Patents by Inventor Atsuyuki ICHIKAWA

Atsuyuki ICHIKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for centering a sample tube for use with an NMR measurement system and sample tube centering method
    Patent number: 11675031
    Abstract: A rotation mechanism includes a bearing mechanism and a drive mechanism. Prior to loading of a sample unit, bearing gas is supplied to a bearing mechanism. In the course of inserting the sample unit, bearing gas is sprayed to a surface of the sample tube from around the sample tube to thereby center the sample unit.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: June 13, 2023
    Assignee: JEOL Ltd.
    Inventors: Yuki Endo, Yutaka Horino, Naohiro Kosaka, Atsuyuki Ichikawa
  • NMR Measurement System and Sample Tube Centering Method
    Publication number: 20210278487
    Abstract: A rotation mechanism includes a bearing mechanism and a drive mechanism. Prior to loading of a sample unit, bearing gas is supplied to a bearing mechanism. In the course of inserting the sample unit, bearing gas is sprayed to a surface of the sample tube from around the sample tube to thereby center the sample unit.
    Type: Application
    Filed: March 3, 2021
    Publication date: September 9, 2021
    Inventors: Yuki Endo, Yutaka Horino, Naohiro Kosaka, Atsuyuki Ichikawa
  • Sputtering apparatus and processing apparatus
    Patent number: 10062553
    Abstract: A sputtering apparatus includes a space defining member defining a sputtering space for forming a film on a substrate. The space defining member includes a concave portion, and an opening portion is provided in the bottom portion of the concave portion. The sputtering apparatus includes a shield member configured to shield the opening portion from the sputtering space. The opening portion is formed so that a pressure gauge capable of measuring the pressure in the sputtering space can be attached, and the shield member is arranged so that at least a part of the shield member is buried in the concave portion.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: August 28, 2018
    Assignee: Canon Anelva Corporation
    Inventors: Taichi Hiromi, Hidetoshi Shimokawa, Atsuyuki Ichikawa
  • SPUTTERING APPARATUS AND PROCESSING APPARATUS
    Publication number: 20170140907
    Abstract: A sputtering apparatus includes a space defining member defining a sputtering space for forming a film on a substrate. The space defining member includes a concave portion, and an opening portion is provided in the bottom portion of the concave portion. The sputtering apparatus includes a shield member configured to shield the opening portion from the sputtering space. The opening portion is formed so that a pressure gauge capable of measuring the pressure in the sputtering space can be attached, and the shield member is arranged so that at least a part of the shield member is buried in the concave portion.
    Type: Application
    Filed: January 31, 2017
    Publication date: May 18, 2017
    Applicant: CANON ANELVA CORPORATION
    Inventors: Taichi HIROMI, Hidetoshi SHIMOKAWA, Atsuyuki ICHIKAWA