Abstract: A dynamic quantity measuring apparatus includes a strain sensor, a resin member, a strain body, and a boding portion. The strain sensor has a plurality of piezoresistance elements and a plurality of electrode pads formed on a surface of a semiconductor substrate. The resin member for electrical wiring is provided with a plurality of wires electrically connected to the plurality of electrode pads. The strain body is joined to a back surface of the strain sensor. The bonding portion is configured to bond the resin member for electrical wiring to the strain body. A groove is provided in a region of the resin member for electrical wiring located in a vicinity of the strain sensor.

Abstract: A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.

Abstract: A semiconductor device includes a metal body; a bonding layer placed on the metal body; and a semiconductor chip placed on the bonding layer. The bonding layer includes a filler-containing first layer formed between the metal body and the semiconductor chip and a second layer bonded to the first layer and the semiconductor chip. The second layer has a thermal expansion coefficient higher than that of the first layer.

Abstract: The purpose of the present invention is to provide a strain sensor module structure having exceptional strain measurement accuracy and suppressing sensor output variation caused by moisture absorbed by a plastic member used as an electrical wiring member, etc., in a strain sensor module. The dynamic quantity measuring apparatus is characterized in having a strain sensor formed by a plurality of piezoelectric resistance elements and electrode pads on the surface of a semiconductor substrate, an electrical wiring plastic member provided with a plurality of wires that electrically connect to the plurality of electrode pads, a strain body joined to the rear surface of the strain sensor, and a bonding part via which the electrical wiring plastic member and strain body are affixed together; a groove being provided in an area of the electrical wiring plastic body that is near the strain sensor.

Abstract: A semiconductor device includes a metal body; a bonding layer placed on the metal body; and a semiconductor chip placed on the bonding layer. The bonding layer includes a filler-containing first layer formed between the metal body and the semiconductor chip and a second layer bonded to the first layer and the semiconductor chip. The second layer has a thermal expansion coefficient higher than that of the first layer.

Abstract: A rotating body non-contact power-feeding device comprises: a power receiving-side substrate with a power receiving-side circuit component mounted thereat, which is fixed to a rotating shaft supported via a bearing and rotates as one with the rotating shaft; and a power transmitting-side substrate with a power transmitting-side circuit component mounted thereat, which is fixed to a holding unit holding the bearing so that a substrate surface thereof faces opposite a substrate surface of the power receiving-side substrate and is connected with a power source, wherein: a power transmitting-side coil is formed with a conductive pattern so as to achieve a flat-plane spiral pattern with a plurality of turns at a substrate surface facing opposite the power receiving-side substrate and the power transmitting-side circuit component is mounted at another substrate surface, at the power transmitting-side substrate that includes a substrate front surface and a substrate back surface, a power receiving-side coil is forme

Abstract: A non-contact power-feeding device comprises: a power transmitting unit that includes a first antenna coil, an oscillator and a driver that enables generation of an AC magnetic field via the first antenna coil based upon a signal provided by the oscillator; and a power receiving unit that includes a second antenna coil that is magnetically coupled with the first antenna coil, wherein the first antenna coil comprises: a flat-plane spiral resonance coil wound with a plurality of turns; and a flat-plane spiral power-feeding coil that is wound with a plurality of turns outward relative to the resonance coil so as to surround the resonance coil, and is magnetically coupled with the resonance coil.

Abstract: A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.

Abstract: A non-contact power-feeding device comprises: a power transmitting unit that includes a first antenna coil, an oscillator and a driver that enables generation of an AC magnetic field via the first antenna coil based upon a signal provided by the oscillator; and a power receiving unit that includes a second antenna coil that is magnetically coupled with the first antenna coil, wherein the first antenna coil comprises: a flat-plane spiral resonance coil wound with a plurality of turns; and a flat-plane spiral power-feeding coil that is wound with a plurality of turns outward relative to the resonance coil so as to surround the resonance coil, and is magnetically coupled with the resonance coil.

Abstract: A rotating body non-contact power-feeding device comprises: a power receiving-side substrate with a power receiving-side circuit component mounted thereat, which is fixed to a rotating shaft supported via a bearing and rotates as one with the rotating shaft; and a power transmitting-side substrate with a power transmitting-side circuit component mounted thereat, which is fixed to a holding unit holding the bearing so that a substrate surface thereof faces opposite a substrate surface of the power receiving-side substrate and is connected with a power source, wherein: a power transmitting-side coil is formed with a conductive pattern so as to achieve a flat-plane spiral pattern with a plurality of turns at a substrate surface facing opposite the power receiving-side substrate and the power transmitting-side circuit component is mounted at another substrate surface, at the power transmitting-side substrate that includes a substrate front surface and a substrate hack surface, a power receiving-side coil is forme

Abstract: In a mobile phone device 1 including a three-axial direction vibration sensor 16 for detecting the walking of a user carrying the mobile phone device 1 and counting the number of walking steps, when an incoming call is received, vibrations due to a notification operation by a vibrator 14 or a speaker 15 are transmitted to the three-axial direction vibration sensor 16. As a result, the three-axial direction vibration sensor 16 inevitably detects unintended vibrations in addition to vibrations from walking, causing the number of walking steps to be miscounted. To prevent this and perform the accurate detection of walking, in the present invention, the detection of walking is performed without using, among vibrations in three directions detected by the three-axial direction vibration sensor 16, vibrations in the same direction as the direction of vibrations caused by a notification operation by the vibrator 14 or the speaker 15.

Abstract: In a mobile phone device 1 including a three-axial direction vibration sensor 16 for detecting the walking of a user carrying the mobile phone device 1 and counting the number of walking steps, when an incoming call is received, vibrations due to a notification operation by a vibrator 14 or a speaker 15 are transmitted to the three-axial direction vibration sensor 16. As a result, the three-axial direction vibration sensor 16 inevitably detects unintended vibrations in addition to vibrations from walking, causing the number of walking steps to be miscounted. To prevent this and perform the accurate detection of walking, in the present invention, the detection of walking is performed without using, among vibrations in three directions detected by the three-axial direction vibration sensor 16, vibrations in the same direction as the direction of vibrations caused by a notification operation by the vibrator 14 or the speaker 15.

Abstract: A mobile terminal device with a camera is provided which can secure emitted light brightness of a camera light unit and save power consumption of the device. During photographing, when the driving power of the camera light unit is increased, driving power for an illumination unit is decreased so that the increase of the total power consumption of the camera light unit and illumination unit can be minimized. In addition, the camera lamp unit and illumination unit are driven by respective driving circuits that share a power supply unit.