Abstract: A composition including a binder and a variable thermal conductivity material satisfying a conditional expression 1, wherein a content of the variable thermal conductivity material is from 300 parts by weight to 10,000 parts by weight with respect to a content of 100 parts by weight of the binder: ?max/?25?1.2??[conditional expression 1] (wherein, ?25 represents a thermal conductivity at 25° C., and ?max represents the maximum value of a thermal conductivity at 200° C. or 500° C.).

Abstract: To provide a thermoelectric conversion module member which has a high connecting property between a thermoelectric conversion layer and a diffusion prevention layer and is also excellent in heat resistance. A thermoelectric conversion module member comprising a thermoelectric conversion layer and a diffusion prevention layer in contact with the above-described thermoelectric conversion layer, wherein the above-described thermoelectric conversion layer is a layer containing a thermoelectric conversion material having a silicon element or a tellurium element, the above-described diffusion prevention layer is a layer containing a metal and the same thermoelectric conversion material as that contained in the above-described thermoelectric conversion layer, and the amount of the above-described thermoelectric conversion material in the above-described diffusion prevention layer is 10 to 50 parts by weight with respect to 100 parts by weight of the above-described metal.

Abstract: A coated particle having excellent thermal expansion control and electrical insulation properties includes a core of a first inorganic compound containing a metal or semimetal element P; and a shell of a second inorganic compound containing a metal or semimetal element Q. The first inorganic compound satisfies 1, and the coated particles satisfy 2 and 3. 1: |dA(T)/dT| is ?10 ppm/°C at T1 of -200° C. to 1,200° C. A is (an a-axis lattice constant of a crystal in the first inorganic compound)/(a c-axis lattice constant of a crystal in the first inorganic compound). 2: in XPS of a surface of each of the coated particles, a ratio of a number of atoms of Q contained in the shell to a number of atoms of P contained in the core t is 45 to 300. 3: an average particle diameter of each coated particle is 0.1 to 100 µm.

Abstract: This particle contains at least one titanium compound crystal grain, and satisfies requirements 1 and 2. Requirement 1: |dA(T)/dT| of the titanium compound crystal grain satisfies 10 ppm/° C. or more at at least one temperature T1 in a range of ?200° C. to 1200° C. A is (a-axis (shorter axis) lattice constant of the titanium compound crystal grain)/(c-axis (longer axis) lattice constant of the titanium compound crystal grain), and each of the lattice constants is obtained by X-ray diffractometry of the titanium compound crystal grain. Requirement 2: the particle contains a pore, and in a cross section of the particle, the pore has an average equivalent circle diameter of 0.8 ?m or more and 30 ?m or less, and the titanium compound crystal grain has an average equivalent circle diameter of 1 ?m or more and 70 ?m or less.

Abstract: Provided is a compact of a powder satisfying requirements 1 to 3. Requirement 1: |dA(T)/dT| of the powder is 10 ppm/° C. or more at least at ?200 to 1,200° C., where A is (a lattice constant of a-axis)/(a lattice constant of c-axis) obtained from X-ray diffractometry. Requirement 2: the powder contains at least one metal or semimetal element, and the element is composed of only an element selected from the group consisting of Li, Na, Mg, Al, Si, K, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Rb, Sr, Y, Zr, Nb, Mo, Tc, Ag, Cd, In, Sn, Sb, Te, Cs, Ba, Hf, Ta, W, Re, Au, Hg, Tl, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu. Requirement 3: the linear thermal expansion coefficient at ?200 to 1,200° C. of the compact is negative at least at one temperature.

Abstract: A solid composition contains a first material and a powder and satisfies requirements 1 and 2. Requirement 1: |dA(T)/dT| satisfies 10 ppm/° C. or more at least at ?200° C. to 1,200° C. A is (an a-axis lattice constant of a crystal in the powder)/(a c-axis lattice constant of a crystal in the powder), obtained from X-ray diffractometry of the powder. Requirement 2: C is 0.04 or more. C is (a log differential pore volume when a pore diameter of the solid composition is B in a pore distribution curve of the solid composition)/(a log differential pore volume corresponding to a maximum peak intensity in the pore distribution curve of the solid composition). B is (a pore diameter giving a maximum peak intensity in the pore distribution curve of the solid composition)/2. The pore distribution curve of the solid composition shows a relationship between the pore diameter and the log differential pore volume.

