Abstract: An electrostatic chuck and method for clamping and de-clamping a workpiece is provided. The ESC comprises a clamping plate having a clamping surface, and one or more electrodes. An electric potential applied to the one or more electrodes selectively clamps the workpiece to the clamping surface. An arc pin operably coupled to the clamping plate and a power source provides an arc for penetrating an insulating layer of the workpiece. The arc pin is selectively connected to an electrical ground, wherein upon removal of the insulative layer of the workpiece, the arc pin provides an electrical ground connection to the workpiece.

Abstract: An electrostatic chuck and method for clamping a workpiece is provided. The ESC comprises a clamping plate having a clamping surface, and one or more electrodes. An electric potential applied to the one or more electrodes selectively clamps the workpiece to the clamping surface. A punch is operably coupled to the clamping plate and an electrical ground, wherein the punch comprises a trigger mechanism and a punch tip. The punch tip translates between extended and retracted positions, wherein a point of the punch tip is proud of the clamping surface when the punch tip is in the extended position. The punch tip is configured to translate toward the clamping surface upon clamping the workpiece to the clamping plate. Upon reaching the retracted position, the trigger mechanism imparts an impact force to the punch tip, forcing the punch tip into the workpiece and providing an electrical ground connection to the workpiece.

Abstract: A method for clamping a workpiece involves placing the workpiece on a clamping surface of an electrostatic clamp. A clamping voltage is applied to the electrostatic clamp at a first frequency, therein providing a first clamping force between the workpiece and the electrostatic clamp. The application of clamping voltage at the first frequency is halted and another clamping voltage at a second frequency is applied to the electrostatic clamp, therein providing a second clamping force between the workpiece and the electrostatic clamp. The second frequency is greater than the first frequency, wherein the second clamping force is less than the first clamping force. The application of the clamping voltage at the second frequency is then halted, and the workpiece is removed from the electrostatic clamp. The clamping voltage can be controlled based on a set of performance criteria, such as a desired minimum clamping force and a maximum de-clamp time.

Abstract: An electrostatic clamp (ESC), system, and method for clamping a workpiece is provided. A clamping plate of the ESC has central disk and an annulus encircling the central disk, wherein the central disk is recessed from the annulus by a gap distance, therein defining a volume. Backside gas delivery apertures are positioned proximate to an interface between the annulus and the central disk. A first voltage to a first electrode of the annulus clamps a peripheral region of the workpiece to a first layer. A second voltage to a second electrode of the central disk generally compensates for a pressure of a backside gas within the volume. The ESC can be formed of J-R- or Coulombic-type materials. A cooling plate associated with the clamping plate further provides cooling by one or more cooling channels configured to route a cooling fluid therethrough.

Abstract: A method for clamping a workpiece is provided, wherein a workpiece is placed on a surface of a clamping plate of a multi-polar electrostatic clamp having a plurality of electrodes. A plurality of phases of the AC clamping voltage are applied to the plurality of electrodes, wherein at least one of the plurality of phases of the AC clamping voltage applied to at least one of the plurality of electrodes is shifted with respect to the remaining plurality of phases by an offset phase shift. A fluctuation in clamping force between the clamping plate and the workpiece during a cycle of the at least one of the plurality of phases of AC clamping voltage is determined, and the offset phase shift is controlled, based, at least in part, on the determined fluctuation in clamping force, an RC time constant of the clamping system, and a set of performance criteria.

Abstract: The present invention is directed to a system and a method for peeling a wafer off of an electrostatic clamp (ESC). The ESC removal system comprises a electrostatic clamp and a wafer electrically coupled and physically in contact with each other. A plurality of grippers or pins are arranged with respect to the wafer and the ESC to allow the wafer to be peeled off or removed section by section from the electrostatic clamp. The system and method allow the wafer to be removed with a much lower pull force than current systems and methods.