Patents by Inventor Atsumi Yamabe
Atsumi Yamabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11642877Abstract: To provide a glass resin laminate of the present invention, in which the glass substrate and the resin layer containing a TFE polymer are strongly laminated, is hardly warped and is excellent in the electrical properties, a composite laminate further having a metal foil, and methods for producing them. A glass resin laminate comprising a glass substrate 10 having an uneven surface 12 with an arithmetic mean roughness of at least 5 nm, and a resin layer containing a tetrafluoroethylene polymer in contact with the uneven surface 12, wherein the uneven surface 12 has specific convex portions 21 and 22 which narrow at at least a part of the root portion as compared with the tip portion.Type: GrantFiled: October 15, 2020Date of Patent: May 9, 2023Assignee: AGC Inc.Inventors: Atsumi Yamabe, Kohei Yasuda, Nobuaki Ikawa
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Patent number: 11632859Abstract: Provided is a long laminate for a printed wiring board, which has reduced thickness of a resin layer and increased signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer. The long laminate contains a metal layer of a long metal foil, a fluororesin layer containing a fluororesin and contacting the metal layer, and a heat-resistant resin layer containing a heat-resistant resin and contacting the fluororesin layer. Each fluororesin layer is 1 to 10 ?m thick. The ratio of the total thickness of the fluororesin layer to the total thickness of the heat-resistant resin layer is 0.3 to 3.0. The sum of the total thickness of the fluororesin layer and the total thickness of the heat-resistant resin layer is at most 50 ?m. Also provided are a method for producing the long laminate, and the printed wiring board.Type: GrantFiled: June 25, 2020Date of Patent: April 18, 2023Assignee: AGC Inc.Inventors: Wataru Kasai, Tomoya Hosoda, Atsumi Yamabe
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Patent number: 11370200Abstract: The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of a second surface 10b thereof is measured by an atomic force microscope.Type: GrantFiled: October 23, 2019Date of Patent: June 28, 2022Assignee: AGC Inc.Inventors: Tomoya Hosoda, Tatsuya Terada, Atsumi Yamabe, Nobutaka Kidera, Wataru Kasai
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Patent number: 11174411Abstract: To provide a liquid composition whereby a resin powder can be uniformly dispersed in a resin or the like without being scattered, and a method for producing a film, a laminate or the like by using the liquid composition. The liquid composition comprises a liquid medium and a resin powder dispersed in the liquid medium, and characterized in that the average particle size of the resin powder is from 0.3 to 6 ?m, the volume-based cumulative 90% diameter of the resin powder is at most 8 ?m, and the resin powder is a resin containing a fluorinated copolymer having a specific functional group. And, the method is a method for producing a film, a laminate or the like by using the liquid composition.Type: GrantFiled: January 16, 2019Date of Patent: November 16, 2021Assignee: AGC Inc.Inventors: Tomoya Hosoda, Tatsuya Terada, Shigeki Kobayashi, Atsumi Yamabe
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Publication number: 20210023820Abstract: To provide a glass resin laminate of the present invention, in which the glass substrate and the resin layer containing a TFE polymer are strongly laminated, is hardly warped and is excellent in the electrical properties, a composite laminate further having a metal foil, and methods for producing them. A glass resin laminate comprising a glass substrate 10 having an uneven surface 12 with an arithmetic mean roughness of at least 5 nm, and a resin layer containing a tetrafluoroethylene polymer in contact with the uneven surface 12, wherein the uneven surface 12 has specific convex portions 21 and 22 which narrow at at least a part of the root portion as compared with the tip portion.Type: ApplicationFiled: October 15, 2020Publication date: January 28, 2021Applicant: AGC Inc.Inventors: Atsumi YAMABE, Kohei YASUDA, Nobuaki IKAWA
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Publication number: 20210024702Abstract: To provide a dispersion, a laminate, a film and an impregnated woven fabric. A powder dispersion comprising powder I of polymer I having units based on tetrafluoroethylene and an oxygen-containing polar group, powder II of polymer II containing units based on a fluoroolefin, a dispersing agent, and a liquid dispersion medium, wherein the ratio of the mass content of the polymer I to the mass content of the polymer II is at most 0.7, or such a power dispersion wherein the dispersing agent is a fluorinated surfactant having a hydroxy group. A laminate, a film, and an impregnated woven fabric produced by using such a powder dispersion.Type: ApplicationFiled: October 9, 2020Publication date: January 28, 2021Applicant: AGC Inc.Inventors: Atsumi YAMABE, Tomoya HOSODA, Wataru KASAI
