Patents by Inventor Atsushi Tatsuyama

Atsushi Tatsuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10807400
    Abstract: The present invention provides a photosensitive resin composition for a relief printing original plate which can achieve both of a printing reproducibility of gradation of a highlight part and a printing durability, and can further achieve a low plate surface tackiness. A photosensitive resin composition for a relief printing original plate containing water-soluble or water-dispersible polyamide, a photopolymerizable unsaturated compound and a photopolymerization initiator as essential ingredients, characterized in that a total of a content of an alicyclic structural unit obtained from diamine and a content of an alicyclic structural unit obtained from dicarboxylic acid in the polyamide is 30 to 90 molar %, and the content of the alicyclic structural unit obtained from dicarboxylic acid in the polyamide is 20 molar % or more.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: October 20, 2020
    Assignee: TOYOBO CO., LTD.
    Inventors: Kazuya Yoshimoto, Atsushi Tatsuyama, Jun Hasuike
  • Publication number: 20180236804
    Abstract: The present invention provides a photosensitive resin composition for a relief printing original plate which can achieve both of a printing reproducibility of gradation of a highlight part and a printing durability, and can further achieve a low plate surface tackiness. A photosensitive resin composition for a relief printing original plate containing water-soluble or water-dispersible polyamide, a photopolymerizable unsaturated compound and a photopolymerization initiator as essential ingredients, characterized in that a total of a content of an alicyclic structural unit obtained from diamine and a content of an alicyclic structural unit obtained from dicarboxylic acid in the polyamide is 30 to 90 molar %, and the content of the alicyclic structural unit obtained from dicarboxylic acid in the polyamide is 20 molar % or more.
    Type: Application
    Filed: August 2, 2016
    Publication date: August 23, 2018
    Applicant: TOYOBO CO., LTD.
    Inventors: Kazuya Yoshimoto, Atsushi Tatsuyama, Jun Hasuike
  • Patent number: 8371218
    Abstract: To provide a photosensitive resin composition which is a material for a printing original plate for laser engraving which generates no printing deficiencies and from which a printing plate with a satisfactory resolution can be produced. A printing original plate for laser engraving where image is formed by irradiation of laser beam to form a printing plate, characterized in that the photosensitive resin composition layer consists of a photosensitive resin composition in which soluble polyamide or soluble polyether urethane urea, ethylenic unsaturated monomer and photopolymerization initiator are essential ingredients and the amount of (meth)acryloyl group in the photosensitive resin composition is 0.25 to 0.40 mol per 100 g of the photosensitive resin composition.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: February 12, 2013
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Satoshi Takahashi, Atsushi Tatsuyama, Toru Wada
  • Publication number: 20100269721
    Abstract: To provide a photosensitive resin composition which is a material for a printing original plate for laser engraving which generates no printing deficiencies and from which a printing plate with a satisfactory resolution can be produced. A printing original plate for laser engraving where image is formed by irradiation of laser beam to form a printing plate, characterized in that the photosensitive resin composition layer consists of a photosensitive resin composition in which soluble polyamide or soluble polyether urethane urea, ethylenic unsaturated monomer and photopolymerization initiator are essential ingredients and the amount of (meth)acryloyl group in the photosensitive resin composition is 0.25 to 0.40 mol per 100 g of the photosensitive resin composition.
    Type: Application
    Filed: December 22, 2008
    Publication date: October 28, 2010
    Applicant: Toyo Boseki Kabushiki Kaisha
    Inventors: Satoshi Takahashi, Atsushi Tatsuyama, Toru Wada