Abstract: A method for producing an epoxy compound by reacting a compound having a carbon-carbon double bond with hydrogen peroxide in the coexistence of the compound having a carbon-carbon double bond, aqueous hydrogen peroxide, a powder of a solid catalyst support and a powder of a solid catalyst, wherein the solid catalyst comprises an isopolyacid, and the isopolyacid is produced from a catalyst raw material comprising (a) tungstic acid or a salt thereof and (b) at least one selected from the group consisting of a salt of an alkaline earth metal and a cationic polymer.

Abstract: A resin composition prepared by blending an epoxy compound represented by the following formula (1), an acid anhydride, and a curing accelerator, wherein the epoxy compound is purified in such a way that, in a chromatogram obtained by gas chromatographic analysis, a ratio of a peak area B of peaks derived from a heavier molecular mass portion having longer retention times than the epoxy compound to a peak area A of peak(s) derived from the epoxy compound B/A is 2.0×10?3 or less. [In the formula, R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, and R12 each independently represent a hydrogen atom, a halogen atom, an alkyl group which may have a substituent, or an alkoxy group which may have a substituent.].

Abstract: The present invention provides a method for producing an epoxy compound by expoxidation of an olefin compound with good productivity wherein a compound having a carbon-carbon double bond is reacted with hydrogen peroxide in the coexistence of (a) a compound having a carbon-carbon double bond, (b) a hydrogen peroxide solution, (c) a powdered solid catalyst support and (d) a powdered catalyst and optionally (e) an organic solvent, the total mass of (c) and (d) being 100 percent by mass or less on the basis of the total mass of (a), (b) and (e).

Abstract: In order to produce an epoxy compound with a less chlorine content at a higher reaction rate and yield, the present invention provides a method for producing an epoxy compound by reacting a compound having a carbon-carbon double bond with hydrogen peroxide in the coexistence of the compound having a carbon-carbon double bond, the hydrogen peroxide solution, a powdered solid catalyst support and a powdered solid catalyst all together, the solid catalyst comprising isopolyacids produced from (a) tungstic acid or a salt thereof and (b) a quaternary ammonium salt compound and/or a pyridinium salt, selected from halogen-free compounds.

Abstract: The present invention provides a method for producing an alicyclic diepoxy compound at a higher yield by carrying out epoxidation of an alicyclic olefin compound at a higher reaction rate. The method is a method for producing an alicyclic diepoxy compound represented by formula (1) below by reacting an alicyclic olefin compound represented by formula (2) below with hydrogen peroxide in the coexistence of the alicyclic olefin compound represented by formula (2) below, a hydrogen peroxide solution, a powdered solid catalyst support and a powdered solid catalyst all together: wherein R1 to R12 are each hydrogen, halogen, an alkyl group optionally having halogen or an alkoxy group optionally having a substituent.

Abstract: A method is provided for carrying out epoxidation of an olefin compound with good productivity. The method produces an epoxy compound by reacting a compound having a carbon-carbon double bond with hydrogen peroxide by carrying out repeatedly or continuously the following steps: (1) reacting a compound having a carbon-carbon double bond with hydrogen peroxide in the coexistence of (a) the compound having a carbon-carbon double bond, (b) a hydrogen peroxide solution, (c) a powdered solid catalyst support, and (d) a powdered solid catalyst, and optionally further (e) an organic solvent to produce an epoxy compound; (2) separating the epoxy compound reaction product from the reaction mixture produced in (1); and (3) adding (d) and also adding (a), (b), (c), and optionally further (e) to the mixture of the powdered solid catalyst support and powdered solid catalyst after separating the reaction product in (2).

Abstract: A method is provided for carrying out epoxidation of an olefin compound with good productivity. The method produces an epoxy compound by reacting a compound having a carbon-carbon double bond with hydrogen peroxide by carrying out repeatedly or continuously the following steps: (1) reacting a compound having a carbon-carbon double bond with hydrogen peroxide in the coexistence of (a) the compound having a carbon-carbon double bond, (b) a hydrogen peroxide solution, (c) a powdered solid catalyst support, and (d) a powdered solid catalyst, and optionally further (e) an organic solvent to produce an epoxy compound; (2) separating the epoxy compound reaction product from the reaction mixture produced in (1); and (3) adding (d) and also adding (a), (b), (c), and optionally further (e) to the mixture of the powdered solid catalyst support and powdered solid catalyst after separating the reaction product in (2).

Abstract: The present invention provides a method for producing an alicyclic diepoxy compound at a higher yield by carrying out epoxidation of an alicyclic olefin compound at a higher reaction rate. The method is a method for producing an alicyclic diepoxy compound represented by formula (1) below by reacting an alicyclic olefin compound represented by formula (2) below with hydrogen peroxide in the coexistence of the alicyclic olefin compound represented by formula (2) below, a hydrogen peroxide solution, a powdered solid catalyst support and a powdered solid catalyst all together: wherein R1 to R12 are each hydrogen, halogen, an alkyl group optionally having halogen or an alkoxy group optionally having a substituent.