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Publication number: 20200329558Abstract: To provide a long laminate capable of obtaining a printed wiring board which is capable of satisfying both reduction in the thickness of a resin layer and increase in the signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer; a method for producing a long laminate which has a thin fluororesin layer which has no wrinkles; and a printed wiring board. A long laminate 10 comprising a metal layer 12 made of a long metal foil, a fluororesin layer 14 containing a fluororesin, in contact with the metal layer 12, and a heat-resistant resin layer 16 containing a heat-resistant resin, in contact with the fluororesin layer 14, wherein the thickness per one fluororesin layer 14 is from 1 to 10 ?m, the ratio (T1/T2) of the total thickness T1 of the fluororesin layer 14 to the total thickness T2 of the heat-resistant resin layer 16, is from 0.3 to 3.Type: ApplicationFiled: June 25, 2020Publication date: October 15, 2020Applicant: AGO Inc.Inventors: Wataru Kasai, Tomoya Hosoda, Atsumi Yamabe
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Publication number: 20200317948Abstract: To provide a dispersion excellent in miscibility with varnish, coating properties, dispersibility and dispersion stability; and methods for producing a metal laminate and a printed board. A dispersion comprises an organic solvent and a powder so that the powder is dispersed in the organic solvent, wherein the powder is a powder containing a tetrafluoroethylene type polymer having a melt viscosity at 380° C. of from 1×102 to 1×106 Pa·s; the viscosity is from 50 to 10,000 mPa·s; and the thixotropy ratio calculated by dividing the viscosity measured under the condition of rotational speed of 30 rpm by the viscosity measured under the condition of rotational speed of 60 rpm, is from 1.0 to 2.2.Type: ApplicationFiled: June 18, 2020Publication date: October 8, 2020Applicant: AGC Inc.Inventors: Tatsuya Terada, Tomoya Hosoda, Atsumi Yamabe
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Publication number: 20200048420Abstract: The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of a second surface 10b thereof is measured by an atomic force microscope.Type: ApplicationFiled: October 23, 2019Publication date: February 13, 2020Applicant: AGC Inc.Inventors: Tomoya HOSODA, Tatsuya TERADA, Atsumi YAMABE, Nobutaka KIDERA, Wataru KASAI
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Patent number: 10323134Abstract: A particulate polyamide is provided. The particulate polyamide is porous and includes at least one of polyamide 4 and polyamide 3. In addition, the particulate polyamide has a particle diameter (d50) of from 10 ?m to 1,000 ?m and a particle diameter dispersion degree (Dv/Dn) of not greater than 3.0, wherein Dv represents the volume average particle diameter of the particulate polyamide, and Dn represents the number average particle diameter of the particulate polyamide.Type: GrantFiled: September 17, 2018Date of Patent: June 18, 2019Assignee: Ricoh Company, Ltd.Inventors: Yoko Arai, Atsumi Yamabe, Koichiro Oyama, Yasuo Kamada
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Publication number: 20190144700Abstract: To provide a liquid composition whereby a resin powder can be uniformly dispersed in a resin or the like without being scattered, and a method for producing a film, a laminate or the like by using the liquid composition. The liquid composition comprises a liquid medium and a resin powder dispersed in the liquid medium, and characterized in that the average particle size of the resin powder is from 0.3 to 6 ?m, the volume-based cumulative 90% diameter of the resin powder is at most 8 ?m, and the resin powder is a resin containing a fluorinated copolymer having a specific functional group. And, the method is a method for producing a film, a laminate or the like by using the liquid composition.Type: ApplicationFiled: January 16, 2019Publication date: May 16, 2019Applicant: AGC Inc.Inventors: Tomoya HOSODA, Tatsuya Terada, Shigeki Kobayashi, Atsumi Yamabe
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Patent number: 10272238Abstract: An electrode sheet attachable to living tissues is provided. The electrode sheet includes a hydrogel, a non-metallic conductive filler dispersed in the hydrogel, and a pharmaceutical or cosmetic transdermal component dispersed in the hydrogel.Type: GrantFiled: July 21, 2017Date of Patent: April 30, 2019Assignee: Ricoh Company, Ltd.Inventor: Atsumi Yamabe
