Patents by Inventor Asif Imran Emon

Asif Imran Emon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POWER CONVERSION MODULE
    Publication number: 20230413467
    Abstract: A power conversion module and method of forming the same includes a motherboard having a first surface and a second surface that opposes the first surface. The motherboard includes a first trace that electrically couples a decoupling capacitor mounted on the motherboard to a first pad on the first surface of the motherboard and an output node of a power conversion module. The motherboard includes a via extending through the motherboard that electrically couples a second pad on the first surface of the motherboard and a third pad on the second surface of the motherboard to the output node and a second trace that electrically couples a fourth pad on the second surface of the motherboard and the decoupling capacitor. The power module includes a first daughterboard mounted on the first surface of the motherboard and a second daughterboard mounted on the second surface of the motherboard.
    Type: Application
    Filed: September 1, 2023
    Publication date: December 21, 2023
    Inventors: Woochan Kim, Vivek Kishorechand Arora, David Ryan Huitink, Hayden Seth Carlton, Fang Luo, Asif Imran Emon
  • Power conversion module and method of forming the same
    Patent number: 11751353
    Abstract: A power conversion module and method of forming the same includes a motherboard having a first surface and a second surface that opposes the first surface. The motherboard includes a first trace that electrically couples a decoupling capacitor mounted on the motherboard to a first pad on the first surface of the motherboard and an output node of a power conversion module. The motherboard includes a via extending through the motherboard that electrically couples a second pad on the first surface of the motherboard and a third pad on the second surface of the motherboard to the output node and a second trace that electrically couples a fourth pad on the second surface of the motherboard and the decoupling capacitor. The power module includes a first daughterboard mounted on the first surface of the motherboard and a second daughterboard mounted on the second surface of the motherboard.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: September 5, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Woochan Kim, Vivek Kishorechand Arora, David Ryan Huitink, Hayden Seth Carlton, Fang Luo, Asif Imran Emon
  • POWER CONVERSION MODULE
    Publication number: 20220029519
    Abstract: A power conversion module includes a motherboard having a first surface and a second surface that opposes the first surface. The motherboard includes a first trace that electrically couples a decoupling capacitor mounted on the motherboard to a first pad on the first surface of the motherboard and an output node of a power conversion module. The motherboard includes a via extending through the motherboard that electrically couples a second pad on the first surface of the motherboard and a third pad on the second surface of the motherboard to the output node and a second trace that electrically couples a fourth pad on the second surface of the motherboard and the decoupling capacitor. The power module includes a first daughterboard mounted on the first surface of the motherboard and a second daughterboard mounted on the second surface of the motherboard.
    Type: Application
    Filed: May 12, 2021
    Publication date: January 27, 2022
    Inventors: Woochan Kim, Vivek Kishorechand Arora, David Ryan Huitink, Hayden Seth Carlton, Fang Luo, Asif Imran Emon