Patents by Inventor Atsushi Sakai

Atsushi Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11977009
    Abstract: An analysis device of an embodiment is an analysis device of an active material layer of an electrode of a secondary battery, and includes a processor configured to execute a program to acquire image data that represents active materials in the active material layer processed by ion milling and voids or fillings between the active materials by a difference in brightness, and compare patterns of the difference in brightness between the image data in at least two different states of the active material layer.
    Type: Grant
    Filed: August 25, 2022
    Date of Patent: May 7, 2024
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Atsushi Sakurai, Hideki Sakai, Tatsuya Hattori, Yuji Isogai
  • Publication number: 20240146161
    Abstract: A magnetic geared electrical machine includes: a stator; a magnetic pole piece rotor including a plurality of magnetic pole pieces disposed radially inward of the stator; an inner rotor including a plurality of rotor magnets, disposed radially inward of the plurality of magnetic pole pieces, and configured to rotate at a higher speed than the magnetic pole piece rotor; and a fan for cooling at least one of the stator, the magnetic pole piece rotor, or the inner rotor. The magnetic pole piece rotor further includes a power transmission shaft disposed on one side in an axial direction relative to the plurality of magnetic pole pieces, and configured to transmit rotational power to and from an external device. The fan is disposed in the inner rotor on an opposite side to the power transmission shaft with the rotor magnet therebetween in the axial direction.
    Type: Application
    Filed: June 14, 2022
    Publication date: May 2, 2024
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Masayuki SAKAI, Yasutaka AOKI, Akihiko UMEDA, Atsushi YUGE
  • Patent number: 11973002
    Abstract: A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: April 30, 2024
    Assignee: Denka Company Limited
    Inventors: Atsushi Sakai, Masaya Yumiba, Kentaro Nakayama, Yoshitaka Taniguchi
  • Publication number: 20240113218
    Abstract: A first trench extending in a Y direction is formed in each of a semiconductor substrate located in a cell region and the semiconductor substrate located in an outer peripheral region. A second trench is formed in the semiconductor substrate in the outer peripheral region so as to surround the cell region in a plan view. A p-type body region is formed in the semiconductor substrate in each region. A plurality of p-type floating regions is formed in the semiconductor substrate in the outer peripheral region. A field plate electrode is formed at a lower portion of each of the first trench and the second trench. A gate electrode is formed at an upper portion of the first trench located in the cell region. A floating gate electrode is formed at an upper portion of each of the first trench located in the outer peripheral region and the second trench.
    Type: Application
    Filed: July 17, 2023
    Publication date: April 4, 2024
    Inventors: Tomoya NISHIMURA, Atsushi SAKAI, Katsumi EIKYU
  • Patent number: 11942495
    Abstract: A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: March 26, 2024
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Daisuke Chino, Hiroyuki Shigeta, Shigekazu Ishii, Koyo Hosokawa, Hirohisa Yasukawa, Mitsuhito Kanatake, Kosuke Hareyama, Yutaka Ootaki, Kiyohisa Sakai, Atsushi Tsukada, Hirotaka Kobayashi, Ninao Sato, Yuki Yamane
  • Publication number: 20240097546
    Abstract: A magnetic geared electrical machine includes: a stator including a stator coil; a first rotor including a plurality of pole pieces; a second rotor including a plurality of rotor magnets, and arranged opposite to the stator across the first rotor in a radial direction; a housing having a first inlet opening and a second inlet opening, and supporting the stator; a first inlet cavity defined by at least the housing so as to communicate with the first inlet opening provided in the housing and with a first radial gap between the stator and the first rotor; and a second inlet cavity defined by at least the housing so as to communicate with the second inlet opening provided in the housing and with a second radial gap between the first rotor and the second rotor.
    Type: Application
    Filed: January 25, 2022
    Publication date: March 21, 2024
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Masayuki Sakai, Yasutaka Aoki, Atsushi Yuge, Takatoshi Matsushita
  • Patent number: 11934123
    Abstract: A fixing device includes a fixing belt, a pressing roller and a heating part. The heating part includes a heater, a plurality of temperature sensors, a heater holding member and a sensor holding member. The sensor holding member holds the temperature sensors between the heater holding member and the sensor holding member. The heater holding member has observation holes through which the heater is exposed. The heater holding member has a guide part which positions the sensor holding member with respect to the heater holding member. The sensor holding member has an engagement part engaged with the guide part. The sensor holding member holds each of the temperature sensors at a position corresponding to each of the observation holes by engagement of the engagement part with the guide part.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: March 19, 2024
    Assignee: KYOCERA Document Solutions Inc.