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Publication number: 20190016867Abstract: A particulate polyamide is provided. The particulate polyamide is porous and includes at least one of polyamide 4 and polyamide 3. In addition, the particulate polyamide has a particle diameter (d50) of from 10 ?m to 1,000 ?m and a particle diameter dispersion degree (Dv/Dn) of not greater than 3.0, wherein Dv represents the volume average particle diameter of the particulate polyamide, and Dn represents the number average particle diameter of the particulate polyamide.Type: ApplicationFiled: September 17, 2018Publication date: January 17, 2019Applicant: RICOH COMPANY, LTD.Inventors: Yoko ARAI, Atsumi YAMABE, Koichiro OYAMA, Yasuo KAMADA
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Patent number: 10138344Abstract: A particulate polyamide is provided. The particulate polyamide is porous and includes at least one of polyamide 4 and polyamide 3. In addition, the particulate polyamide has a particle diameter (d50) of from 10 ?m to 1,000 ?m and a particle diameter dispersion degree (Dv/Dn) of not greater than 3.0, wherein Dv represents the volume average particle diameter of the particulate polyamide, and Dn represents the number average particle diameter of the particulate polyamide.Type: GrantFiled: March 18, 2016Date of Patent: November 27, 2018Assignee: RICOH COMPANY, LTD.Inventors: Yoko Arai, Atsumi Yamabe, Koichiro Oyama, Yasuo Kamada
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Publication number: 20180326195Abstract: According to an embodiment, a microneedle array includes a plurality of hollow needles and a plurality of individual liquid chambers. The plurality of individual liquid chambers is configured to be in communication with the hollow needles. Each of the hollow needles is configured to hold a liquid composition to be ejected from tip end holes of the hollow needles. Each of the hollow needles has a length of 1 to 100 ?m. The individual liquid chambers being provided corresponding to the hollow needles.Type: ApplicationFiled: July 26, 2018Publication date: November 15, 2018Inventors: Atsumi YAMABE, Toshihiro KANEMATSU
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Publication number: 20180147155Abstract: A transdermal device is provided. The transdermal device includes a transdermal patch, a sheet-shaped electrode stacked overlying one surface of the transdermal patch, and a power source connected to the sheet-shaped electrode. The transdermal patch includes a carrier layer. The carrier layer comprises a hollow structure and an external composition. The hollow structure comprises a plurality of cells partitioned by an insulator and has hollow portions penetrating through one plane surface to the other plane surface of the hollow structure. The external composition comprises a dispersion liquid comprising a nanoparticle containing an active ingredient.Type: ApplicationFiled: November 16, 2017Publication date: May 31, 2018Inventors: Atsumi YAMABE, Toshihiro KANEMATSU
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Publication number: 20180043150Abstract: An electrode sheet attachable to living tissues is provided. The electrode sheet includes a hydrogel, a non-metallic conductive filler dispersed in the hydrogel, and a pharmaceutical or cosmetic transdermal component dispersed in the hydrogel.Type: ApplicationFiled: July 21, 2017Publication date: February 15, 2018Inventor: Atsumi YAMABE
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Publication number: 20160272776Abstract: A particulate polyamide is provided. The particulate polyamide is porous and includes at least one of polyamide 4 and polyamide 3. In addition, the particulate polyamide has a particle diameter (d50) of from 10 ?m to 1,000 ?m and a particle diameter dispersion degree (Dv/Dn) of not greater than 3.0, wherein Dv represents the volume average particle diameter of the particulate polyamide, and Dn represents the number average particle diameter of the particulate polyamide.Type: ApplicationFiled: March 18, 2016Publication date: September 22, 2016Applicant: RICOH COMPANY, LTD.Inventors: Yoko ARAI, Atsumi YAMABE, Koichiro OYAMA, Yasuo KAMADA
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Publication number: 20160068671Abstract: A water-decomposable resin composition is provided. The water-decomposable resin composition includes a polyvinyl alcohol resin and a water absorptive resin. The polyvinyl alcohol resin has a melting point and a temperature at which a weight thereof decreases by 10% due to heat, and the difference between the melting point and the temperature is 100° C. or more.Type: ApplicationFiled: August 31, 2015Publication date: March 10, 2016Applicant: RICOH COMPANY, LTD.Inventors: Atsumi Yamabe, Koji Iwasaki, Shinji Ohtani, Nozomu Tamoto