MADHUSOODHANAN
  • Patent number: 10456886
    Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: October 29, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sivapackia Ganapathiappan, Nag B. Patibandla, Rajeev Bajaj, Daniel Redfield, Fred C. Redeker, Mahendra C. Orilall, Boyi Fu, Mayu Yamamura, Ashwin Chockalingam
  • Patent number: 10399201
    Abstract: Embodiments herein relate to advanced polishing pads with tunable chemical, material and structural properties, and manufacturing methods related thereto. According to one or more embodiments herein, a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments herein thus may provide an advanced polishing pad having discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: September 3, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
  • Patent number: 10391605
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: August 27, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
  • Patent number: 10384330
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: August 20, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
  • Publication number: 20190224809
    Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
    Type: Application
    Filed: April 2, 2019
    Publication date: July 25, 2019
    Inventors: Sivapackia GANAPATHIAPPAN, Nag B. PATIBANDLA, Rajeev BAJAJ, Daniel REDFIELD, Fred C. REDEKER, Mahendra C. ORILALL, Boyi FU, Mayu YAMAMURA, Ashwin CHOCKALINGAM
  • Publication number: 20190202024
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Application
    Filed: March 11, 2019
    Publication date: July 4, 2019
    Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
  • Publication number: 20190047112
    Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.
    Type: Application
    Filed: July 31, 2018
    Publication date: February 14, 2019
    Inventors: Boyi FU, Sivapackia GANAPATHIAPPAN, Daniel REDFIELD, Rajeev BAJAJ, Ashwin CHOCKALINGAM, Dominic J. BENVEGNU, Mario Dagio CORNEJO, Mayu YAMAMURA, Nag B. PATIBANDLA, Ankit VORA