Abstract: In order to produce an epoxy compound with a less chlorine content at a higher reaction rate and yield, the present invention provides a method for producing an epoxy compound by reacting a compound having a carbon-carbon double bond with hydrogen peroxide in the coexistence of the compound having a carbon-carbon double bond, the hydrogen peroxide solution, a powdered solid catalyst support and a powdered solid catalyst all together, the solid catalyst comprising isopolyacids produced from (a) tungstic acid or a salt thereof and (b) a quaternary ammonium salt compound and/or a pyridinium salt, selected from halogen-free compounds.

Abstract: The present invention provides a method for producing an epoxy compound by expoxidation of an olefin compound with good productivity wherein a compound having a carbon-carbon double bond is reacted with hydrogen peroxide in the coexistence of (a) a compound having a carbon-carbon double bond, (b) a hydrogen peroxide solution, (c) a powdered solid catalyst support and (d) a powdered catalyst and optionally (e) an organic solvent, the total mass of (c) and (d) being 100 percent by mass or less on the basis of the total mass of (a), (b) and (e).

Abstract: A resin composition prepared by blending an epoxy compound represented by the following formula (1), an acid anhydride, and a curing accelerator, wherein the epoxy compound is purified in such a way that, in a chromatogram obtained by gas chromatographic analysis, a ratio of a peak area B of peaks derived from a heavier molecular mass portion having longer retention times than the epoxy compound to a peak area A of peak(s) derived from the epoxy compound B/A is 2.0×10?3 or less. [In the formula, R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, and R12 each independently represent a hydrogen atom, a halogen atom, an alkyl group which may have a substituent, or an alkoxy group which may have a substituent.

Abstract: A set associative cache memory includes a tag memory configured to store tags which are predetermined high-order bits of an address, a tag comparator configured to compare a tag in a request address (RA) with the tag stored in the tag memory and a data memory configured to incorporate way information obtained through a comparison by the tag comparator in part of a column address.

Abstract: Systems and methods for the noise analysis of circuits are presented. These systems and methods may allow a circuit or circuit design to be analyzed for possible noise failures in a block of logic caused by sources. outside the block. More particularly, these systems and methods may generate an abstract file for one or more blocks of a circuit. These abstract files may include noise tolerances for input pins and bi-directional pins of a block, along with noise tolerances for those output pins of the block which also feed to an input of one or more gates internal to the block. Using these noise abstracts a unit of the circuit may be analyzed, or the circuit itself may be analyzed for possible noise induced failures.

Abstract: An unsaturated monocarboxylic ester compound has at least two structures represented by the following general formula (1): wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, and R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group. A curable composition comprises (A) the unsaturated monocarboxylic ester compound having two or more structures represented by the general formula (1) mentioned above, (B) a polymerization initiator, and optionally (C) a diluent.

Abstract: A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.

Abstract: A photocurable and thermosetting resin composition comprises (A) an actinic energy ray-curable resin having at least one structure represented by the following general formula (1), (B) a-polymerization initiator, (C) a diluent, and (D) a polyfunctional oxetane compound. The actinic energy ray-curable resin mentioned above can be produced by causing the reaction of (a) a polyfunctional oxetane compound with (b) an unsaturated monocarboxylic acid and the subsequent reaction of (c) a polybasic acid anhydride with a primary hydroxyl group of the resultant modified oxetane resin (a?). wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group, and X represents a polybasic acid anhydride residue.

Abstract: Systems and methods for the noise analysis of circuits are presented. These systems and methods may allow a circuit or circuit design to be analyzed for possible noise failures in a block of logic caused by sources. outside the block. More particularly, these systems and methods may generate an abstract file for one or more blocks of a circuit. These abstract files may include noise tolerances for input pins and bi-directional pins of a block, along with noise tolerances for those output pins of the block which also feed to an input of one or more gates internal to the block. Using these noise abstracts a unit of the circuit may be analyzed, or the circuit itself may be analyzed for possible noise induced failures.

Abstract: A printed circuit board that includes a solder resist has a photocurable and thermosetting resin composition which comprises (A) an actinic energy ray-curable resin having at least one structure represented by the following general formula (1), (B) a polymerization initiator, (C) a diluent, and (D) a polyfunctional oxetane compound. The actinic energy ray-curable resin mentioned above can be produced by causing the reaction of (a) a polyfunctional oxetane compound with (b) an unsaturated monocarboxylic acid and the subsequent reaction of (c) a polybasic acid anhydride with a primary hydroxyl group of the resultant modified oxetane resin (a?). wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group, and X represents a polybasic acid anhydride residue.

Abstract: An unsaturated monocarboxylic ester compound has at least two structures represented by the following general formula (1): wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, and R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group. A curable composition comprises (A) the unsaturated carboxylic ester compound having two or more structures represented by the general formula (1) mentioned above, (B) a polymerization initiator, and optionally (C) a diluent.

Abstract: An unsaturated monocarboxylic ester compound has at least two structures represented by the following general formula (1): wherein R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, and R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group. A curable composition comprises (A) the unsaturated monocarboxylic ester compound having two or more structures represented by the general formula (1) mentioned above, (B) a polymerization initiator, and optionally (C) a diluent.