Patents by Inventor Atsushi Fujishima
Atsushi Fujishima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8435867Abstract: Foreign matter formed over (or adhered to) a surface of a lead is reliably removed. A laser beam is applied to a residual resin (sealing body) which is formed in (or adhered to) a region surrounded by a sealing body (a first sealing body), a lead exposed (projected) from the sealing body, and a dam bar. The foreign matter formed over (or adhered to) the surface of the lead can be reliably removed by washing the surface of the lead after the removal of the residual resin. Thus, in a subsequent plating step, the reliability (wettability, adhesion with the lead) of a plating film to be formed over the surface of the lead can be improved.Type: GrantFiled: September 23, 2010Date of Patent: May 7, 2013Assignee: Renesas Electronics CorporationInventors: Atsushi Fujishima, Haruhiko Harada
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Patent number: 7985625Abstract: A method of manufacturing a semiconductor device involves the steps of: forming a plurality of product formation areas each having a circuit and a plurality of first electrode pads over a main surface of a semiconductor wafer; arranging a plurality of second electrode pads with larger pitches than the first electrode pads in each of the product formation areas; segmenting the semiconductor wafer to separate the plural product formation areas and provide a plurality of semiconductor devices each having the circuit, the plural first electrode pads and the plural second electrode pads on a first surface; and cleaning foreign matter off the first surface of the semiconductor device after the step of segmenting the semiconductor devices.Type: GrantFiled: May 14, 2009Date of Patent: July 26, 2011Assignee: Renesas Electronics CorporationInventors: Yoshihiko Yamaguchi, Atsushi Fujishima, Yusuke Ohta
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Publication number: 20110097854Abstract: Foreign matter formed over (or adhered to) a surface of a lead is reliably removed. A laser beam is applied to a residual resin (sealing body) which is formed in (or adhered to) a region surrounded by a sealing body (a first sealing body), a lead exposed (projected) from the sealing body, and a dam bar. The foreign matter formed over (or adhered to) the surface of the lead can be reliably removed by washing the surface of the lead after the removal of the residual resin. Thus, in a subsequent plating step, the reliability (wettability, adhesion with the lead) of a plating film to be formed over the surface of the lead can be improved.Type: ApplicationFiled: September 23, 2010Publication date: April 28, 2011Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Atsushi FUJISHIMA, Haruhiko HARADA
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Publication number: 20090221104Abstract: A method of manufacturing a semiconductor device involves the steps of: forming a plurality of product formation areas each having a circuit and a plurality of first electrode pads over a main surface of a semiconductor wafer; arranging a plurality of second electrode pads with larger pitches than the first electrode pads in each of the product formation areas; segmenting the semiconductor wafer to separate the plural product formation areas and provide a plurality of semiconductor devices each having the circuit, the plural first electrode pads and the plural second electrode pads on a first surface; and cleaning foreign matter off the first surface of the semiconductor device after the step of segmenting the semiconductor devices.Type: ApplicationFiled: May 14, 2009Publication date: September 3, 2009Inventors: Yoshihiko Yamaguchi, Atsushi Fujishima, Yusuke Ohta
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Patent number: 7534657Abstract: A method of manufacturing a semiconductor device involves the steps of: forming a plurality of product formation areas each having a circuit and a plurality of first electrode pads over a main surface of a semiconductor wafer; arranging a plurality of second electrode pads with larger pitches than the first electrode pads in each of the product formation areas; segmenting the semiconductor wafer to separate the plural product formation areas and provide a plurality of semiconductor devices each having the circuit, the plural first electrode pads and the plural second electrode pads on a first surface; and cleaning foreign matter off the first surface of the semiconductor device after the step of segmenting the semiconductor devices.Type: GrantFiled: September 30, 2004Date of Patent: May 19, 2009Assignee: Renesas Technology Corp.Inventors: Yoshihiko Yamaguchi, Atsushi Fujishima, Yusuke Ohta
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Patent number: 7467464Abstract: A method for manufacturing a multi media card comprises the steps of: providing a substrate, mounting a first flash memory chip and a controller chip for controlling the flash memory chip over a front surface of the substrate, molding the first flash memory chip and the controller chip by a resin, providing a case having a main surface and a back surface, wherein the back surface of the case has a first recess and a second recess, and, covering the resin and the front surface of the substrate by the case. The depth of the first recess is deeper than the depth of the second recess. The resin is fitted in the first recess. An edge portion of the substrate is fitted in the second recess. The substrate warps so that a central portion of the substrate projects in a direction away from the case.Type: GrantFiled: December 3, 2007Date of Patent: December 23, 2008Assignees: Renesas Technology Corp., Hitachi ULSI Systems, Co., Ltd.Inventors: Takahiro Osawa, Yoichi Kawata, Atsushi Fujishima, Tamaki Wada, Kenichi Imura