    Inventors: Atsushi Kohama, Yuhiro Sakai
  • Publication number: 20240084106
    Abstract: Provided is a kneaded material including an ultraviolet absorbing agent that contains at least one compound selected from a compound represented by Formula (1) or a compound represented by Formula (2), and a polymer compound.
    Type: Application
    Filed: November 1, 2023
    Publication date: March 14, 2024
    Applicant: FUJIFILM Corporation
    Inventors: Daisuke SASAKI, Yusuke SAKAI, Atsushi AZUMA
  • Publication number: 20240067846
    Abstract: Provided are a photopolymerizable composition including at least one compound selected from a compound represented by Formula (1) or a compound represented by Formula (2), a polymerizable compound, and a photopolymerization initiator, and a cured substance and an optical member which are formed of the photopolymerizable composition.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 29, 2024
    Applicant: FUJIFILM Corporation
    Inventors: Daisuke SASAKI, Yusuke SAKAI, Ryoji ORITA, Atsushi AZUMA
  • Publication number: 20240055301
    Abstract: A semiconductor device includes a cell region in which MISFETs are formed, and a peripheral region surrounding the cell region in plan view. In the cell region and the peripheral region, an n-type impurity region is formed in a semiconductor substrate. In the semiconductor substrate, an element isolation portion, a p-type impurity region, and an n-type impurity region are formed in the peripheral region so as to surround the cell region in plan view. A p-type impurity region and an n-type impurity region are formed in the semiconductor substrate in the cell region so as to contact the impurity region. The element isolation portion is located in the impurity region and is spaced apart from a junction interface between the impurity region and the impurity region.
    Type: Application
    Filed: June 16, 2023
    Publication date: February 15, 2024
    Inventors: Yudai HIGA, Atsushi SAKAI, Yotaro GOTO
  • Publication number: 20230369414
    Abstract: Semiconductor device has a cell region and a peripheral region, and has a drift layer, a trench, an gate dielectric film on an inner wall of the trench, a gate electrode, and a p-type first semiconductor region below the trench in the cell region on a semiconductor substrate. Further, in the peripheral region on the semiconductor substrate, p-type second semiconductor region is formed in the same layer as the p-type first semiconductor region. a width of the p-type first semiconductor region and a width of the p-type second semiconductor region are different.
    Type: Application
    Filed: July 25, 2023
    Publication date: November 16, 2023
    Inventors: Atsushi SAKAI, Katsumi EIKYU, Yasuhiro OKAMOTO, Kenichi HISADA, Nobuo MACHIDA
  • Patent number: 11808855
    Abstract: An optical device includes a light source provided with a plurality of surface-emitting laser elements to emit a laser beam, a scanner to scan the laser beam emitted from the light source, and an optical system disposed in an optical path between the light source and the scanner and to guide the laser beam to the scanner. The optical system includes a first optical element to control a divergence angle of the laser beam emitted from the light source and a second optical element to concentrate the laser beam that has passed through the first optical element onto a to-be-scanned surface of the scanner.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: November 7, 2023
    Assignee: RICOH COMPANY, LTD.
    Inventors: Toshiyuki Ikeoh, Yasufumi Yamada, Atsushi Sakai, Naoto Jikutani, Tsuyoshi Ueno, Nobunari Tsukamoto, Tadashi Nakamura, Kazuma Izumiya, Shuichi Suzuki
  • Publication number: 20230340263
    Abstract: A polyimide resin composition having a polyimide resin (A) and a polyether sulfone resin (B), wherein the polyimide resin (A) comprises a repeating structural unit of formula (1) and a repeating structural unit of formula (2), a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %, and a mass ratio of the component (A) to the component (B), [(A)/(B)], is 0.1/99.9 to 65/35; and a molded article containing the same: where R1 represents a divalent group of 6 to 22 carbon atoms with an alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group of 5 to 16 carbon atoms; and X1 and X2 each independently represent a tetravalent group of 6 to 22 carbon atoms and having an aromatic ring.
    Type: Application
    Filed: September 10, 2021
    Publication date: October 26, 2023
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Atsushi SAKAI, Yuuki SATO, Takuya FUKUSHIMA
  • Publication number: 20230335635
    Abstract: A semiconductor device includes a semiconductor substrate, a first source region and a first drain region each formed from an upper surface of the semiconductor substrate, a first gate electrode formed on the semiconductor substrate between the first source region and the first drain region via a first gate dielectric film, a first trench formed in the upper surface of the semiconductor substrate between the first gate dielectric film and the first drain region in a gate length direction, a second trench formed in the upper surface of the semiconductor substrate between the gate dielectric film and the first drain region in the gate length direction, the second trench being shallower than the first trench, and a first dielectric film embedded in the first trench and the second trench. The first trench and the second trench are in contact with each other in a gate width direction.
