Abstract: Provided is an optical connection component that is constituted of a plate-shaped substrate configured to transmit light to be used, and a resin optical waveguide. The resin optical waveguide is constituted of a resin core formed with a resin through which light to be used passes. For example, the resin core is formed with a light-cured resin. The resin optical waveguide uses air surrounding the resin core as a cladding. The resin core has a folded back structure in which the resin core once separates from the surface of the substrate and then returns to the surface of the substrate, and is connected to each of a first input/output end and a second input/output end of the substrate.

Abstract: An optical connection structure includes a first focus lens arranged between a first light incidence/emission end and an optical element, and a second focus lens arranged between a second light incidence/emission end and the optical element. The first focus lens and the second focus lens are arranged on an optical axis connecting the first light incidence/emission end and the second light incidence/emission end.

Abstract: An optical connection structure includes a PLC that is an optical waveguide chip including an optical waveguide and at least one groove formed on a substrate, and at least one optical fiber that is fitted into the at least one groove of the PLC. The PLC includes the optical waveguide, at least one grating coupler that is optically connected to the optical waveguide, and the at least one groove formed at a position in a vicinity of the at least one grating coupler in a cladding layer in which the optical waveguide is formed. An optical fiber of the at least one optical fiber is fitted into a groove of the at least one groove such that an end surface of the optical fiber is located in a vicinity of a grating coupler of the at least one grating coupler, the optical fiber being optically connected to the grating coupler.

Abstract: A first optical waveguide layer and a second optical waveguide layer are optically connected by a resin optical waveguide composed of a resin core composed of a light-transmitting resin and a cladding composed of air surrounding the resin core. A hollow outer wall structure that houses the resin optical waveguide is provided. An enclosed space is provided inside the outer wall structure. The outer wall structure is disposed to bridge the gap between the first optical device and the second optical device.

Abstract: The optical module includes an extension circuit board and a front end flip-chip mounted on the extension circuit board. The front end includes a semiconductor amplifier chip that executes signal processing, and an optical semiconductor chip that includes at least one of a light emitting element and a light receiving element and is flip-chip mounted on the semiconductor amplifier chip. The extension circuit board has a recessed portion that can accommodate at least a part of the optical semiconductor chip. The semiconductor amplifier chip is flip-chip mounted on the extension circuit board in the state where the surface mounting the optical semiconductor chip faces the surface of the extension circuit board, and at least a part of the optical semiconductor chip is accommodated in the recessed portion.

Abstract: A first adhesive layer is provided to be in contact with an SSC. A second adhesive layer is provided to be in contact with an optical fiber. A lens structure is on an interface between the first adhesive layer and the second adhesive layer.

Abstract: A connection structure of optical waveguide chips includes a base substrate (2003) in which grooves (2013) are formed, spacer optical fibers (2006) each disposed for a corresponding one of the grooves (2013) and fitted in the groove (2013) while partially projecting from the base substrate (2003), and silica-based PLCs (2001, 2002) that are a plurality of optical waveguide chips in each of which grooves (2007) fitted on the projecting portions of the spacer optical fibers (2006) are formed at positions of an optical waveguide layer (2008) facing the grooves (2013), and each of which is mounted on the base substrate (2003) while being supported by the spacer optical fibers (2006). The silica-based PLCs (2001, 2002) are mounted on the base substrate (2003) such that incident/exit end faces of the optical waveguide layers (2008) face each other.

Abstract: A connection structure for optical waveguide chips includes a silica-based PLC in which grooves are formed, spacer steel balls fitted in the grooves, and silica-based PLCs in which grooves into which the spacer steel balls to be fitted are formed, the silica-based PLCs being mounted on the silica-based PLC by being supported by the spacer steel balls. A conductor wire formed in the silica-based PLC and a conductor wire formed in the silica-based PLC are electrically connected to each other by a conductor film formed in the groove, the spacer steel balls and a conductor film formed in the groove.

Abstract: A connection structure of optical waveguide chips includes a base substrate (2003) in which grooves (2013) are formed, spacer optical fibers (2006) each disposed for a corresponding one of the grooves (2013) and fitted in the groove (2013) while partially projecting from the base substrate (2003), and silica-based PLCs (2001, 2002) that are a plurality of optical waveguide chips in each of which grooves (2007) fitted on the projecting portions of the spacer optical fibers (2006) are formed at positions of an optical waveguide layer (2008) facing the grooves (2013), and each of which is mounted on the base substrate (2003) while being supported by the spacer optical fibers (2006). The silica-based PLCs (2001, 2002) are mounted on the base substrate (2003) such that incident/exit end faces of the optical waveguide layers (2008) face each other.