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Publication number: 20080173995Abstract: There is a need to provide a large capacity memory card for a portable communication device. A memory card 1 includes: a wiring board 2 mainly composed of a glass epoxy resin; multiple semiconductor chips (3C and 3F) mounted on a main surface of the memory card 1; and a mold resin 4 for encapsulating the wiring board 2 and the semiconductor chips (3C and 3F). The mold resin 4 is made of a thermosetting epoxy resin containing quartz filler. A back surface of the wiring board 2 is not covered with the mold resin 4 and is exposed to a back surface of the memory card 1. The back surface of the wiring board 2 is used to form multiple external connection terminals 7 electrically connected to the semiconductor chips (3C and 3F) . When the memory card 1 is attached to a card slot of a mobile phone, the external connection terminals 7 contact with a connector terminal contained in the card slot. This makes it possible to exchange signals between the memory card 1 and the mobile phone or to supply the power.Type: ApplicationFiled: September 12, 2007Publication date: July 24, 2008Inventors: Bunshi Kuratomi, Fukumi Shimizu, Michiaki Sugiyama, Atsushi Fujishima, Tamaki Wada
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Publication number: 20080115352Abstract: A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.Type: ApplicationFiled: December 3, 2007Publication date: May 22, 2008Inventors: Takahiro Osawa, Yoichi Kawata, Atsushi Fujishima, Tamaki Wada, Kenichi Imura
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Patent number: 7322531Abstract: A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.Type: GrantFiled: January 6, 2006Date of Patent: January 29, 2008Assignees: Hitachi ULSI Systems Co., Ltd., Renesas Technology CorporationInventors: Takahiro Osawa, Yoichi Kawata, Atsushi Fujishima, Tamaki Wada, Kenichi Imura
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Patent number: 7086600Abstract: A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.Type: GrantFiled: February 2, 2001Date of Patent: August 8, 2006Assignees: Renesas Technology Corporation, Hitachi ULSI Systems Co., Ltd.Inventors: Takahiro Osawa, Yoichi Kawata, Atsushi Fujishima, Tamaki Wada, Kenichi Imura
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Publication number: 20060108430Abstract: A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.Type: ApplicationFiled: January 6, 2006Publication date: May 25, 2006Inventors: Takahiro Osawa, Yoichi Kawata, Atsushi Fujishima, Tamaki Wada, Kenichi Imura
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Publication number: 20050085009Abstract: A method of manufacturing a semiconductor device involves the steps of: forming a plurality of product formation areas each having a circuit and a plurality of first electrode pads over a main surface of a semiconductor wafer; arranging a plurality of second electrode pads with larger pitches than the first electrode pads in each of the product formation areas; segmenting the semiconductor wafer to separate the plural product formation areas and provide a plurality of semiconductor devices each having the circuit, the plural first electrode pads and the plural second electrode pads on a first surface; and cleaning foreign matter off the first surface of the semiconductor device after the step of segmenting the semiconductor devices.Type: ApplicationFiled: September 30, 2004Publication date: April 21, 2005Inventors: Yoshihiko Yamaguchi, Atsushi Fujishima, Yusuke Ohta
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Publication number: 20040056104Abstract: In a memory card of the structure wherein a substrate is affixed to a cap, the memory card is formed to a predetermined thickness without projection of substrate edges from a back surface of the cap.Type: ApplicationFiled: July 16, 2003Publication date: March 25, 2004Inventors: Takahiro Osawa, Yoichi Kawata, Atsushi Fujishima, Tamaki Wada, Kenichi Imura
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Publication number: 20030153134Abstract: A method for manufacturing a semiconductor device including providing first and second semiconductor chips each having a main surface having a semiconductor element and a plurality of external terminals, and a lower surface respectively opposing the main surface. A first lead frame is provided which has a frame body which supports outer portions and inner portions extending from the outer portions, and a second lead frame is provided which has a frame body which supports outer portions and inner portions extending from the outer portions. After electrically connecting the external terminals to the inner portions of the lead frames and resin-sealing the first and second semiconductor chips so that the first and second lead frames are superimposed, the frame body of the second lead frame is removed and a first processing fluid is applied to the outer portions of the first lead frame and the second lead frame.Type: ApplicationFiled: February 27, 2003Publication date: August 14, 2003Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara
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Patent number: 6551858Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.Type: GrantFiled: April 29, 2002Date of Patent: April 22, 2003Assignees: Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara
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Patent number: 6479322Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.Type: GrantFiled: January 2, 2002Date of Patent: November 12, 2002Assignees: Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara
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Publication number: 20020119598Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, comprises a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by soldering outside the resin body after sealing them with resin.Type: ApplicationFiled: April 29, 2002Publication date: August 29, 2002Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara
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Patent number: 6410365Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.Type: GrantFiled: June 1, 1999Date of Patent: June 25, 2002Assignees: Hitachi, Ltd., Hitachi ULSI Systems Co., Ltd.Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara
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Publication number: 20020064903Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, comprises a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by soldering outside the resin body after sealing them with resin.Type: ApplicationFiled: January 2, 2002Publication date: May 30, 2002Inventors: Youichi Kawata, Kouji Koizumi, Michiaki Sugiyama, Atsushi Fujishima, Yasuyuki Nakajima, Takatoshi Hagiwara