Patents by Inventor Atsushi Onodera
Atsushi Onodera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10598235Abstract: To reduce abnormal noise production in a friction brake structure, the friction brake structure includes: a brake plate (20) fixed to a rotating shaft (15) of a rotary electric machine (1); a ring-shaped brake shoe (30) disposed facing the brake plate; and a brake shoe support plate (40) which engages with a fixing portion of the rotary electric machine so as to be movable in an axial direction, and which supports the brake shoe and is biased by biasing action so as to bring the brake shoe into sliding contact with the brake plate.Type: GrantFiled: December 21, 2015Date of Patent: March 24, 2020Assignee: Oriental Motor Co., Ltd.Inventor: Atsushi Onodera
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Publication number: 20170370429Abstract: To reduce abnormal noise production in a friction brake structure, the friction brake structure includes: a brake plate 20 fixed to a rotating shaft 15 of a rotary electric machine 1; a ring-shaped brake shoe 30 disposed facing the brake plate; and a brake shoe support plate 40 which engages with a fixing portion of the rotary electric machine so as to be movable in an axial direction, and which supports the brake shoe and is biased by biasing action so as to bring the brake shoe into sliding contact with the brake plate.Type: ApplicationFiled: December 21, 2015Publication date: December 28, 2017Inventor: Atsushi ONODERA
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Patent number: 9288913Abstract: A wiring board includes a variable wettability layer situated on a top surface of a support board and containing a material of which a critical surface tension changes by energy given thereto. A conductive layer is situated inside a concave portion formed in the variable wettability layer. The concave portion has opposite side walls formed in tapered surfaces inclining so that a distance between the side walls is reduced toward a bottom of the concave portion in a cross-sectional shape taken along a plane perpendicular to a conducting direction of the conductive layer. Upper edges of the side walls are formed in gently curved surfaces.Type: GrantFiled: June 30, 2014Date of Patent: March 15, 2016Assignee: RICOH COMPANY, LTD.Inventors: Hiroshi Miura, Koei Suzuki, Atsushi Onodera, Takanori Tano
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Patent number: 9153524Abstract: A method of forming a stacked-layer wiring includes forming first wettability variable layer on a substrate using material that changes surface energy by energy application; forming first conductive layer in or on the first wettability variable layer; forming second wettability variable layer on the first wettability variable layer using material that changes surface energy by energy application; forming concave portion to become wiring pattern of second conductive layer to the second wettability variable layer while concurrently forming high surface energy area on surface exposed by forming the concave portion by changing surface energy; forming via hole by exposing a part of the first conductive layer while concurrently forming high surface energy area on surface exposed by forming the via hole by changing surface energy; and applying conductive ink to the high surface energy area to form the second conductive layer and via simultaneously.Type: GrantFiled: July 1, 2014Date of Patent: October 6, 2015Assignee: RICOH COMPANY, LTD.Inventors: Koei Suzuki, Takanori Tano, Hiroshi Miura, Atsushi Onodera
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Publication number: 20150008589Abstract: A method of forming a stacked-layer wiring includes forming first wettability variable layer on a substrate using material that changes surface energy by energy application; forming first conductive layer in or on the first wettability variable layer; forming second wettability variable layer on the first wettability variable layer using material that changes surface energy by energy application; forming concave portion to become wiring pattern of second conductive layer to the second wettability variable layer while concurrently forming high surface energy area on surface exposed by forming the concave portion by changing surface energy; forming via hole by exposing a part of the first conductive layer while concurrently forming high surface energy area on surface exposed by forming the via hole by changing surface energy; and applying conductive ink to the high surface energy area to form the second conductive layer and via simultaneously.Type: ApplicationFiled: July 1, 2014Publication date: January 8, 2015Applicant: RICOH COMPANY, LTD.Inventors: Koei SUZUKI, Takanori TANO, Hiroshi MIURA, Atsushi ONODERA
