Patents by Inventor Asuka TACHIKAWA

Asuka TACHIKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240016537
    Abstract: An electrode for a high-frequency medical device in which a coating film is formed on at least a part of a surface of a treatment section of the medical device, wherein the coating film includes a silicone resin, and at least one type of filler having conductivity. Particles of the fillers are fusion-bonded to each other to form a conductive path, and/or a particle of the filler and an electrode substrate disposed on a surface of the treatment section are fusion-bonded to form a conductive path.
    Type: Application
    Filed: September 25, 2023
    Publication date: January 18, 2024
    Applicant: OLYMPUS CORPORATION
    Inventors: Asuka TACHIKAWA, Hiroaki KASAI, Yoshiyuki OGAWA, Issei MAEDA
  • Publication number: 20230355291
    Abstract: This treatment portion of a medical energy device treats a biological tissue by transferring energy to the biological tissue, in a state where the treatment portion is in contact with the biological tissue. The treatment portion of the medical energy device includes a main body portion and a covering film. The main body portion transfers energy to the biological tissue. The covering film contains silicone as a main component, and covers the surface of the main body portion. The silicone includes at least a D unit and a T unit. In the silicone, the molar ratio of silicon atoms forming the D unit with respect to all the silicon atoms is 40-99%. In the silicone, the molar ratio of methyl functional groups bonded to the silicon atoms with respect to all functional groups bonded to the silicon atoms is at least 60%.
    Type: Application
    Filed: July 6, 2023
    Publication date: November 9, 2023
    Applicant: OLYMPUS CORPORATION
    Inventors: Yoshiyuki OGAWA, Hiroaki KASAI, Takuya FUJIHARA, Yu MURANO, Issei MAEDA, Asuka TACHIKAWA