Abstract: Exemplary embodiments of the present invention provide a method of manufacturing a piezoelectric device that includes a piezoelectric layer having high crystallinity in which crystal orientation is aligned to a desired direction, a method of manufacturing a ferroelectric device that includes a ferroelectric layer having the similar high crystallinity, and so forth. Exemplary embodiments include an insulating layer composed of SiO2 and so forth and a buffer layer composed of strontium oxide (SrO) and so forth are formed on a substrate such as a silicon single crystal wafer in sequence, and then a lower electrode composed of strontium ruthenate (SRO) is formed on the buffer layer. By forming self-assembled monolayers on the lower electrode, high affinity regions A1 and low affinity regions A2 are formed. Then, piezoelectric layers are selectively formed only on the high affinity regions A1.

Abstract: A device manufacturing method, including: a first process for providing the plural elements on the original substrate via a separation layer in a condition where terminal sections are exposed to a surface on an opposite side to the separation layer; a second process for adhering the surface where the terminal sections of the elements to be transferred on the original substrate are exposed, via conductive adhesive, to a surface of the final substrate on a side where conductive sections for conducting with the terminal sections of the elements are provided; a third process for producing exfoliation in the separation layer between the original substrate and the final substrate; and a fourth process for separating the original substrate from which the transfer of elements has been completed, from the final substrate.

Abstract: Aspects of the invention can provide a method for manufacturing a microstructure, including forming a photosensitive film above a work piece, exposing the photosensitive film, as a first exposure, by irradiating interference light generated by intersecting two laser beams having a wavelength shorter than a wavelength of visible light, developing the exposed photosensitive film so as to develop a shape corresponding to a pattern of the interference light to the photosensitive film, and etching the work piece using the developed photosensitive film as an etching mask.

Abstract: A method of manufacturing an organic thin film element including an organic thin film between a pair of thin film electrodes with at least one transparent electrode includes forming the transparent electrode by atomizing a material liquid containing a transparent-electrode forming material onto a base material; and forming the organic thin film on the transparent electrode. The organic thin film element is capable of simply providing an organic thin film element having a long element life. A method of manufacturing an electro-optic device as well as a method of manufacturing electronic equipment by using the above method are described.

Abstract: A method for manufacturing an organic thin film element that includes an organic thin film between a pair of thin film electrodes and at least one electrode being a transparent electrode includes forming a transparent electrode by spraying a material liquid containing a transparent electrode formation material on a base material, and forming an organic thin film on the transparent electrode. This method allows for the manufacture of the organic thin film element by which an organic thin film element with high light-extraction efficiency is simply provided. A method for manufacturing an electro-optic device and a method for manufacturing electronic equipment that utilize the method for manufacturing an organic thin film element are described.

Abstract: A device manufacturing method, including: a first process for providing the plural elements on the original substrate via a separation layer in a condition where terminal sections are exposed to a surface on an opposite side to the separation layer; a second process for adhering the surface where the terminal sections of the elements to be transferred on the original substrate are exposed, via conductive adhesive, to a surface of the final substrate on a side where conductive sections for conducting with the terminal sections of the elements are provided; a third process for producing exfoliation in the separation layer between the original substrate and the final substrate; and a fourth process for separating the original substrate from which the transfer of elements has been completed, from the final substrate.

Abstract: Exemplary embodiments of the present invention provide a method of manufacturing a piezoelectric device that includes a piezoelectric layer having high crystallinity in which crystal orientation is aligned to a desired direction, a method of manufacturing a ferroelectric device that includes a ferroelectric layer having the similar high crystallinity, and so forth. Exemplary embodiments include an insulating layer composed of SiO2 and so forth and a buffer layer composed of strontium oxide (SrO) and so forth are formed on a substrate such as a silicon single crystal wafer in sequence, and then a lower electrode composed of strontium ruthenate (SRO) is formed on the buffer layer. By forming self-assembled monolayers on the lower electrode, high affinity regions A1 and low affinity regions A2 are formed. Then, piezoelectric layers are selectively formed only on the high affinity regions A1.

