Patents by Inventor Atsushi Nagahori

Atsushi Nagahori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5039844
    Abstract: A process for producing a PTC device comprising the steps of forming a laminate comprising a PTC composition and at least two electrode plates having the PTC composition sandwiched therebetween, opposing the surface of a lead plate to be electrically connected to each of the electrodes, to the surface of each of the electrode plates of the laminate while contacting at a narrow area, and then passing a current between the electrode and the lead via the narrow contact surface to weld them. By this process, there is obtained a PTC device having, at a portion of the joining interface between each electrode plate and each lead plate, a nugget formed by melting both the plates. This PTC device has a low contact resistance between the PTC composition and the electrode plates.
    Type: Grant
    Filed: September 29, 1988
    Date of Patent: August 13, 1991
    Assignee: Nippon Mektron, Ltd.
    Inventor: Atsushi Nagahori
  • Patent number: 4876439
    Abstract: A PTC device with a laminate having a PTC composition and at least two electrode plates having the PTC composition sandwiched therebetween, superposing, on the surface of each of the electrode plates of the laminate, a lead plate to be electrically connected to the electrode, joining the electrode plate and the lead plate by spot welding, and during or prior to the spot welding process, forming at least one through hole penetrating through the electrode plate and the lead plate in the center of a weld.
    Type: Grant
    Filed: July 18, 1988
    Date of Patent: October 24, 1989
    Assignee: Nippon Mektron, Ltd.
    Inventor: Atsushi Nagahori
  • Patent number: 4787135
    Abstract: A process for producing a PTC device comprising the steps of forming a laminate comprising a PTC composition and at least two electrode plates having the PTC composition sandwiched therebetween, opposing the surface of a lead plate to be electrically connected to each of the electrodes, to the surface of each of the electrode plates of the laminate while contacting at a narrow area, and then passing a current between the electrode and the lead via the narrow contact surface to weld them. By this process, there is obtained a PTC device having, at a portion of the joining interface between each electrode plate and each lead plate, a nugget formed by melting both the plates. This PTC device has a low contact resistance between the PTC composition and the electrode plates.
    Type: Grant
    Filed: February 26, 1987
    Date of Patent: November 29, 1988
    Assignee: Nippon Mektron, Ltd.
    Inventor: Atsushi Nagahori
  • Patent number: 4769901
    Abstract: A process for producing a PTC device comprising the steps of forming a laminate comprising a PTC composition and at least two electrode plates having the PTC composition sandwiched therebetween, superposing, on the surface of each of the electrode plates of the laminate, a lead plate to be electrically connected to the electrode, joining the electrode plate and the lead plate by spot welding, and during or prior to the spot welding process, forming at least one through hole penetrating through the electrode plate and the lead plate in the center of a weld. This process can minimize the heat damage of the PTC composition and the resulting PTC device has a low contact resistance.
    Type: Grant
    Filed: February 26, 1987
    Date of Patent: September 13, 1988
    Assignee: Nippon Mektron, Ltd.
    Inventor: Atsushi Nagahori