Abstract: A ring network has first and second network connecting offices for connecting ring networks together and for dropping a signal from a terminal office. Each node of the ring network recognizes whether it is the first network connecting office based upon channel setting information. A first node, which has been recognized as being the first network connecting office, executes a squelch-table creation procedure between itself and other nodes based upon the channel setting information, thereby identifying a second node, which is the second network connecting office. The first node embeds office identification information in a squelch table of a protection channel and sends this information to the second node. The second node recognizes that it itself is the second network connecting office based upon the office identification information.

Abstract: A semiconductor device has, in one embodiment, two wells of different conductivity types formed in a semiconductor substrate. The two wells are arranged to be adjacent to each other to form a junction therebetween. A field oxide film is formed to cover the junction at a main surface of the semiconductor substrate. Other field oxide films or field-shield isolation structures may be formed to isolate circuit elements from one another in the wells.

Abstract: A semiconductor device has, in one embodiment, two wells of different conductivity types formed in a semiconductor substrate. The two wells are arranged to be adjacent to each other to form a junction therebetween. A field oxide film is formed to cover the junction at a main surface of the semiconductor substrate. Other field oxide films or field-shield isolation structures may be formed to isolate circuit elements from one another in the wells.

Abstract: A semiconductor device has, in one embodiment, two wells of different conductivity types formed in a semiconductor substrate. The two wells are arranged to be adjacent to each other to form a junction therebetween. A field oxide film is formed to cover the junction at a main surface of the semiconductor substrate. Other field oxide films or field-shield isolation structures may be formed to isolate circuit elements from one another in the wells.

Abstract: A photoelectric transducer device including a plurality of sensor elements made up of photodiodes and blocking diodes on a substrate, connected into a linear pattern which extends in a primary scanning direction, the sensor elements to be driven in a suitable sequence to read image data from an original document. Each sensor element include a first lower electrode formed on the substrate, a second lower electrode, formed on the substrate and electrically separated from the first electrode, a photodiode formed on the first electrode, a blocking diode formed on the second electrode for preventing crosstalk, and an upper electrode formed on the photodiode and blocking diode for electrically connecting them. Lead wires for connecting the sensor elements to output circuits extend in the primary scanning direction on the first lower electrodes with an insulating film in between, the first lower electrodes being selectively connected to the lead wires through holes provided in the insulating film.

Abstract: A clinical thermometer which employs an infrared sensor and is constructed so as to prevent the occurrence of a temperature measurement error caused by a change in temperature of a tip portion (of a housing a temperature measuring portion) during temperature measurement. In one embodiment a heat insulator is attached to the tip portion to prevent a rise in temperature of the tip portion. In a second embodiment, the tip portion is formed of a metal of good heat conductivity in the shape of a net for example to improve the heat radiating property of the tip portion, thereby preventing a rise in temperature of the tip portion. In a third embodiments, a temperature sensor is attached to the tip portion to correct a temperature measurement error caused by a change in temperature of the tip portion.

Abstract: A self-alignment process for the fabrication of an array formed from a plurality of micron-scale solid state circuit elements operatively disposed upon a large area substrate. By the instant process electrical contact may be established with the upper electrode of the micron-scale solid state circuit elements without the necessity of masking.

Abstract: Sonde apparatus for a blast furnace whose wall is provided with a lance ingress and egress port through which a lance is able to enter into the furnace and withdraw therefrom wherein a gas check valve, lance cutting means, lance cooling means, lance straightening means, and gas seal means are provided in succession and in communication with one another, and drive means for inserting and withdrawing the lance is further provided in succession therewith, all said elements being arranged along a line which is an extension of the axis of the lance ingress and egress port.

Abstract: A variable resistor having a short-circuiting member which is displaced in response to the generation of abnormally high heat in the resistance member of the variable resistor with a piece thereof in contact to short-circuit the input and output terminals of the resistance member. This results in a bypass for large current, so that a protection circuit in an output amplifier is operated to suspend the generation of heat.

Abstract: A fader controlling variable resistor adapted to adjust the balance in sound volume of the right and left loudspeakers, or the front and rear loudspeakers. When abnormal heat is generated in a variable resistor in a fader control circuit, the sliding piece of the variable resistor is disconnected from the resistance member by the utilization of a thermo-plastic resin of a low-melting-point material is readily deformed or molten by heat, to prevent a fire attributed to the generation of heat therein. In one embodiment of the invention, the sliding piece is maintained in contact with the resistance member against its elastic force by a protrusion of thermo-plastic resin. When abnormally high heat is generated in the variable resistor, the protrusion is molten, and the sliding piece is disconnected from the resistance member or the conductor.