Abstract: A copolymer of the present invention comprises a repeating unit derived from phenylphenyl (meth)acrylate; a repeating unit derived from a hydroxyphenyl group-containing unsaturated compound; and a repeating unit derived from an epoxy group-containing unsaturated compound. The copolymer of the present invention brings together excellent transparency and a high refractive index. A resin film formed from the copolymer of the present invention can be suitably utilized in the formation of a protective film or interlayer insulating film for an electronic part such as a liquid crystal display device, an integrated circuit device, or a solid-state imaging device, the formation of a microlens or a microlens array, the formation of an optical waveguide, or the like.

Abstract: A copolymer of the present invention comprises a repeating unit derived from phenylphenyl(meth)acrylate; a repeating unit derived from a hydroxyphenyl group-containing unsaturated compound; and a repeating unit derived from an epoxy group-containing unsaturated compound. The copolymer of the present invention brings together excellent transparency and a high refractive index. A resin film formed from the copolymer of the present invention can be suitably utilized in the formation of a protective film or interlayer insulating film for an electronic part such as a liquid crystal display device, an integrated circuit device, or a solid-state imaging device, the formation of a microlens or a microlens array, the formation of an optical waveguide, or the like.

Abstract: Disclosed is a photosensitive resin composition which has excellent transparency, heat resistance, thermal discoloration resistance, adhesion to a substrate and electrical characteristics, while exhibiting good developability and storage stability. Specifically disclosed is a photosensitive resin composition which contains the following components (A), (B) and (C). (A) a copolymer which contains (a1) hydroxyphenyl (meth)acrylate and (a2) an unsaturated epoxy compound as copolymerization components (B) a novolac resin which contains one or more phenols selected from among dimethylphenol, trimethylphenol, methylpropylphenol, dipropylphenol, butylphenol, methylbutylphenol, dibutylphenol, and 4,4?-dihydroxy-2,2?-diphenylpropane (C) a quinonediazide group-containing compound.

Abstract: Disclosed is a photosensitive resin composition which has excellent transparency, heat resistance, thermal discoloration resistance, adhesion to a substrate and electrical characteristics, while exhibiting good developability and storage stability. Specifically disclosed is a photosensitive resin composition which contains the following components (A), (B) and (C).