Patents by Inventor Atsushi Ishimaru

Atsushi Ishimaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10032714
    Abstract: A semiconductor switch includes an insulating film on a semiconductor substrate. A switching circuit is on a first portion of the insulating film. The switching circuit is configured to switch a path of a high-frequency signal. A wiring layer is provided on the insulating film. The wiring layering includes a signal wire and a ground wire. A conductive layer is between the wiring layer and the insulating film. The conductive layer, in some embodiments, includes a first conductive region between the high-frequency wiring and the insulating film and a second conductive region between the grounding wiring and the insulating film.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: July 24, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Atsushi Ishimaru
  • Patent number: 9654094
    Abstract: According to one embodiment, a semiconductor switch circuit includes a semiconductor substrate, an insulating film, a semiconductor layer, a first wiring line, a semiconductor switch unit, and a first conductor. The insulating film is provided on the semiconductor substrate. The semiconductor layer is provided on the insulating film. The first wiring line is provided above the insulating film. The semiconductor switch unit is provided on the semiconductor layer and is electrically connected to the first wiring line. The first conductor is provided between the first wiring line and the semiconductor substrate.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: May 16, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Atsushi Ishimaru, Keita Masuda
  • Patent number: 9627208
    Abstract: According to an embodiment, a semiconductor switch includes a first insulating film on a semiconductor substrate, a first semiconductor layer on the first insulating film, a semiconductor switch circuit on the first semiconductor layer, and a wiring on the first insulating film. The first insulating film being between the wiring and the substrate. The wiring connects the semiconductor switch circuit and a terminal. A polycrystalline semiconductor layer is between the wiring and the first insulating film.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: April 18, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Atsushi Ishimaru, Masami Nagaoka
  • Publication number: 20170005651
    Abstract: A semiconductor switch includes an insulating film on a semiconductor substrate. A switching circuit is on a first portion of the insulating film. The switching circuit is configured to switch a path of a high-frequency signal. A wiring layer is provided on the insulating film. The wiring layering includes a signal wire and a ground wire. A conductive layer is between the wiring layer and the insulating film. The conductive layer, in some embodiments, includes a first conductive region between the high-frequency wiring and the insulating film and a second conductive region between the grounding wiring and the insulating film.
    Type: Application
    Filed: March 3, 2016
    Publication date: January 5, 2017
    Inventor: Atsushi ISHIMARU
  • Publication number: 20160190231
    Abstract: According to an embodiment, a semiconductor switch includes a first insulating film on a semiconductor substrate, a first semiconductor layer on the first insulating film, a semiconductor switch circuit on the first semiconductor layer, and a wiring on the first insulating film. The first insulating film being between the wiring and the substrate. The wiring connects the semiconductor switch circuit and a terminal. A polycrystalline semiconductor layer is between the wiring and the first insulating film.
    Type: Application
    Filed: September 1, 2015
    Publication date: June 30, 2016
    Inventors: Atsushi ISHIMARU, Masami NAGAOKA
  • Publication number: 20150263721
    Abstract: According to one embodiment, a semiconductor switch circuit includes a semiconductor substrate, an insulating film, a semiconductor layer, a first wiring line, a semiconductor switch unit, and a first conductor. The insulating film is provided on the semiconductor substrate. The semiconductor layer is provided on the insulating film. The first wiring line is provided above the insulating film. The semiconductor switch unit is provided on the semiconductor layer and is electrically connected to the first wiring line. The first conductor is provided between the first wiring line and the semiconductor substrate.
    Type: Application
    Filed: August 29, 2014
    Publication date: September 17, 2015
    Inventors: Atsushi Ishimaru, Keita Masuda
  • Patent number: 7969842
    Abstract: A playback device includes a reading section that performs reading from a recording medium, and a control section that acquires the latest temporary management information recorded last on the recording medium. The control section executes a read control process of controlling the reading section so that when reading pointer information in a temporary management information unit recorded last in a temporary management information unit recording area, reading of data is executed from a predetermined position located before a segment in which the pointer information is included, and an information acquiring process of executing a process for acquiring the temporary management information pointed to by the pointer information from the data read in response to the read control process.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: June 28, 2011
    Assignee: Sony Corporation
    Inventors: Masaaki Yamamoto, Atsushi Ishimaru, Kenji Yorimoto
  • Publication number: 20080304383
    Abstract: A playback device includes a reading section that performs reading from a recording medium, and a control section that acquires the latest temporary management information recorded last on the recording medium. The control section executes a read control process of controlling the reading section so that when reading pointer information in a temporary management information unit recorded last in a temporary management information unit recording area, reading of data is executed from a predetermined position located before a segment in which the pointer information is included, and an information acquiring process of executing a process for acquiring the temporary management information pointed to by the pointer information from the data read in response to the read control process.
    Type: Application
    Filed: March 21, 2008
    Publication date: December 11, 2008
    Applicant: Sony Corporation
    Inventors: Masaaki YAMAMOTO, Atsushi Ishimaru, Kenji Yorimoto
  • Patent number: 7344077
    Abstract: The present invention has been made to adequately and quickly adjust the spherical aberration and focus bias in an optical pickup. In the present invention, evaluation values are measured on a plurality of respective measurement points each determined by a combination of a spherical aberration correction value and focus bias value and a two-variable function having the spherical aberration correction value and focus bias value as variables is approximated to the evaluation values. Based on the two-variable function obtained by the approximation, the optimal value of the spherical aberration correction value and focus bias value on which the evaluation value becomes optimal is calculated. As a result, it is possible to adequately and quickly adjust the spherical aberration and focus bias in an optical pickup.
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: March 18, 2008
    Assignee: Sony Corporation
    Inventors: Seiichi Sagara, Atsushi Ishimaru
  • Publication number: 20060164949
    Abstract: The present invention has been made to adequately and quickly adjust the spherical aberration and focus bias in an optical pickup. In the present invention, evaluation values are measured on a plurality of respective measurement points each determined by a combination of a spherical aberration correction value and focus bias value and a two-variable function having the spherical aberration correction value and focus bias value as variables is approximated to the evaluation values. Based on the two-variable function obtained by the approximation, the optimal value of the spherical aberration correction value and focus bias value on which the evaluation value becomes optimal is calculated. As a result, it is possible to adequately and quickly adjust the spherical aberration and focus bias in an optical pickup.
    Type: Application
    Filed: December 30, 2005
    Publication date: July 27, 2006
    Applicant: Sony Corporation
    Inventors: Seiichi Sagara, Atsushi Ishimaru
  • Patent number: D307092
    Type: Grant
    Filed: November 24, 1987
    Date of Patent: April 10, 1990
    Assignee: Twinbird Industrial Company Limited
    Inventor: Atsushi Ishimaru
  • Patent number: D316666
    Type: Grant
    Filed: October 3, 1989
    Date of Patent: May 7, 1991
    Assignee: Twinbird Industrial Company Limited
    Inventor: Atsushi Ishimaru
  • Patent number: D317981
    Type: Grant
    Filed: February 15, 1989
    Date of Patent: July 9, 1991
    Assignee: Twinbird Industrial Company Limited
    Inventor: Atsushi Ishimaru