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Publication number: 20150008019Abstract: A wiring board includes a variable wettability layer situated on a top surface of a support board and containing a material of which a critical surface tension changes by energy given thereto. A conductive layer is situated inside a concave portion formed in the variable wettability layer. The concave portion has opposite side walls formed in tapered surfaces inclining so that a distance between the side walls is reduced toward a bottom of the concave portion in a cross-sectional shape taken along a plane perpendicular to a conducting direction of the conductive layer. Upper edges of the side walls are formed in gently curved surfaces.Type: ApplicationFiled: June 30, 2014Publication date: January 8, 2015Applicant: RICOH COMPANY, LTD.Inventors: Hiroshi MIURA, Koei SUZUKI, Atsushi ONODERA, Takanori TANO
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Patent number: 8877584Abstract: A method of manufacturing an interconnection member includes forming on a substrate a wettability changing layer containing a material in which critical surface tension is changed by giving energy; forming a depression part in the wettability changing layer by a laser ablation method using a laser of an ultraviolet region; and coating the depression part with an electrically conductive ink to form an electrically conductive part. At the same time when a pattern of the depression part is formed in the wettability changing layer, a pattern of a high surface energy area is formed as a result of the critical surface tension being changed.Type: GrantFiled: May 22, 2012Date of Patent: November 4, 2014Assignee: Ricoh Company, Ltd.Inventors: Koei Suzuki, Haruo Nakamura, Atsushi Onodera, Takanori Tano, Hiroshi Miura
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Patent number: 8847394Abstract: A disclosed laminated structure includes a wettability-variable layer containing a wettability-variable material whose surface energy changes when energy is applied thereto and including at least a high-surface-energy area having high surface energy and a low-surface-energy area having low surface energy; and a conductive layer formed on the high-surface-energy area. The high-surface-energy area includes a first area and a second area extending from the first area and having a width smaller than that of the first area.Type: GrantFiled: July 12, 2011Date of Patent: September 30, 2014Assignee: Ricoh Company, Ltd.Inventors: Atsushi Onodera, Hidenori Tomono, Koei Suzuki, Takanori Tano, Takumi Yamaga
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Patent number: 8779434Abstract: A thin film transistor array is disclosed. The thin film transistor array includes plural gate electrodes formed on an insulation substrate, plural source electrodes formed above or under the gate electrodes via a gate insulation film so that the source electrodes cross the gate electrodes in a planar view, plural drain electrodes formed at corresponding positions surrounded by the gate electrodes and the source electrodes in a planar view in the same layer as that of the source electrodes, semiconductor layers formed via the gate insulation film to face the gate electrodes for forming corresponding channel regions between the source electrodes and the drain electrodes. The plural gate electrodes are linearly formed, and the channel regions are disposed to face the gate electrodes.Type: GrantFiled: October 6, 2008Date of Patent: July 15, 2014Assignee: Ricoh Company, Ltd.Inventors: Takao Inoue, Takumi Yamaga, Atsushi Onodera
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Patent number: 8723193Abstract: A multiple-layer wiring substrate having a first conductive layer; an interlayer insulating layer; and a second conductive layer is disclosed, wherein the interlayer insulating layer includes a material whose surface energy is changed by receiving energy, and has a first region which does not include a contact hole and a second region which is formed such that its surface energy is higher than that of the first region, wherein a region within the contact hole of the first conductive layer has surface energy which is higher than surface energy of the second region of the interlayer insulating layer, and wherein the second conductive layer is formed by laminating, wherein the second conductive layer is in contact with the second region of the interlayer insulating layer along the second region, and is connected to the first conductive layer via the contact hole.Type: GrantFiled: September 13, 2012Date of Patent: May 13, 2014Assignee: Ricoh Company, Ltd.Inventors: Atsushi Onodera, Koei Suzuki, Hiroshi Miura, Takanori Tano
