Abstract: The rectifying device converts high-frequency power input from an input terminal into direct current power and outputs the direct current power from an output terminal. The rectifying device includes a rectifier that converts the high-frequency power into the direct current power, and an impedance changer having one end connected to a connection point of the rectifier and the output terminal and the other end to which reference voltage is applied such that impedance varies while having a negative correlation with respect to an absolute value of voltage of the direct current power. When the absolute value of the voltage of the direct current power is greater than a predetermined value that is lower than reverse withstand voltage of the rectifying element included in the rectifier, the impedance of the impedance changer as viewed from the rectifier is a value regarded as corresponding to a short circuit.

Abstract: Provided is a solid-state image sensor that includes a micro lens through which incident light is condensed, a photoelectrical conversion unit that generates electric charge based on the condensed incident light, and a translucent plate formed between the micro lens and the photoelectrical conversion unit and including a light-shielding wall provided between a translucent part provided for each pixel and the pixel. An antireflection film including films of two layers or more is formed between the light-shielding wall and the translucent part.

Abstract: Provided is a laminated lens structure capable of corresponding various optical parameters. The laminated lens structure includes at least one or more sheets of first lens-attached substrates and at least one or more sheets of second lens-attached substrates as a lens-attached substrate including a lens resin portion that forms a lens, and a carrier substrate that carries the lens resin portion. The carrier substrate of the first lens-attached substrates is constituted by laminating a plurality of sheets of carrier configuration substrates in a thickness direction, and the carrier substrate of the second lens-attached substrates is constituted by one sheet of carrier configuration substrate. For example, the present technology is applicable to a camera module and the like.

Abstract: A method for manufacturing an intermediate material for a soft packaging container according to the present invention includes: a first overlaying step P1 of laying a second raw film sheet 120 over a first raw film sheet 110; a confining portion forming step P2 of forming a filler confining portion 50 for confining a filler 59, the filler confining portion 50 being constituted by a non-joined region between the first raw film sheet 110 and the second raw sheet 12, by joining a portion of the first raw film sheet 110 and a portion of the second sheet 12 to each other; a folding step P4 of folding the first raw film sheet 110 and the second sheet 12 with the first raw film sheet 110 on an outer side, such that the filler confining portion 50 is present in a state where an inner portion thereof is continuous on two sides that are connected via at least one folding position; an accommodating portion forming step P5 of forming an accommodating portion 60 by joining a plurality of portions including at least one of

Abstract: A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

Abstract: A light-emitting device has a light-emitting element including first and a second semiconductor light-emitting structures, each having a first and a second electrode, and a substrate supporting the light-emitting element. The substrate has an interconnection layer having a first interconnection portion comprising a first land, a second interconnection portion comprising second and third lands, and a third interconnection portion comprising a fourth land, and a first reflective member covering a portion of the interconnection layer. A portion of the first land is coupled to the first electrode of the first semiconductor light-emitting structure. A portion of the second land and a portion of the third land are coupled to the second electrode of the first semiconductor light-emitting structure and the first electrode of the second semiconductor light-emitting structure, respectively. A portion of the fourth land is coupled to the second electrode of the second semiconductor light-emitting structure.

Abstract: A control circuit of a code modulator sets first to third states to a code modulation circuit. In first state, first and fourth switch circuits are on, and second and third switch circuits are off. In second state, first and fourth switch circuits are off, and second and third switch circuits are on. In third state, all first to fourth switch circuits are on during transition from the first to second state, and vice versa. A control circuit of a code demodulator sets fourth to sixth states to a code demodulation circuit. In fourth state, fifth and eighth switch circuits are off, and sixth and seventh switch circuits are on. In fifth state, fifth and eighth switch circuits are on, and sixth and seventh switch circuits are off. In sixth state, all fifth to eighth switch circuits are on during transition from fourth to fifth state, and vice versa.

Abstract: According to one embodiment, there is provided a rotating electrical machine coil with a conductor and an insulation layer that is provided around the conductor to cover the conductor, the rotating electrical machine coil including a linear part of the coil and a coil end that is separable from and electrically connectable to the linear part of the coil.

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

Abstract: A light emitting device includes a light emitting element adapted to emit blue light, quantum dots that absorb part of the blue light emitted from the light emitting element to emit green light, and at least one of a KSF phosphor adapted to absorb part of the blue light emitted from the light emitting element to emit red light and a MGF phosphor adapted to absorb part of the blue light emitted from the light emitting element to emit red light.

