Patents by Inventor Asuka Hosoda

Asuka Hosoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing an electronic component
    Patent number: 7080451
    Abstract: A method of manufacturing an electronic component with a contact having a terminal section for brazing and a contact section includes steps that construct a contact base member of a material that is poorly wettable, forms a primer plating layer of a material that is poorly wettable to the weld brazing material on the base member, forms a finish plating layer of a material that is highly wettable to the weld brazing material on the primer plating layer, and selectively removes a portion of the finish plating layer to obtain an exposed region of the primer plating layer that serves as an arresting region for arresting the weld brazing material from creeping up and migrating along the highly wettable finish plating layer in brazing the terminal section to the brazing pad of a wiring board.
    Type: Grant
    Filed: November 26, 2003
    Date of Patent: July 25, 2006
    Assignee: Japan Aviation Electronics Industry Limited
    Inventors: Kazuhisa Saito, Asuka Hosoda, Hiroshi Akimoto
  • Electronic component and method of manufacturing the same
    Publication number: 20040121659
    Abstract: An electronic component is obtained by forming a primer plating layer of a material which is poorly wettable to a weld brazing material 3 on a base member 11X of a contact 11 having a terminal section 111 for brazing and a contact section 112, and then forming a finish plating layer of a material which is highly wettable to the weld brazing material on the primer plating layer. An exposed region of the poorly wettable primer plating layer is formed thereafter by selectively removing a portion of the finish plating layer at the terminal section 111 and served as an arresting region for arresting the weld brazing material 3 from creeping up and migrating along the highly wettable plating layer in brazing the terminal section 111 to the brazing pad 22 of a wiring board 2.
    Type: Application
    Filed: November 26, 2003
    Publication date: June 24, 2004
    Applicant: Japan Aviation Electronics Industry Limited
    Inventors: Kazuhisa Saito, Asuka Hosoda, Hiroshi Akimoto
  • Electronic component and a method of manufacturing the same
    Patent number: 6712625
    Abstract: An electronic component is obtained by forming a primer plating layer of a material which is poorly wettable to a weld brazing material 3 on a base member 11X of a contact 11 having a terminal section 111 for brazing and a contact section 112, and then forming a finish plating layer of a material which is highly wettable to the weld brazing material on the primer plating layer. An exposed region of the poorly wettable primer plating layer is formed thereafter by selectively removing a portion of the finish plating layer at the terminal section 111 and served as an arresting region for arresting the weld brazing material 3 from creeping up and migrating along the highly wettable plating layer in brazing the terminal section 111 to the brazing pad 22 of a wiring board 2.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: March 30, 2004
    Assignee: Japan Aviation Electronics Industry Limited
    Inventors: Kazuhisa Saito, Asuka Hosoda, Hiroshi Akimoto
  • Electronic component and a method of manufacturing the same
    Publication number: 20020049008
    Abstract: An electronic component is obtained by forming a primer plating layer of a material which is poorly wettable to a weld brazing material 3 on a base member 11X of a contact 11 having a terminal section 111 for brazing and a contact section 112, and then forming a finish plating layer of a material which is highly wettable to the weld brazing material on the primer plating layer. An exposed region of the poorly wettable primer plating layer is formed thereafter by selectively removing a portion of the finish plating layer at the terminal section 111 and served as an arresting region for arresting the weld brazing material 3 from creeping up and migrating along the highly wettable plating layer in brazing the terminal section 111 to the brazing pad 22 of a wiring board 2.
    Type: Application
    Filed: April 27, 2001
    Publication date: April 25, 2002
    Applicant: Japan Aviation Electronics Industry Limited
    Inventors: Kazuhisa Saito, Asuka Hosoda, Hiroshi Akimoto