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Patent number: 8614142Abstract: A method for manufacturing a laminated structure includes a step of supplying a droplet of a functional fluid selectively to at least a first region of a high surface energy area formed in a wettability variable layer of the laminated structure. In the step, the droplet is supplied by inkjet printing, and a center position of the droplet is determined in such a manner as to satisfy both Equations (1) and (2) below: X<±(L+2S?D?2?)/2 (here, L+2S>D+2?) ??(1) X<±(L+D?2?)/2 (here, L+2D>D+2?) ??(2), where X is a distance between a center position of the first region and the center position of the droplet, D is a diameter of the droplet when travelling, ? is variation in a landing position of the droplet, L is width of the first region, and S is a gap between the first and the second regions.Type: GrantFiled: March 3, 2011Date of Patent: December 24, 2013Assignee: Ricoh Company, Ltd.Inventors: Atsushi Onodera, Hidenori Tomono, Koei Suzuki
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Patent number: 8598570Abstract: An organic transistor array includes gate electrodes provided on a substrate, source and drain electrodes provided above or below the gate electrodes via a gate insulator layer, and an organic semiconductor layer opposing the gate electrodes via the gate insulator layer, and forming a channel region between mutually adjacent source and drain electrodes. The organic transistor array in a plan view is sectioned into sections each forming a single pixel, and each section has a closest packed structure.Type: GrantFiled: June 24, 2009Date of Patent: December 3, 2013Assignee: Ricoh Company, Ltd.Inventors: Keiichiro Yutani, Takumi Yamaga, Atsushi Onodera
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Patent number: 8529425Abstract: A horizontal centrifugal separator is configured such that a groove formed along a joint surface between an upper casing and a lower casing constituting the casing is outwardly bent near an opening of the casing, and that an elastic sealing member is disposed in the groove and an end portion thereof abuts against a sealing surface provided on a ring member which is provided so as to surround the outer circumference of the opening of the casing and is pressed against the casing. In this case, surface sealing is constituted by the end portion of the elastic sealing member and the sealing surface of the ring member. In this manner, the hermeticity can be improved without using a sealing member having a complicated structure.Type: GrantFiled: December 7, 2007Date of Patent: September 10, 2013Assignee: Tomoe Engineering Co., Ltd.Inventors: Atsushi Onodera, Keishiro Yamazaki
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Publication number: 20130069087Abstract: A multiple-layer wiring substrate having a first conductive layer; an interlayer insulating layer; and a second conductive layer is disclosed, wherein the interlayer insulating layer includes a material whose surface energy is changed by receiving energy, and has a first region which does not include a contact hole and a second region which is formed such that its surface energy is higher than that of the first region, wherein a region within the contact hole of the first conductive layer has surface energy which is higher than surface energy of the second region of the interlayer insulating layer, and wherein the second conductive layer is formed by laminating, wherein the second conductive layer is in contact with the second region of the interlayer insulating layer along the second region, and is connected to the first conductive layer via the contact hole.Type: ApplicationFiled: September 13, 2012Publication date: March 21, 2013Applicant: RICOH COMPANY, LTD.Inventors: Atsushi ONODERA, Koei Suzuki, Hiroshi Miura, Takanori Tano
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Publication number: 20120312583Abstract: A method of manufacturing an interconnection member includes forming on a substrate a wettability changing layer containing a material in which critical surface tension is changed by giving energy; forming a depression part in the wettability changing layer by a laser ablation method using a laser of an ultraviolet region; and coating the depression part with an electrically conductive ink to form an electrically conductive part. At the same time when a pattern of the depression part is formed in the wettability changing layer, a pattern of a high surface energy area is formed as a result of the critical surface tension being changed.Type: ApplicationFiled: May 22, 2012Publication date: December 13, 2012Applicant: RICOH COMPANY, LTD.Inventors: Koei SUZUKI, Haruo NAKAMURA, Atsushi ONODERA, Takanori TANO, Hiroshi MIURA