Abstract: The rectifying device converts high-frequency power input from an input terminal into direct current power and outputs the direct current power from an output terminal. The rectifying device includes a rectifier that converts the high-frequency power into the direct current power, and an impedance changer having one end connected to a connection point of the rectifier and the output terminal and the other end to which reference voltage is applied such that impedance varies while having a negative correlation with respect to an absolute value of voltage of the direct current power. When the absolute value of the voltage of the direct current power is greater than a predetermined value that is lower than reverse withstand voltage of the rectifying element included in the rectifier, the impedance of the impedance changer as viewed from the rectifier is a value regarded as corresponding to a short circuit.

Abstract: A device includes a light emitting device including: a light emitting element adapted to emit a blue light, a sealing resin covering the light emitting element, and a sulfide phosphor-containing layer disposed separate from the sealing resin; and a diffusion plate disposed between the sealing resin and the sulfide phosphor-containing layer, the diffusion plate being spaced apart from the sealing resin.

Abstract: A toner is provided that contains a crystalline polyester resin comprising a polycondensed resin of a dicarboxylic acid represented by the following formula (1) with a diol represented by the following formula (2). A content of a cyclic ester represented by the following formula (3) in the toner, measured by a thermal extraction gas chromatographic mass spectrometry at a thermal extraction temperature of 160° C., is from 1 to 200 ppm in terms of toluene: where n represents an integer of from 2 to 12; where m represents an integer of from 2 to 12; and where n represents an integer of from 2 to 12, m represents an integer of from 2 to 12, and m+n?6 is satisfied.

Abstract: A cleaning composition having good foamability and being capable of producing fine and stable foams with resilient texture, more specifically, a cleaning composition including a surfactant, methyl cellulose, hydroxypropyl methyl cellulose, and a solvent.

Abstract: To realize a laser irradiation apparatus by using which accuracy in processing a substrate can be improved. A laser irradiation apparatus according to an embodiment includes a laser irradiation unit configured to apply laser light to a substrate, a base part, and a conveyance stage configured to convey the substrate. The conveyance stage includes a stage configured to be movable over the base part, a base flange fixed over the stage, a substrate stage fixed to an upper end part of the base flange and configured so that the substrate is placed thereover, and a pusher pin for supporting the substrate, the pusher pin being configured to penetrate the substrate stage and to be movable up and down.

Abstract: There is provided an imaging apparatus including: a solid state image sensor configured to generate a pixel signal by photoelectric conversion in accordance with a light amount of an incoming light; an integrated configuration unit configured to integrate a function for fixing the solid state image sensor and a function for removing an infrared light of the incoming light.

Abstract: A method of controlling a wavelength of a wavelength tunable laser module includes: referring to data of measured frequencies and wavelength filter control values at two or more points for each basic frequency channel, the data being stored in a memory of a controller; selecting the basic frequency channel closest to a frequency of laser light that a laser light source is instructed to emit; calculating a first wavelength filter control value for providing the instructed frequency of laser light from the data of the measured frequencies allocated to the basic frequency channel closest to the instructed frequency and the wavelength filter control values; and controlling the transmission characteristic of a wavelength filter using the first wavelength filter control value.

Abstract: A light emitting device includes a light emitting element adapted to emit blue light, quantum dots that absorb part of the blue light emitted from the light emitting element to emit green light, and at least one of a KSF phosphor adapted to absorb part of the blue light emitted from the light emitting element to emit red light and a MGF phosphor adapted to absorb part of the blue light emitted from the light emitting element to emit red light.

Abstract: A foreign object detecting device includes first and second coils, the winding directions of which are the same, and a foreign object detecting circuit. The foreign object detecting circuit outputs a first detecting signal having a first predetermined waveform to a first terminal of the first coil and outputs a second detecting signal having a second predetermined waveform, which has the same polarity as the first predetermined waveform, to a third terminal of the second coil to cause magnetic fields generated from the first and second coils to repel each other. The foreign object detecting circuit measures an amount of change of the impedance value of the first or second coil which is caused by the presence of a foreign object. When the amount of change exceeds a predetermined value, the foreign object detecting circuit determines that there is a foreign object above the first or second coil.

Abstract: A light emitting device includes a mounting board, light sources, a light diffuser, a wavelength conversion layer, and scatter reflection portions. Each of the light sources has an upper face on which a light reflecting layer is disposed. The light diffuser is arranged above the plurality of light sources. The wavelength conversion layer is located at least between the light sources and the light diffuser. The wavelength conversion layer is configured to absorb at least a portion of light from the light sources and to emit light having a wavelength which is different from a wavelength of the light from the light sources. The scatter reflection portions are arranged on a surface of the wavelength conversion layer that is closer to the light diffuser. Each of the scatter reflection portions is arranged above at least a portion of the upper face of a corresponding one of the light sources.