Patents by Inventor Atsumi Takahashi
Atsumi Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11644031Abstract: A vane pump includes: a rotor; vanes freely slidably received in the rotor; a cam ring having a cam face with which the vanes come into sliding contact; a side member having a sliding contact surface with which side surfaces of the rotor and the vanes come into sliding contact; pump chambers; and a discharge port configured to guide working fluid discharged from the pump chambers. The side member has a guide surface that is provided on an end portion side of the opening portion, the guide surface being configured to push the end portions of the vanes upward and guide them toward the sliding contact surface of the side member as the rotor is rotated in the reverse rotation direction.Type: GrantFiled: October 29, 2019Date of Patent: May 9, 2023Assignee: KYB CORPORATIONInventors: Yusuke Ohmori, Tomoyuki Nakagawa, Masamichi Sugihara, Atsumi Takahashi, Satoshi Watanabe
-
Patent number: 11590614Abstract: A flux comprising an organic acid; a solvent; and polyoxyethylene behenyl alcohol having an average number of moles of ethylene oxide added of 7 to 40 mol.Type: GrantFiled: October 21, 2019Date of Patent: February 28, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Ayaka Shirakawa, Hiroshi Sugii, Atsumi Takahashi, Daisuke Maruko, Hiroyoshi Kawasaki, Masato Shiratori
-
Patent number: 11413711Abstract: Provided are a flux, resin flux cored solder and a flux coated pellet which are washable with water. Resin flux cored solder is composed of solder having a linear shape and a flux filled in a substantially central part (core) of the cross section of the solder. The flux contains an amine for salt formation and an organic acid for salt formation, in which the amount of the organic acid is within a range between 10 parts by mass or more and 645 parts by mass or less based on 100 parts by mass of the amine. The organic acid for salt formation is composed of at least one organic acid selected from the group consisting of malonic acid, succinic acid, glutaric acid, tartaric acid, malic acid, diglycolic acid, and citric acid.Type: GrantFiled: November 13, 2018Date of Patent: August 16, 2022Assignee: Senju Metal Industry Co., Ltd.Inventors: Motohiro Onitsuka, Yoko Kurasawa, Hiroyuki Yamasaki, Atsumi Takahashi, Toshihisa Kugi, Hiroyoshi Kawasaki
-
Publication number: 20220010795Abstract: A vane pump includes: a rotor; vanes freely slidably received in the rotor; a cam ring having a cam face with which the vanes come into sliding contact; a side member having a sliding contact surface with which side surfaces of the rotor and the vanes come into sliding contact; pump chambers; and a discharge port configured to guide working fluid discharged from the pump chambers. The side member has a guide surface that is provided on an end portion side of the opening portion, the guide surface being configured to push the end portions of the vanes upward and guide them toward the sliding contact surface of the side member as the rotor is rotated in the reverse rotation direction.Type: ApplicationFiled: October 29, 2019Publication date: January 13, 2022Applicant: KYB CorporationInventors: Yusuke OHMORI, Tomoyuki NAKAGAWA, Masamichi SUGIHARA, Atsumi TAKAHASHI, Satoshi WATANABE
-
Publication number: 20210387292Abstract: A flux comprising an organic acid; a solvent; and polyoxyethylene behenyl alcohol having an average number of moles of ethylene oxide added of 7 to 40 mol.Type: ApplicationFiled: October 21, 2019Publication date: December 16, 2021Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Ayaka Shirakawa, Hiroshi Sugii, Atsumi Takahashi, Daisuke Maruko, Hiroyoshi Kawasaki, Masato Shiratori
-
Publication number: 20200376609Abstract: Provided are a flux, resin flux cored solder and a flux coated pellet which are washable with water. Resin flux cored solder is composed of solder having a linear shape and a flux filled in a substantially central part (core) of the cross section of the solder. The flux contains an amine for salt formation and an organic acid for salt formation, in which the amount of the organic acid is within a range between 10 parts by mass or more and 645 parts by mass or less based on 100 parts by mass of the amine. The organic acid for salt formation is composed of at least one organic acid selected from the group consisting of malonic acid, succinic acid, glutaric acid, tartaric acid, malic acid, diglycolic acid, and citric acid.Type: ApplicationFiled: November 13, 2018Publication date: December 3, 2020Inventors: Motohiro Onitsuka, Yoko Kurasawa, Hiroyuki Yamasaki, Atsumi Takahashi, Toshihisa Kugi, Hiroyoshi Kawasaki
-
Patent number: 10610979Abstract: Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.Type: GrantFiled: May 24, 2018Date of Patent: April 7, 2020Assignee: Senju Metal Industry Co., Ltd.Inventors: Daisuke Maruko, Atsumi Takahashi, Hiroki Sudo, Hiroyoshi Kawasaki, Takahiro Hattori, Takahiro Roppongi, Daisuke Soma, Takashi Hagiwara, Isamu Sato, Yuji Kawamata
-
Patent number: 10583533Abstract: Provided is a flux that is able to suppress any solder bridges even when it is applied to the narrow pitched electrodes such that the bridge occurs when using the past flux. The flux is characterized by containing 15% by mass or more and 35% by mass or less of polyoxyalkylene ethylenediamine, 2% by mass or more and 15% by mass or less of an organic acid, 10% by mass or more and 30% by mass or less of a base material, 3% by mass or more and 30% by mass or less of an amine and 20% by mass or more and 40% by mass or less of a solvent.Type: GrantFiled: February 16, 2017Date of Patent: March 10, 2020Assignee: Senju Metal Industry Co., Ltd.Inventors: Daisuke Maruko, Atsumi Takahashi, Hiroyoshi Kawasaki