Abstract: This ink jet recording head manufacturing method comprises (A) a process for forming a peeling layer 11 wherein peeling is induced by light irradiation, on a base plate 10 exhibiting light-transmissivity, (B) a process for forming a common electrode film 3 on the peeling layer 11, (C) a process for forming a plurality of piezoelectric elements 4, (D) a process for forming a reservoir piece 5 comprising a lid structure that accommodates in its interior one or more piezoelectric elements 4, which interior forms an ink reservoir 51, (E) a process for irradiating the peeling layer 11 with prescribed light from the base plate 10 side thereof, thereby producing peeling in the peeling layer 11, and peeling the base plate 10 away, and (F) a process for bonding a pressure chamber plate 2, whereon are provided a plurality of pressure chambers 21, to the common electrode film 3 separated from the base plate, so that the pressure chambers 21 are sealed.

Abstract: An ink jet recording head manufacturing method is provided comprising: forming a peeling layer wherein peeling is induced by light irradiation on a base plate exhibiting light-transmissivity; forming a common electrode film on the peeling layer; forming a plurality of piezoelectric elements, forming a reservoir piece including a lid structure that accommodates one or more piezoelectric elements in an interior which forms an ink reservoir; irradiating the peeling layer with prescribed light from the base plate side to induce peeling; peeling the base plate away; and bonding a pressure chamber plate provided with a plurality of pressure chambers to the common electrode film separated from the base plate so that the pressure chambers are sealed.

Abstract: A method for manufacturing an optical waveguide includes the steps of forming a liquid-repellent region upon a substrate, and forming the optical waveguide in a region upon the substrate other than the liquid-repellent region.

Abstract: A manufacturing method of a microlens array includes the step of forming second light transmitting layers 36 on a first light transmitting layer 26. The first light transmitting layer 26 has a plurality of recessed parts 28 and partitions 32 for delimiting the recessed parts 28, wherein at least a portion of the inner surface of each recessed part 28 is a lens surface 30. The second light transmitting layers 36 are formed in the respective recessed parts 28 in such a manner that the second light transmitting layers 36 avoid the partitions 32 of the first light transmitting layer 26. The second light transmitting layers 36 are formed in such a manner that the surfaces of the second light transmitting layers 36 form lens surfaces 38 for the respective recessed parts 28.

Abstract: The present application provides a manufacturing method for a device which enables manufacture of a device effectively at low cost by dispersingly arranging elements such as TFTs on a final substrate which becomes an active matrix substrate for electro-optic devices, a device obtained by the method, an electro-optic device, and electronic equipment. The method is to prepare a part or all of many elements formed on a first substrate 10 and then these elements are transferred to a second substrate 14. for manufacturing a device.

Abstract: A device manufacturing method, including: a first process for providing the plural elements on the original substrate via a separation layer in a condition where terminal sections are exposed to a surface on an opposite side to the separation layer; a second process for adhering the surface where the terminal sections of the elements to be transferred on the original substrate are exposed, via conductive adhesive, to a surface of the final substrate on a side where conductive sections for conducting with the terminal sections of the elements are provided; a third process for producing exfoliation in the separation layer between the original substrate and the final substrate; and a fourth process for separating the original substrate from which the transfer of elements has been completed, from the final substrate.

Abstract: A method for fabricating a microlens array having a flat surface by a simple process, a microlens array fabricated, thereby and an optical device. The method for fabricating the microlens array includes a first step of bringing a lens side of a microlens array substrate 10 having a plurality of lenses 12 formed thereon into close contact with a flat surface 22 of a master plate 20, in which one surface is the flat surface 22, with a light transmitting layer precursor 30 therebetween; a second step of curing the light transmitting layer precursor 30 to form a light transmitting layer 32; and a third step of releasing the master plate 20 from the light transmitting layer 32.

