Abstract: This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing.

Abstract: Provided is an electrolytic capacitor including: a plurality of capacitor elements; a plurality of storers that stores the plurality of capacitor elements, respectively; and a sealer that seals the plurality of capacitor elements in the plurality of storers. The plurality of storers is integrally formed.

Abstract: This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing.

Abstract: An inter-component connection structure includes a male fitting member; and a female fitting member that has a first nipping portion and a second nipping portion disposed to face each other, and nips an insertion portion of the male fitting member inserted between the first nipping portion and the second nipping portion. A pair of the male fitting member and the female fitting member is disposed in different components. The first nipping portion and the second nipping portion are respectively bent to form protruding portions toward surfaces thereof facing each other. A gap is provided at a tip portion of each of the first nipping portion and the second nipping portion. In at least one of the pair of the male fitting member and the female fitting member, an insulating portion is provided in a region that is not in contact with the other when fitted.

Abstract: A power conversion apparatus includes a case having a heat-dissipation property, and including a housing part formed to surround a predetermined space, a resin material having a thermal conductivity, the resin material being provided in the predetermined space, a coil disposed in the predetermined space, a coil case having a shape that fits with the housing part, the coil case being configured to house the coil, and a power semiconductor device disposed along a side wall of the coil case. The power semiconductor device is pressed and fixed between a side wall of the housing part and the side wall of the coil case in a state where a heat dissipation surface is in contact with the side wall of the housing part.

Abstract: This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing.

Abstract: This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing.

Abstract: A power conversion apparatus includes a case having a heat-dissipation property, and including a housing part formed to surround a predetermined space, a resin material having a thermal conductivity, the resin material being provided in the predetermined space, a coil disposed in the predetermined space, a coil case having a shape that fits with the housing part, the coil case being configured to house the coil, and a power semiconductor device disposed along a side wall of the coil case. The power semiconductor device is pressed and fixed between a side wall of the housing part and the side wall of the coil case in a state where a heat dissipation surface is in contact with the side wall of the housing part.

Abstract: This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing.

Abstract: Provided is a reactor device which is inexpensive, has high heat radiation and with which there is a high degree of freedom when positioning the transformer core. A heat-radiating plate (105) of U-shaped cross section is contacted onto an upper face and both side faces of an upper part E core (102) forming a transformer (101) upper part, and a transformer (101) provided with the heat-radiating plate (105) is housed from one face which is open of a reactor case (106), and a potting resin material is charged into the gap between the transformer (101) and the reactor case (106) until a lower edge part of the heat-radiating plate (105) is submerged. The reactor case (106) housing the transformer (101) is installed and secured onto a base providing a cooling mechanism.

Abstract: This reactor apparatus is capable of having both the excellent heat dissipating characteristics and insulating characteristics. The heat dissipating characteristics of the reactor apparatus are improved by having a metal plate (300), which has high heat dissipating characteristics, in direct contact with the whole surface of the bottom surface portion (204) of a case (200), which is formed of an insulating resin, and which houses the whole coil (120) of a reactor. A heat dissipating adhesive is applied to and hardened between the bottom surface portion (204) and the metal plate (300). Furthermore, the metal plate (300) is fixed to the bottom surface portion (204) by means of braces (400).

Abstract: Provided is a reactor device which is inexpensive, has high heat radiation and with which there is a high degree of freedom when positioning the transformer core. A heat-radiating plate (105) of U-shaped cross section is contacted onto an upper face and both side faces of an upper part E core (102) forming a transformer (101) upper part, and a transformer (101) provided with the heat-radiating plate (105) is housed from one face which is open of a reactor case (106), and a potting resin material is charged into the gap between the transformer (101) and the reactor case (106) until a lower edge part of the heat-radiating plate (105) is submerged. The reactor case (106) housing the transformer (101) is installed and secured onto a base providing a cooling mechanism.