-
Publication number: 20190210167Abstract: Provided is a flux that is able to suppress any solder bridges even when it is applied to the narrow pitched electrodes such that the bridge occurs when using the past flux. The flux is characterized by containing 15% by mass or more and 35% by mass or less of polyoxyalkylene ethylenediamine, 2% by mass or more and 15% by mass or less of an organic acid, 10% by mass or more and 30% by mass or less of a base material, 3% by mass or more and 30% by mass or less of an amine and 20% by mass or more and 40% by mass or less of a solvent.Type: ApplicationFiled: February 16, 2017Publication date: July 11, 2019Inventors: Daisuke Maruko, Atsumi Takahashi, Hiroyoshi Kawasaki
-
Patent number: 10160827Abstract: A resin composition having an adhesive property in a high temperature range that is estimated during soldering, and flux using this resin composition, a flux residue of which is washable. The resin composition contains a hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule and a thermosetting resin in a ratio of 1:3 or more and 1:7 or less. Further, the flux contains the hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule in an amount of 8.5% by mass or more and 16% by mass or less, and a thermosetting resin in an amount of 50% by mass or more and 60% by mass or less, wherein a ratio between the hydroxyl carboxylic acid and the thermosetting resin is 1:7 or less.Type: GrantFiled: October 14, 2015Date of Patent: December 25, 2018Assignee: Senju Metal Industry Co., Ltd.Inventors: Daisuke Maruko, Atsumi Takahashi, Takayuki Yoshida
-
Publication number: 20180339375Abstract: Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.Type: ApplicationFiled: May 24, 2018Publication date: November 29, 2018Inventors: Daisuke Maruko, Atsumi Takahashi, Hiroki Sudo, Hiroyoshi Kawasaki, Takahiro Hattori, Takahiro Roppongi, Daisuke Soma, Takashi Hagiwara, Isamu Sato, Yuji Kawamata
-
Publication number: 20170321000Abstract: A resin composition having an adhesive property in a high temperature range that is estimated during soldering, and flux using this resin composition, a flux residue of which is washable. The resin composition contains a hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule and a thermosetting resin in a ratio of 1:3 or more and 1:7 or less. Further, the flux contains the hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its molecule in an amount of 8.5% by mass or more and 16% by mass or less, and a thermosetting resin in an amount of 50% by mass or more and 60% by mass or less, wherein a ratio between the hydroxyl carboxylic acid and the thermosetting resin is 1:7 or less.Type: ApplicationFiled: October 14, 2015Publication date: November 9, 2017Inventors: Daisuke Maruko, Atsumi Takahashi, Takayuki Yoshida
-
Patent number: 6809034Abstract: An Al film is formed on a barrier metal covering a thin film resistor to have a first opening. A photo-resist is formed on the Al film and in the opening, and is patterned to have a second opening having an opening area smaller than that of the first opening and open in the first opening to expose the barrier metal therefrom. Then, the barrier metal is etched through the second opening. Because the barrier metal is etched from an inner portion more than the opening end of the first opening, under-cut of the barrier metal is prevented.Type: GrantFiled: April 24, 2002Date of Patent: October 26, 2004Assignee: Denso CorporationInventors: Ichiro Ito, Satoshi Shiraki, Tomio Yamamoto, Makoto Ohkawa, Atsumi Takahashi, Yasuaki Tsuzuki, Akito Fukui, Toshio Sakakibara, Takayuki Sugisaka
-
Patent number: 6770564Abstract: An Al film is formed on a barrier metal covering a thin film resistor to have a first opening. A photo-resist is formed on the Al film and in the opening, and is patterned to have a second opening having an opening area smaller than that of the first opening and open in the first opening to expose the barrier metal therefrom. Then, the barrier metal is etched through the second opening. Because the barrier metal is etched from an inner portion more than the opening end of the first opening, under-cut of the barrier metal is prevented.Type: GrantFiled: July 28, 1999Date of Patent: August 3, 2004Assignee: Denso CorporationInventors: Ichiro Ito, Satoshi Shiraki, Tomio Yamamoto, Makoto Ohkawa, Atsumi Takahashi, Yasuaki Tsuzuki, Akito Fukui, Toshio Sakakibara, Takayuki Sugisaka
-
Publication number: 20020115299Abstract: An Al film is formed on a barrier metal covering a thin film resistor to have a first opening. A photo-resist is formed on the Al film and in the opening, and is patterned to have a second opening having an opening area smaller than that of the first opening and open in the first opening to expose the barrier metal therefrom. Then, the barrier metal is etched through the second opening. Because the barrier metal is etched from an inner portion more than the opening end of the first opening, under-cut of the barrier metal is prevented.Type: ApplicationFiled: April 24, 2002Publication date: August 22, 2002Inventors: Ichiro Ito, Satoshi Shiraki, Tomio Yamamoto, Makoto Ohkawa, Atsumi Takahashi, Yasuaki Tsuzuki, Akito Fukui, Toshio Sakakibara, Takayuki Sugisaka