Abstract: This ink jet recording head manufacturing method comprises (A) a process for forming a peeling layer 11 wherein peeling is induced by light irradiation, on a base plate 10 exhibiting light-transmissivity, (B) a process for forming a common electrode film 3 on the peeling layer 11, (C) a process for forming a plurality of piezoelectric elements 4, (D) a process for forming a reservoir piece 5 comprising a lid structure that accommodates in its interior one or more piezoelectric elements 4, which interior forms an ink reservoir 51, (E) a process for irradiating the peeling layer 11 with prescribed light from the base plate 10 side thereof, thereby producing peeling in the peeling layer 11, and peeling the base plate 10 away, and (F) a process for bonding a pressure chamber plate 2, whereon are provided a plurality of pressure chambers 21, to the common electrode film 3 separated from the base plate, so that the pressure chambers 21 are sealed.

Abstract: This ink jet recording head manufacturing method comprises (A) a process for forming a peeling layer 11 wherein peeling is induced by light irradiation, on a base plate 10 exhibiting light-transmissivity, (B) a process for forming a common electrode film 3 on the peeling layer 11, (C) a process for forming a plurality of piezoelectric elements 4, (D) a process for forming a reservoir piece 5 comprising a lid structure that accommodates in its interior one or more piezoelectric elements 4, which interior forms an ink reservoir 51, (E) a process for irradiating the peeling layer 11 with prescribed light from the base plate 10 side thereof, thereby producing peeling in the peeling layer 11, and peeling the base plate 10 away, and (F) a process for bonding a pressure chamber plate 2, whereon are provided a plurality of pressure chambers 21, to the common electrode film 3 separated from the base plate, so that the pressure chambers 21 are sealed.

Abstract: A method for manufacturing a microlens array including the steps of forming a reflecting layer as a mark composed of at least one of a raised part and a recessed part in a first light-transmitting layer having a plurality of lenses and the mark, the reflecting layer having a higher reflectance than that of the first light-transmitting layer; and forming a second light-transmitting layer so as to cover at least the lenses.

Abstract: This ink jet recording head manufacturing method comprises (A) forming a peeling layer 11 wherein peeling is induced by light irradiation, on a base plate 10 exhibiting light-transmissivity, (B) forming a common electrode film 3 on the peeling layer 11, (C) forming a plurality of piezoelectric elements 4, (D) forming a reservoir piece 5 comprising a lid structure that accommodates in its interior one or more piezoelectric elements 4, which interior forms an ink reservoir 51, (E) irradiating the peeling layer 11 with prescribed light from the base plate 10 side thereof, thereby producing peeling in the peeling layer 11, and peeling the base plate 10 away, and (F) bonding a pressure chamber plate 2, whereon are provided a plurality of pressure chambers 21, to the common electrode film 3 separated from the base plate, so that the pressure chambers 21 are sealed.

Abstract: With a view to permitting manufacture of an ink jet head capable of coping with a higher resolution at a low cost through a simple process, the method of manufacturing an ink jet printer head of the invention comprises the step of ejecting an ink by pressurizing an ink pressure chamber by means of a piezo-electric element deforming in response to an electric signal, provided on a head base forming the ink pressure chamber; wherein a manufacturing method of the head base comprises a first step of manufacturing a green sheet having a prescribed relief pattern in response to the head base; a second step of forming the head base by coating and solidifying a material for forming the head base on the surface of the green sheet having the relief pattern; a third step of stripping off the head base from the green sheet; and a fourth step of forming a nozzle port for discharging the ink on the head base.

Abstract: A method for manufacturing a microlens array including the steps of forming a reflecting layer as a mark composed of at least one of a raised part and a recessed part in a first light-transmitting layer having a plurality of lenses and the mark, the reflecting layer having a higher reflectance than that of the first light-transmitting layer; and forming a second light-transmitting layer so as to cover at least the lenses.