Patents by Inventor Augustinus Cornelis Maria Van De Ven

Augustinus Cornelis Maria Van De Ven has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for interconnecting tracks present on opposite sides of a substrate
    Patent number: 7992295
    Abstract: A method and device for making an electrically conductive connection between two electrically conductive tracks present on two opposite sides of a dielectric substrate. The method: a) provides the substrate, with at least one first electrically conductive track present on one side thereof and at least one second electrically conductive track present on the other side of the substrate opposite the one side, b) forms a through hole through the substrate and through two opposite parts of a first track and a second track, respectively, and c) makes an electrically conductive connection via the through hole between the first track through which the through hole has been formed and the second hole through which the through hole has been formed.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: August 9, 2011
    Assignee: Meco Equipment Engineers B.V.
    Inventors: Augustinus Cornelis Maria Van De Ven, Rik Franciscus Jozef Peter Rozeboom
  • Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
    Patent number: 7501048
    Abstract: The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of immersing the substrate with the pattern present thereon in an electrolytic bath, electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate, and effecting contacting movement in the electrolytic bath of the electrode and the pattern with respect to each other during immersion of the substrate. The invention furthermore provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: March 10, 2009
    Assignee: Meco Equipment Engineers B.V.
    Inventors: Peter Jacobus Gerardus Loermans, Augustinus Cornelis Maria Van De Ven
  • Method For Interconnecting Tracks Present on Opposite Sides of a Substrate
    Publication number: 20080301936
    Abstract: A method and device for making an electrically conductive connection between two electrically conductive tracks present on two opposite sides of a dielectric substrate. The method: a) provides the substrate, with at least one first electrically conductive track present on one side thereof and at least one second electrically conductive track present on the other side of the substrate opposite the one side, b) forms a through hole through the substrate and through two opposite parts of a first track and a second track, respectively, and c) makes an electrically conductive connection via the through hole between the first track through which the through hole has been formed and the second hole through which the through hole has been formed.
    Type: Application
    Filed: December 5, 2006
    Publication date: December 11, 2008
    Applicant: MECO EQUIPMENT ENGINEERS B.V. (A DUTCH CORP.)
    Inventors: Augustinus Cornelis Maria Van De Ven, Rik Franciscus Jozef Peter Rozeboom