Abstract: An imaging method of imaging a subject through a multispectral camera including a processor, includes: causing the processor to perform: a data acquisition step of acquiring first spectral data of a first subject, second spectral data of a second subject, and third spectral data of a third subject; a wavelength selection step of selecting a plurality of wavelengths from a wavelength region of the acquired first to third spectral data, the wavelength selection step being for determining, as a computational amount, a difference or a ratio between feature amounts of two pieces of spectral data, from among the first spectral data, the second spectral data, and the third spectral data, and obtaining computational amounts to select the plurality of wavelengths; and an imaging step of imaging a subject including at least one of the first subject, the second subject, or the third subject at the plurality of wavelengths.

Abstract: A lens device includes an imaging optical system and an optical member. The optical member is disposed near a pupil of the imaging optical system in a state where an optical axis of the optical member coincides with an optical axis of the imaging optical system. The optical member includes a frame that includes a plurality of aperture regions, a plurality of optical filters that are disposed in at least one of the plurality of aperture regions and include two or more optical filters transmitting light having at least some wavelength ranges different from each other, and a plurality of polarizing filters that are disposed in at least one of the plurality of aperture regions and have different polarization directions. The lens barrel has a slit, and the optical member is insertable into and removable from the imaging optical system through the slit.

Abstract: A liquid crystal polyester composition is provided, containing a liquid crystal polyester and a plate-like inorganic filler, in which a ratio (D50/D50*) of median diameters of the plate-like inorganic filler is 3.0 to 6.0. The D50 is a median diameter of the plate-like inorganic filler measured by a laser diffraction method. The D50* is a median diameter of the plate-like inorganic filler measured by a centrifugal sedimentation method.

Abstract: A liquid crystal polyester composition is provided, containing a liquid crystal polyester and a plate-like inorganic filler, in which a ratio (D50/D50*) of median diameters of the plate-like inorganic filler is 3.0 to 6.0. The D50 is a median diameter of the plate-like inorganic filler measured by a laser diffraction method. The D50* is a median diameter of the plate-like inorganic filler measured by a centrifugal sedimentation method.

Abstract: A method for applying a sealant to a component, in which the sealant is applied to a part of or the entirety of a sealing surface of the component, comprises the steps of: disposing in the sealant, an abutting member approximately in parallel to a surface of the sealant, which is a liquid, formed into a film of a specified thickness; pressing the sealing surface of the component to the abutting member in the sealant formed into the film; and transferring the sealant to the sealing surface of the component by pulling the component apart from the sealant.

Abstract: A surface acoustic wave device includes a surface acoustic wave element and a package. The package has a base member and a conductive cap member which are joined together by a sealing material so as to hermetically seal the surface acoustic wave element therein. The conductive cap member is coated with the sealing material on the entire surface thereof that is disposed opposite to the base member.

Abstract: A sealing structure and a sealing method for an electronic component achieves desired sealing properties and heat resistance. An electronic component element is mounted on a substrate having an electrode pattern disposed thereon, and is sealed by bonding a cap for covering the electronic component element on the substrate. An adhesive structure used to join the cap on the substrate includes a high-glass-transition-point adhesive partially coated on the cap bonded portion of the substrate, and a low-glass-transition-point adhesive coated over an entire periphery of the opening of the cap. The opening of the cap is pressed on a mounting portion of the substrate, and the adhesives are then cured to bond and seal the substrate and the cap.

Abstract: A sealing structure and a sealing method for an electronic component achieves desired sealing properties and heat resistance. An electronic component element is mounted on a substrate having an electrode pattern disposed thereon, and is sealed by bonding a cap for covering the electronic component element on the substrate. An adhesive structure used to join the cap on the substrate includes a high-glass-transition-point adhesive partially coated on the cap bonded portion of the substrate, and a low-glass-transition-point adhesive coated over an entire periphery of the opening of the cap. The opening of the cap is pressed on a mounting portion of the substrate, and the adhesives are then cured to bond and seal the substrate and the cap.