Abstract: The invention relates to a piezoelectric device comprising flexible single crystalline piezoelectric LiNbO3 and/or LiTaO3 films integrated on flexible substrate and methods for producing the same. More specifically, the invention relates to a flexible piezoelectric device for energy harvesting. The a Flexible piezoelectric device comprises a flexible substrate layer which comprises an upper face and a lower face, and at least one LiNbO3 and/or LiTaO3 film, called LNT film bonded to one of the faces of the flexible substrate layer, wherein thickness tf of said at least one LNT film is chosen between a use range of 5 to 50 micrometers (?m).

Abstract: A process for fabricating a micro-electro-mechanical system, includes the following steps: production of a stack on the surface of a temporary substrate so as to produce a first assembly, comprising: at least depositing a piezoelectric material or a ferroelectric material to produce a layer of piezoelectric material or of ferroelectric material; producing a first bonding layer; production of a second assembly comprising at least producing a second bonding layer on the surface of a host substrate; production of at least one acoustic isolation structure in at least one of the two assemblies; production of at least one electrode level containing one or more electrodes in at least one of the two assemblies; bonding the two assemblies via the two bonding layers, before or after the production of the at least one electrode level in at least one of the two assemblies; removing the temporary substrate.

Abstract: A layered solid element includes a ferroelectric layer of a crystalline material Li1?x(Nb1?yTay)1+xO3+2x?z which has X- or 33° Y-orientation with respect to a substrate of the layered solid element. The ferroelectric layer is grown epitaxially from a buffer layer having of one of the chemical formulae LkNirO1.5·(k+r)+w or Ln+1NinO3n+1+?, where L is a lanthanide element. Such layered solid element may form a thin-film bulk acoustic resonator and be useful for integrated electronic circuits such as RF-filters, or guided optical devices such as integrated optical modulators.

Abstract: A process for fabricating a micro-electro-mechanical system, includes the following steps: production of a stack on the surface of a temporary substrate so as to produce a first assembly, comprising: at least depositing a piezoelectric material or a ferroelectric material to produce a layer of piezoelectric material or of ferroelectric material; producing a first bonding layer; production of a second assembly comprising at least producing a second bonding layer on the surface of a host substrate; production of at least one acoustic isolation structure in at least one of the two assemblies; production of at least one electrode level containing one or more electrodes in at least one of the two assemblies; bonding the two assemblies via the two bonding layers, before or after the production of the at least one electrode level in at least one of the two assemblies; removing the temporary substrate.