Abstract: An optical waveguide connection structure connects a Si waveguide and an optical fiber to each other with a bonding layer interposed therebetween. The Si waveguide has a core whose cross-sectional area in the direction perpendicular to the direction of propagation of light decreases toward the optical fiber, and a cladding that covers the core. The optical fiber has a fiber core, a fiber cladding that covers the fiber core, and a recess formed in an end face opposed to the Si waveguide. The bonding layer fills a gap between the end face of the Si waveguide and the end face of the optical fiber and the recess, and the bonding layer has a refractive index greater than the refractive index of the fiber core of the optical fiber.

Abstract: A connection structure of optical waveguide chips includes a base substrate (2003) in which grooves (2013) are formed, spacer optical fibers (2006) each disposed for a corresponding one of the grooves (2013) and fitted in the groove (2013) while partially projecting from the base substrate (2003), and silica-based PLCs (2001, 2002) that are a plurality of optical waveguide chips in each of which grooves (2007) fitted on the projecting portions of the spacer optical fibers (2006) are formed at positions of an optical waveguide layer (2008) facing the grooves (2013), and each of which is mounted on the base substrate (2003) while being supported by the spacer optical fibers (2006). The silica-based PLCs (2001, 2002) are mounted on the base substrate (2003) such that incident/exit end faces of the optical waveguide layers (2008) face each other.

Abstract: An objective is to provide an integrated optical module which can avoid positional change and separation of a PLC chip when humidity changes. Provided is an integrated optical module characterized in that the integrated optical module includes: a PLC chip; a seat bonded and fixed to part of a lower surface of the PLC chip with an adhesive which is applied to an adhesion surface of the seat; and a support portion supporting the seat, in which a water-repellent treatment portion is provided by masking an upper portion of the support portion with a water-repellent material. The water-repellent treatment portion is provided only around the seat for a predetermined width. The water-repellent treatment portion is provided around the seat for a width of 100 ?m or more.

Abstract: An objective is to provide an integrated optical module which can avoid positional change and separation of a PLC chip when humidity changes. Provided is an integrated optical module characterized in that the integrated optical module includes: a PLC chip; a seat bonded and fixed to part of a lower surface of the PLC chip with an adhesive which is applied to an upper surface of the seat; and a support portion supporting the seat, in which a groove where an adhesive overflowing from the upper surface of the seat is to stay is formed in an upper surface of the support portion at a portion surrounding the seat, the upper surface of the seat serving as an adhesion surface.

Abstract: An objective is to provide an integrated optical module which can avoid positional change and separation of a PLC chip when humidity changes. Provided is an integrated optical module characterized in that the integrated optical module includes: a PLC chip; a seat bonded and fixed to part of a lower surface of the PLC chip with an adhesive which is applied to an adhesion surface of the seat; and a support portion supporting the seat, in which a water-repellent treatment portion is provided by masking an upper portion of the support portion with a water-repellent material. The water-repellent treatment portion is provided only around the seat for a predetermined width. The water-repellent treatment portion is provided around the seat for a width of 100 ?m or more.

Abstract: In a conventional optical signal processing device, a confocal optical system is configured in which a focusing lens is positioned at a substantially-intermediate point of a free space optical path. Thus, the free space optical system had a long length. It has been difficult to reduce the size of the entire device. The optical signal processing device of the present invention uses a lens layout configuration different from the confocal optical system to thereby significantly reduce the length of the system. The optical signal processing device consists of the first focusing lens positioned in the close vicinity of a signal processing device, and the second focusing lens positioned in the vicinity of a dispersing element. A distance between the dispersing element and the signal processing device is approximately a focal length of the first focusing lens. Compared with the conventional technique, the length of the optical path can be halved.

Abstract: In a conventional optical signal processing device, a confocal optical system is configured in which a focusing lens is positioned at a substantially-intermediate point of a free space optical path. Thus, the free space optical system had a long length. It has been difficult to reduce the size of the entire device. The optical signal processing device of the present invention uses a lens layout configuration different from the confocal optical system to thereby significantly reduce the length of the system. The optical signal processing device consists of the first focusing lens positioned in the close vicinity of a signal processing device, and the second focusing lens positioned in the vicinity of a dispersing element. A distance between the dispersing element and the signal processing device is approximately a focal length of the first focusing lens. Compared with the conventional technique, the length of the optical path can be halved.