Patents by Inventor Atsunari Yamashita
Atsunari Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8730647Abstract: A printed wiring board includes a capacitor including a dielectric body having a first surface and a second surface, a first electrode provided on the first surface of the dielectric body, and a second electrode provided on the second surface of the dielectric body. The first electrode has an area facing and being smaller than the first surface of the dielectric body, and the second electrode has an area facing and being larger than the second surface of the dielectric body.Type: GrantFiled: September 3, 2008Date of Patent: May 20, 2014Assignee: Ibiden Co., Ltd.Inventors: Yasuhiko Mano, Atsunari Yamashita, Yoshitake Tsuchiya, Takashi Kariya
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Patent number: 8613136Abstract: A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.Type: GrantFiled: November 9, 2009Date of Patent: December 24, 2013Assignee: Ibiden Co., Ltd.Inventors: Hironori Tanaka, Kazuhiro Yoshikawa, Naoaki Fujii, Atsunari Yamashita
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Patent number: 8415791Abstract: A semiconductor device includes a support plate having a hole formed therein and a conductor formed on a wall surface of the hole, a semiconductor element; and a conductive post formed by a conductor having a first end portion at one end, and a second end portion at an other end. The second end portion of the conductive post is connected to the semiconductor element, and a side surface of the conductive post is fixed to the conductor on the wall surface of the hole deformed by pressing force of the conductive post on a side closer to the first end portion than the second end portion.Type: GrantFiled: November 23, 2010Date of Patent: April 9, 2013Assignee: Ibiden Co., Ltd.Inventors: Kiyotaka Tsukada, Tetsuya Muraki, Atsunari Yamashita, Yoshitomo Tomida
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Patent number: 8336205Abstract: A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.Type: GrantFiled: August 12, 2011Date of Patent: December 25, 2012Assignee: Ibiden Co., Ltd.Inventors: Hironori Tanaka, Kazuhiro Yoshikawa, Naoaki Fujii, Atsunari Yamashita
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Patent number: 8278753Abstract: The semiconductor device comprises a support plate; a semiconductor element; and conductor posts consisting of a conductor having a first end at one end and a second end at the other end, the second end being connected to the semiconductor element and the conductor posts being connected to the support plate at a position on the side of the second end that is closer to the first end, wherein the conductor posts have a heat conductivity of approximately 200 W/m·K or higher and a Vickers hardness of approximately 70 or lower.Type: GrantFiled: November 23, 2010Date of Patent: October 2, 2012Assignee: Ibiden Co., Ltd.Inventors: Kiyotaka Tsukada, Tetsuya Muraki, Atsunari Yamashita, Yoshitomo Tomida
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Publication number: 20110289773Abstract: A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.Type: ApplicationFiled: August 12, 2011Publication date: December 1, 2011Applicant: IBIDEN CO., LTDInventors: Hironori Tanaka, Kazuhiro Yoshikawa, Naoaki Fujii, Atsunari Yamashita
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Patent number: 8024858Abstract: A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.Type: GrantFiled: January 12, 2009Date of Patent: September 27, 2011Assignee: Ibiden Co., Ltd.Inventors: Hironori Tanaka, Kazuhiro Yoshikawa, Naoaki Fujii, Atsunari Yamashita
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Publication number: 20110121448Abstract: The semiconductor device comprises a support plate; a semiconductor element; and conductor posts consisting of a conductor having a first end at one end and a second end at the other end, the second end being connected to the semiconductor element and the conductor posts being connected to the support plate at a position on the side of the second end that is closer to the first end, wherein the conductor posts have a heat conductivity of approximately 200 W/m·K or higher and a Vickers hardness of approximately 70 or lower.Type: ApplicationFiled: November 23, 2010Publication date: May 26, 2011Applicant: IBIDEN CO., LTD.Inventors: Kiyotaka TSUKADA, Tetsuya Muraki, Atsunari Yamashita, Yoshitomo Tomida
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Publication number: 20110121450Abstract: A semiconductor device includes a support plate having a hole formed therein and a conductor formed on a wall surface of the hole, a semiconductor element; and a conductive post formed by a conductor having a first end portion at one end, and a second end portion at an other end. The second end portion of the conductive post is connected to the semiconductor element, and a side surface of the conductive post is fixed to the conductor on the wall surface of the hole deformed by pressing force of the conductive post on a side closer to the first end portion than the second end portion.Type: ApplicationFiled: November 23, 2010Publication date: May 26, 2011Applicant: IBIDEN CO., LTD.Inventors: Kiyotaka Tsukada, Tetsuya Muraki, Atsunari Yamashita, Yoshitomo Tomida
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Patent number: 7935893Abstract: A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.Type: GrantFiled: January 12, 2009Date of Patent: May 3, 2011Assignee: Ibiden Co., Ltd.Inventors: Hironori Tanaka, Kazuhiro Yoshikawa, Naoaki Fujii, Atsunari Yamashita
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Publication number: 20100043942Abstract: A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.Type: ApplicationFiled: November 9, 2009Publication date: February 25, 2010Applicant: IBIDEN CO., LTD.Inventors: Hironori Tanaka, Kazuhiro Yoshikawa, Naoaki Fujii, Atsunari Yamashita
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Publication number: 20090205202Abstract: A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.Type: ApplicationFiled: January 12, 2009Publication date: August 20, 2009Applicant: IBIDEN CO., LTD.Inventors: Hironori Tanaka, Kazuhiro Yoshikawa, Naoaki Fujii, Atsunari Yamashita
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Publication number: 20090205859Abstract: A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.Type: ApplicationFiled: January 12, 2009Publication date: August 20, 2009Applicant: IBIDEN CO., LTD.Inventors: Hironori Tanaka, Kazuhiro Yoshikawa, Naoaki Fujii, Atsunari Yamashita
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Publication number: 20090200073Abstract: A printed wiring board includes a capacitor including a dielectric body having a first surface and a second surface, a first electrode provided on the first surface of the dielectric body, and a second electrode provided on the second surface of the dielectric body. The first electrode has an area facing and being smaller than the first surface of the dielectric body, and the second electrode has an area facing and being larger than the second surface of the dielectric body.Type: ApplicationFiled: September 3, 2008Publication date: August 13, 2009Applicant: IBIDEN, CO., LTD.Inventors: Yasuhiko Mano, Atsunari Yamashita, Yoshitake Tsuchiya, Takashi Kariya