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Patent number: 8263969Abstract: A laminated structure includes a wettability variable layer formed on a substrate, including a material whose critical surface tension varies by receiving energy so that high and low surface energy regions are formed; a conductive layer formed in one of the high surface energy regions; and an insulating layer formed in such a manner as to cover the conductive layer, wherein another one of the high surface energy regions is formed in such a manner as to surround a periphery of a circuit formation region in which a plurality of the conductive layers are formed; and the insulating layer is formed in such a manner as to also cover the another one of the high surface energy regions so that an adhesive guard ring region is formed between the wettability variable layer and the insulating layer.Type: GrantFiled: April 23, 2009Date of Patent: September 11, 2012Assignee: Ricoh Company, Ltd.Inventors: Koei Suzuki, Takanori Tano, Atsushi Onodera
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Patent number: 8253137Abstract: A laminate structure is disclosed that has a region having high surface free energy and a region having low surface free energy that are well separated, has high adhesiveness between an underlying layer and a conductive layer, and can be formed easily with low cost. The laminate structure includes a wettability-variable layer including a first surface free energy region of a first film thickness and a second surface free energy region of a second film thickness, and a conductive layer formed on the second surface free energy region of the wettability-variable layer. The second film thickness is less than the first film thickness and the surface free energy of the second surface free energy region is made higher than the surface free energy of the first surface free energy region by applying a predetermined amount of energy on the second surface free energy region.Type: GrantFiled: July 15, 2008Date of Patent: August 28, 2012Assignee: Ricoh Company, Ltd.Inventors: Takanori Tano, Atsushi Onodera, Koei Suzuki, Hidenori Tomono
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Patent number: 8101945Abstract: A disclosed laminated structure includes a wettability variable layer containing a wettability variable material whose surface energy changes when energy is applied thereto and including at least a high surface energy area having high surface energy and a low surface energy area having low surface energy; and a conductive layer disposed on the high surface energy area. The conductive layer includes a first high surface energy area, a second high surface energy area smaller in width than the first high surface energy area, and a third high surface energy area smaller in width than the second high surface energy area. The first high surface energy area and the second high surface energy area are connected by the third high surface energy area.Type: GrantFiled: September 17, 2008Date of Patent: January 24, 2012Assignee: Ricoh Company, Ltd.Inventors: Atsushi Onodera, Hidenori Tomono
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Publication number: 20110266549Abstract: A disclosed laminated structure includes a wettability-variable layer containing a wettability-variable material whose surface energy changes when energy is applied thereto and including at least a high-surface-energy area having high surface energy and a low-surface-energy area having low surface energy; and a conductive layer formed on the high-surface-energy area. The high-surface-energy area includes a first area and a second area extending from the first area and having a width smaller than that of the first area.Type: ApplicationFiled: July 12, 2011Publication date: November 3, 2011Inventors: Atsushi ONODERA, Hidenori Tomono, Koei Suzuki, Takanori Tano, Takumi Yamaga
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Publication number: 20110215336Abstract: A method for manufacturing a laminated structure includes a step of supplying a droplet of a functional fluid selectively to at least a first region of a high surface energy area formed in a wettability variable layer of the laminated structure. In the step, the droplet is supplied by inkjet printing, and a center position of the droplet is determined in such a manner as to satisfy both Equations (1) and (2) below: X<±(L+2S?D?2?)/2 (here, L+2S>D+2?) ??(1) X<±(L+D?2?)/2 (here, L+2D>D+2?) ??(2), where X is a distance between a center position of the first region and the center position of the droplet, D is a diameter of the droplet when travelling, ? is variation in a landing position of the droplet, L is width of the first region, and S is a gap between the first and the second regions.Type: ApplicationFiled: March 3, 2011Publication date: September 8, 2011Applicant: RICOH COMPANY, LTD.Inventors: Atsushi Onodera, Hidenori Tomono, Koei Suzuki