Patents by Inventor Atushi Saiki

Atushi Saiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package, method of manufacturing the package and packet of the package
    Publication number: 20030102247
    Abstract: A package (10) has blisters (11) each having an embossed hollow (12) with an open end, for containing a tablet (15), and a flange (13) extending around the open end of the embossed hollow (12). The flanges (13) of the blisters (11) are bonded to a covering sheet 20. The blisters (11) are formed separately, and the flange (13) of each blister (11) has a circular shape.
    Type: Application
    Filed: May 24, 2002
    Publication date: June 5, 2003
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Isao Inoue, Kiyoshi Oguchi, Masaho Hayashi, Atushi Saiki
  • Package, method of manufacturing the package and packet of the package
    Patent number: 6244442
    Abstract: A package (10) has blisters (11) each having an embossed hollow (12) with an open end, for containing a tablet (15), and a flange (13) extending around the open end of the embossed hollow (12). The flanges (13) of the blisters (11) are bonded to a covering sheet 20. The blisters (11) are formed separately, and the flange (13) of each blister (11) has a circular shape.
    Type: Grant
    Filed: March 28, 1997
    Date of Patent: June 12, 2001
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Isao Inoue, Kiyoshi Oguchi, Masaho Hayashi, Atushi Saiki