Abstract: This powder satisfies requirements 1 and 2. Requirement 1: |dA(T)/dT| satisfies 10 ppm/° C. or more at at least one temperature Ti in a range of ?200° C. to 1200° C. A is (a-axis (shorter axis) lattice constant) of a crystal in the powder)/(c-axis (longer axis) lattice constant of the crystal in the powder), and each of the lattice constants is obtained by X-ray diffractometry of the powder. Requirement 2: a particle diameter D50 at a cumulative frequency of 50%, a particle diameter D10 at a cumulative frequency of 10%, and a particle diameter D90 at a cumulative frequency of 90% in a volume-based cumulative particle diameter distribution curve obtained by a laser diffraction scattering method satisfy conditions (I) and (II): (I) D10/D50 is 0.05 or more and 0.45 or less; and (II) 190 is 0.5 ?m or more and 70 ?m or less.

Abstract: A compound containing Sn, Te and Mn, and further containing either one or both of Sb and Bi.

Abstract: A compound containing Sn, Te and Mg, and further containing either one or both of Sb and Bi.

Abstract: To provide a thermoelectric conversion module member which has a high connecting property between a thermoelectric conversion layer and a diffusion prevention layer and is also excellent in heat resistance. A thermoelectric conversion module member comprising a thermoelectric conversion layer and a diffusion prevention layer in contact with the above-described thermoelectric conversion layer, wherein the above-described thermoelectric conversion layer is a layer containing a thermoelectric conversion material having a silicon element or a tellurium element, the above-described diffusion prevention layer is a layer containing a metal and the same thermoelectric conversion material as that contained in the above-described thermoelectric conversion layer, and the amount of the above-described thermoelectric conversion material in the above-described diffusion prevention layer is 10 to 50 parts by weight with respect to 100 parts by weight of the above-described metal.

Abstract: A wavelength conversion sheet contains a condensed silicone resin cured product, and a wavelength conversion material. The wavelength conversion sheet has a storage modulus at 25° C. of 2 GPa or more and 10 GPa or less, and a storage modulus at 150° C. of 0.1 GPa or more and 5 GPa or less. The content of the condensed silicone resin cured product is 5% by mass or more and 80% by mass or less, to the total content of the condensed silicone resin cured product and the wavelength conversion material.

Abstract: A silicone resin composition contains a silicone resin and a solvent. The silicone resin composition is a liquid composition having a viscosity of 100 to 50000 mPa·s at 25° C. The silicone resin contains a structural unit represented by the following formula (A3), and the total content of a structural unit represented by the following formula (A1), a structural unit represented by the following formula (A1?), a structural unit represented by the following formula (A2) and the structural unit represented by the following formula (A3) contained in the silicone resin to the total content of all structural units contained in the silicone resin is 80% by mole or more, wherein R1 represents an alkyl group or an aryl group; and R2 represents an alkoxy group or a hydroxyl group.

Abstract: A composition including a binder and a variable thermal conductivity material satisfying a conditional expression 1, wherein a content of the variable thermal conductivity material is from 300 parts by weight to 10,000 parts by weight with respect to a content of 100 parts by weight of the binder: ?max/?25?1.2??[conditional expression 1] (wherein, ?25 represents a thermal conductivity at 25° C., and ?max represents the maximum value of a thermal conductivity at 200° C. or 500° C.

Abstract: A cured product includes a condensed silicone resin cured product and satisfies (1) and (2): (1) In a solid state 29Si-nuclear magnetic resonance spectrum of a condensed silicone resin cured product, there is a peak assigned to silicon atoms of a T unit (silicon atoms bonded to three oxygen atoms); and (2) In a Kratky Plot, from a wavenumber qMax of a maximum peak position in the range of wavenumbers of 0.01 to 0.17 ??1 of the X-ray, a parameter dMax obtained by formula (A) is 170 ? or less.

Abstract: An LED device is provided which includes a substrate, an LED element disposed on the substrate, an inorganic glass molded body disposed at a position where all or a part of the light which is emitted from the LED element passes through, a first bonding portion that is provided in contact with the substrate and bonds the substrate and the inorganic glass molded body, and a second bonding portion provided between the LED element and the inorganic glass molded body. The LED element is shielded from the outside air by the substrate, the inorganic glass molded body and the first bonding portion. A material which forms the second bonding portion contains a condensation polymerization-type silicone resin. A distance between the LED element and the inorganic glass molded body is 0.1 mm or less.

Abstract: An LED device is provided which includes a substrate, an LED element disposed on the substrate, an inorganic glass molded body disposed at a position where all or a part of the light which is emitted from the LED element passes through, a first bonding portion that is provided in contact with the substrate and bonds the substrate and the inorganic glass molded body, and a second bonding portion provided between the LED element and the inorganic glass molded body. The LED element is shielded from the outside air by the substrate, the inorganic glass molded body and the first bonding portion. A material which forms the second bonding portion contains a condensation polymerization-type silicone resin. A distance between the LED element and the inorganic glass molded body is 0.1 mm or less.