Abstract: Inside a first case outer frame portion as an outer frame of the first case, a plurality of first core pieces and a partition to separate a pair of adjacent first core pieces among the plurality of first core pieces are disposed. The first case has a shape capable of accommodating at least a part of the second core piece. The first case outer frame portion includes a first case accommodating portion as a portion of the first case outer frame portion that is capable of accommodating the plurality of first core pieces, and a first case cover portion to cover a space inside the first case accommodating portion.

Abstract: A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.

Abstract: A wiring substrate includes: a base body having an insulating property and including a first surface and a second surface on a side opposite the first surface; a resist portion covering at least part of the first surface and at least a part of the second surface of the base body and including a hole portion having a predetermined pattern; and a wiring line disposed in the hole portion of the resist portion so as to be in contact with the base body. In a cross-sectional view in a thickness direction of the base body, a length of an exposed surface of the wiring line exposed from the resist portion is less than a length of a contact surface of the wiring line in contact with the base body.

Abstract: A method of manufacturing a wiring substrate includes providing a conductive paste including metal nanoparticles, metal particles, and a resin, disposing the conductive paste on at least a first surface of an insulating base body, and forming a wiring layer by heating and pressurizing the conductive paste by using a roll press or a hard SUS plate. In the providing the conductive paste, the ratio of a mass of the metal nanoparticles to the total mass of the metal nanoparticles and the metal particles is in a range of 5 mass % to 95 mass %, and the conductive paste is heated and pressurized such that part of the wiring layer in a thickness direction is embedded in at least the first surface of the insulating base body.

Abstract: According to one embodiment, a semiconductor device includes an integrated circuit (IC) chip and a silicon capacitor. The IC chip has a first terminal and a second terminal on a first surface. The silicon capacitor has a first electrode and a second electrode on a second surface facing the first surface. The first electrode is electrically connected to the first terminal through a first conductive member, and the second electrode is electrically connected to the second terminal through a second conductive member.

Abstract: A protective ring with an annular shape that is formed of an elastic member and is mounted in an annular groove formed in a butt adhesion surface of a first cylindrical member and a second cylindrical member includes a band-shaped ring body and a ridge protruding from a center of an inner surface in a width direction and pressed against the annular groove. The ridge is continuously formed such that a cross section of the ridge is semicircular-shaped and has a smaller diameter than a width of the ring body, and the width of the ring body is larger than a thickness of the protective ring in a radius direction.

Abstract: A coil apparatus includes a coil unit including a coil, a base core that is a first core component, and a core module that is a second core component. The first core component includes a center leg that is a leg around which the coil is wound. The second core component includes a plurality of core segments arranged in a row with gaps between them. The second core component is connected to the leg to form a magnetic path together with the first core component.

Abstract: According to one embodiment, a semiconductor device includes an integrated circuit (IC) chip and a silicon capacitor. The IC chip has a first terminal and a second terminal on a first surface. The silicon capacitor has a first electrode and a second electrode on a second surface facing the first surface. The first electrode is electrically connected to the first terminal through a first conductive member, and the second electrode is electrically connected to the second terminal through a second conductive member.

Abstract: A semiconductor device includes a molded body and an interconnection layer. The molded body includes a semiconductor chip, at least one terminal body disposed around the semiconductor chip and a resin member provided between the semiconductor chip and the terminal body. The molded body has a first surface, a second surface opposite to the first surface and a side surface connected to the first and second surfaces. The interconnection layer is provided on the first surface of the molded body. The interconnection layer includes an interconnect electrically connecting the semiconductor chip and the terminal body. The terminal body has first and second contact surfaces. The first contact surface is exposed at the first or second surface of the molded body. The second contact surface is connected to the first contact surface and exposed at the side surface of the molded body.

Abstract: Inside a first case outer frame portion as an outer frame of the first case, a plurality of first core pieces and a partition to separate a pair of adjacent first core pieces among the plurality of first core pieces are disposed. The first case has a shape capable of accommodating at least a part of the second core piece. The first case outer frame portion includes a first case accommodating portion as a portion of the first case outer frame portion that is capable of accommodating the plurality of first core pieces, and a first case cover portion to cover a space inside the first case accommodating portion.

Abstract: A semiconductor device includes a molded body and an interconnection layer. The molded body includes a semiconductor chip, at least one terminal body disposed around the semiconductor chip and a resin member provided between the semiconductor chip and the terminal body. The molded body has a first surface, a second surface opposite to the first surface and a side surface connected to the first and second surfaces. The interconnection layer is provided on the first surface of the molded body. The interconnection layer includes an interconnect electrically connecting the semiconductor chip and the terminal body. The terminal body has first and second contact surfaces. The first contact surface is exposed at the first or second surface of the molded body. The second contact surface is connected to the first contact surface and exposed at the side surface of the molded body.

