Patents by Inventor Augustin Coella-Vera

Augustin Coella-Vera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layer thin film device
    Patent number: 6506664
    Abstract: The present invention provides a method of transfer of a first planar substrate with two major surfaces to a second substrate, comprising the steps of: forming the first planar substrate, attaching one of the major surfaces of the first planar substrate to a carrier by means of a release layer; attaching the other major surface of the first substrate to the second substrate with a curable polymer adhesive layer; partly curing the polymer adhesive layer, disconnecting the release layer from the first substrate to separate the first substrate from the camer, followed by coing the polymer adhesive layer.
    Type: Grant
    Filed: April 3, 2000
    Date of Patent: January 14, 2003
    Assignees: IMEC VZW, Alcatel
    Inventors: Eric Beyne, Augustin Coella-Vera