Patents by Inventor Aubrey Chapman

Aubrey Chapman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5754403
    Abstract: A thermal core (10) including aluminum layer (12) held between two molybdenum layers (14) for dissipating heat from a plurality of chip carriers (22). Core (10) has the ability to withstand excessive vibrational loads while being lightweight. Bonding molybdenum/aluminum/molybdenum layers (12, 14) creates a core (10) having an increased stiffness factor which surpasses military vibrational requirements. Additionally, due to the low density of porous aluminum layer (12), weight limitations set forth by the military can also be met.
    Type: Grant
    Filed: November 8, 1994
    Date of Patent: May 19, 1998
    Assignee: Texas Instruments Incorporated
    Inventors: Burhan Ozmat, Robert Kent Peterson, Aubrey Chapman