    Type: Application
    Filed: April 18, 2022
    Publication date: October 19, 2023
    Inventors: Katsumi EIKYU, Atsushi SAKAI, Yotaro GOTO
  • Publication number: 20230266761
    Abstract: A haul vehicle management system includes: a three-dimensional data acquisition unit that acquires three-dimensional data outside an outline of a traveling area where a haul vehicle can travel; and a course data generation unit that generates a traveling course of the haul vehicle on the basis of outer shape data of the haul vehicle and the three-dimensional data, the traveling course being set in the traveling area.
    Type: Application
    Filed: May 10, 2021
    Publication date: August 24, 2023
    Applicant: Komatsu Ltd.
    Inventors: Takashi Hiranaka, Atsushi Sakai, Yuji Kobashi, Kenta Osagawa
  • Publication number: 20230257515
    Abstract: A resin composition containing a liquid crystal polymer (A) and a predetermined polyimide resin (B), wherein the liquid crystal polymer (A) contains at least one repeating structural unit selected from the group consisting of repeating structural units represented by the following formulas (I) to (IV), and a molded article containing the same: wherein a, b, and c represent an average number of repeating structural units.
    Type: Application
    Filed: June 22, 2021
    Publication date: August 17, 2023
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Atsushi SAKAI, Yuuki SATO
  • Publication number: 20230118274
    Abstract: A semiconductor device includes a cell region in which a plurality of unit cells are formed, and an outer peripheral region surrounding the cell region in plan view. Each of the plurality of unit cells includes a semiconductor substrate having a drift region, a body region, a source region, a pair of first column regions, and a gate electrode formed in a trench with a gate insulating film interposed therebetween. A well region is formed on a surface of the drift region in the outer peripheral region. A second column region is formed in the drift region below the well region and extends in Y and X directions so as to surround the cell region. The well region is connected to the body region, and the second column region is connected to the well region.
    Type: Application
    Filed: August 12, 2022
    Publication date: April 20, 2023
    Inventors: Yuta NABUCHI, Katsumi EIKYU, Atsushi SAKAI, Akihiro SHIMOMURA, Satoru TOKUDA
  • Publication number: 20230112550
    Abstract: A semiconductor device and a method of manufacturing the same capable of ensuring a sufficient breakdown voltage near a terminal end portion of a cell portion are provided. The cell portion includes a first cell column region and a second cell column region adjacent to each other, and a first cell trench gate and a second cell trench gate arranged between the first cell column region and the second cell column region. An outer peripheral portion includes an outer peripheral trench gate connected to an end portion of each of the first cell trench gate and the second cell trench gate, and a first outer peripheral column region arranged on the cell portion side with respect to the outer peripheral trench gate and extended across the first cell trench gate and the second cell trench gate in plan view.
    Type: Application
    Filed: August 11, 2022
    Publication date: April 13, 2023
    Inventors: Yuta NABUCHI, Hiroshi YANAGIGAWA, Katsumi EIKYU, Atsushi SAKAI
  • Publication number: 20230111142
    Abstract: A semiconductor device includes a plurality of unit cells. Each of the plurality of unit cells has a pair of column regions, a pair of trenches formed between the pair of column regions in the X direction, and a pair of gate electrodes formed in the pair of trenches via a gate insulating film, respectively. The two unit cells adjacent in the X direction share one column region of the pair of column regions and are arranged to be symmetrical about the shared column region. Here, a distance between the two trenches, which are adjacent with the one column region interposed therebetween, of the trenches in the two adjacent unit cells is different from a distance between the pair of trenches in the one unit cell.
    Type: Application
    Filed: August 11, 2022
    Publication date: April 13, 2023
    Inventors: Katsumi EIKYU, Yuta NABUCHI, Atsushi SAKAI, Akihiro SHIMOMURA, Satoru TOKUDA
  • Publication number: 20230099582
    Abstract: A management system for a transport vehicle includes a storage unit that stores a traveling path outline indicating an outline of a traveling path at a work site and an intersection outline indicating an outline of an intersection at the work site, a designation unit that designates a start point of traveling of the transport vehicle at the work site and an end point of traveling of the transport vehicle, and a connection unit that generates a traveling area outline by connecting the traveling path outline and the intersection outline on the basis of the start point and the end point designated by the designation unit.
    Type: Application
    Filed: March 23, 2021
    Publication date: March 30, 2023
    Applicant: Komatsu Ltd.
    Inventors: Atsushi Sakai, Kazuma Takeda, Kenta Osagawa