Patents by Inventor Asmaa ELKADI

Asmaa ELKADI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dummy fill structures
    Patent number: 11610839
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to dummy fill structures and methods of manufacture. The structure includes: a passive device formed in interlevel dielectric material; and a plurality of metal dummy fill structures composed of at least one main branch and two extending legs from at least one side of the main branch, the at least two extending legs being positioned and structured to suppress eddy currents of the passive device.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: March 21, 2023
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Tung-Hsing Lee, Teng-Yin Lin, Frank W. Mont, Edward J. Gordon, Asmaa Elkadi, Alexander Martin, Won Suk Lee, Anvitha Shampur
  • DUMMY FILL STRUCTURES
    Publication number: 20210125922
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to dummy fill structures and methods of manufacture. The structure includes: a passive device formed in interlevel dielectric material; and a plurality of metal dummy fill structures composed of at least one main branch and two extending legs from at least one side of the main branch, the at least two extending legs being positioned and structured to suppress eddy currents of the passive device.
    Type: Application
    Filed: October 29, 2019
    Publication date: April 29, 2021
    Inventors: Tung-Hsing LEE, Teng-Yin LIN, Frank W. MONT, Edward J. GORDON, Asmaa ELKADI, Alexander MARTIN, Won Suk LEE, Anvitha SHAMPUR