Abstract: An optical device includes a substrate, a semiconductor chip, a resin member, and a transparent plate. The semiconductor chip is provided on the substrate, and an optically functional layer is formed in a part of a top portion of the semiconductor chip. The resin member is provided on the substrate with a top surface and an inner side surface, and has a frame shape surrounding the optically functional layer. The resin member is integrally formed from a resin material, and includes a recessed portion provided at the intersection of the top surface and the inner side surface. The transparent plate is disposed in the recessed portion. The semiconductor chip, the resin member, and the transparent plate are arranged to define airspace.

Abstract: An optical device includes a substrate, a semiconductor chip, a resin member, and a transparent plate. The semiconductor chip is provided on the substrate, and an optically functional layer is formed in a part of a top portion of the semiconductor chip. The resin member is provided on the substrate with a top surface and an inner side surface, and has a frame shape surrounding the optically functional layer. The resin member is integrally formed from a resin material, and includes a recessed portion provided at the intersection of the top surface and the inner side surface. The transparent plate is disposed in the recessed portion. The semiconductor chip, the resin member, and the transparent plate are arranged to define airspace.

Abstract: An inner peripheral surface (10C) of an elastic seal (10) having a U-shaped cross section and made of rubber is supported by a guide ring (20) having a flat cross-sectional shape and made of synthetic resin.

Abstract: An inner peripheral surface (10C) of an elastic seal (10) having a U-shaped cross section and made of rubber is supported by a guide ring (20) having a flat cross-sectional shape and made of synthetic resin.

Abstract: A download system capable of appropriately spreading loads on a server and on a transmission path, and further enhancing convenience in download of data. A reservation candidate acquirer of a communication terminal acquires from a software managing server reservation candidate information containing time information about time zones as candidates to which a reservation for download of an update file can be allocated. At the communication terminal a user selects a reserved time zone from the time zones corresponding to the time information included in the reservation candidate information, and the software managing server registers the reservation in the reserved time zone. Thereby, the reserved time zone can be selected from the candidate time zones transmitted by the software managing server and the candidate time zones are determined based on a reservation table set so as to spread loads on the software managing server and on the transmission path.

Abstract: A seal rubber 3 is placed in a first peripheral groove 2 formed in one main surface 1A of an approximately flat-plate-shaped metal body 1. A second peripheral groove 4 and multiple communicating holes 5 to communicate between the second peripheral groove 4 and the first peripheral groove 2 are formed in the other main surface 1B of the metal body 1. A retaining rubber 6 disposed in the second peripheral groove 4, the seal rubber 3, and a bridge rubber 7 disposed in the communicating hole 5 are integrated. The first peripheral groove 2 is made to be a dovetail groove, the second peripheral groove 4 is made to have an inner surface inclined to reduce the groove width from a groove opening side to a groove bottom surface side, and the groove width D4-2 of the groove bottom surface and the inner diameter D3 of the communicating hole 5 are made to be substantially the same.

Abstract: A sealing construction provided with a plate member of metal and a rubber member forming a sealing portion and unitedly fixed to the plate member on which a ring concave groove is formed on an obverse face. And, plural through holes, having enlarged opening end portions on a reverse face, are formed through a bottom face of the ring concave groove and the reverse face. Further, a ring plate is disposed as to contact the bottom face of the ring concave groove and partially close the opening portions of the through holes toward the bottom face, and the rubber member, fit to the through hole and surrounding the ring plate, is unitedly connected to the sealing portion in the ring concave groove.

Abstract: A download system capable of appropriately spreading loads on a server and on a transmission path, and further enhancing convenience in download of data. A reservation candidate acquirer of a communication terminal acquires from a software managing server reservation candidate information containing time information about time zones as candidates to which a reservation for download of an update file can be allocated. At the communication terminal a user selects a reserved time zone from the time zones corresponding to the time information included in the reservation candidate information, and the software managing server registers the reservation in the reserved time zone. Thereby, the reserved time zone can be selected from the candidate time zones transmitted by the software managing server and the candidate time zones are determined based on a reservation table set so as to spread loads on the software managing server and on the transmission path.

Abstract: A seal rubber 3 is placed in a first peripheral groove 2 formed on one main surface 1A of an approximately flat-plate-shaped metal body 1, the second peripheral groove 4 and multiple communicating holes 5 to communicate between the second peripheral groove 4 and the first peripheral groove 2 are formed on the other main surface 1B of the metal body 1, and a retaining rubber 6 disposed in the second peripheral groove 4, a seal rubber 3, and a bridge rubber 7 disposed in the communicating hole 5 are integrated. The first peripheral groove 2 is made to be a dovetail groove, the second peripheral groove 4 is made to have an inner surface inclined to reduce the groove width from a groove opening side to a groove bottom surface side, and the groove width D4-2 of the groove bottom surface and the inner diameter D3 of the communicating hole 5 are made to be substantially the same.