Abstract: An interconnect system for providing electrical connection to bond pads of a semiconductor device (14) includes a socket (18) having a plurality of conductors (16) and a carrier assembly (10) receivable in the socket (18) carrying a semiconductor device (14). The carrier assembly comprises a substrate assembly (12) and a latch assembly (22, 122, 222). The substrate assembly (12) includes a substrate (12a) having a complaint membrane (12f) and a plurality of contact bumps (12i) on a top surface of the complaint membrane (12c) for contacting bond pads on the semiconductor device (14). The force applying latch assembly (22, 122, 222) applies pressure in making a temporary electrical connection between contact bumps (12i) and the bond pads of semiconductor device (14). Latch assembly (222) comprises a latch (232) which cooperates with a spring (231) to place a force on a lid (224, 324, 424) which in turn places a force on the semiconductor device (14).

Abstract: An electrically insulating body having rows of electrical contact receiving apertures is shown in which solder tail electrical contacts, such as screw machine contacts, either of the pin or receptacle type, are removably received in the apertures. The electrical contacts are free to move in their seats within preselected limits to lower connector mating forces.

Abstract: A printed circuit board connector is shown having an elongated body of electrically insulating material in which several rows of apertures extend from a flat surface on one side, each row extending to one of a series of platforms on an opposite side spaced at progressively greater distances from the flat surface in order to accommodate contact pins having right angle bends with the same spacing beyond the right angle bend as on the flat surface. The contact pins received in the apertures communicating with the flat surface may be of the male pin or female receptacle type.

Abstract: A circuit board system resiliently mounts a plurality of daughter boards with high circuit interconnection density on a mother board using pairs of mating connectors having welded contact members accommodated in novel arrangements in the respective connectors to permit high density of electrical interconnection with convenience and reliability. Contact parts of substantial size are welded into contacts in one connector to detachably interconnect with contact parts of similar size in mating connector to improve interconnection releability. Novel contact arrangements permit accommodation of those parts of substantial size in the mating connectors. Sheet metal spring or post parts welded into the contacts in both connectors permit the contacts to be conveniently loaded into connector bodies and permit large numbers of contact springs or posts to be soldered to terminal pads or circuit paths on mother or daughter boards with high density.

Abstract: An improved circuit panel connector comprises an electrically insulating body having a plurality of openings extending through the body and has electrical contacts such as screw machine contact assemblies movably mounted in the respective body openings so that posts extend from the openings at one side of the body and terminal entry portions of the contacts are accessible at an opposite side of the body. A plate having a plurality of protuberances formed therein is disposed over the opposite connector body side with the protuberances fitted into the terminal entry portions of the contacts for spacing the movably mounted contacts relative to each other in the connector body openings. A polyimide tape is adhesively and detachably secured to the body over the plate for holding the plate on the body and for sealing the body openings. The contact posts are inserted into corresponding openings in a circuit panel and soldered to circuit paths on the panel.

Abstract: A low insertion force connector has conductors blanked and formed from metal strip materials and disposed in openings in an insulating connector body. A receptacle portion of each conductor has a bridge formed to extend around the perimeter of a square and disposed inside a body opening and has integral leaf springs extending from the bridge at the respective sides of the square toward a terminal entry end of the opening so that two pairs of the springs are disposed in facing relation around a common axis for receiving a terminal therebetween. The contact surfaces of one pair of springs is relatively closer to the entry end of the body opening than the contact surfaces of the other pair of springs so that a terminal being inserted moves the pairs of springs separately in establishing said spring forces, thereby requiring lesser terminal insertion forces.

Abstract: A low insertion force connector has metal conductors disposed in respective openings in an insulating connector body. Each conductor has a bridge portion extending in a square inside its respective body opening and has integral leaf springs extending from respective sides of the square toward a terminal entry end of the body opening. Two pairs of the springs are disposed so that the springs in each pair face each other around a common axis for receiving a terminal therebetween. Each leaf spring has an obliquely disposed surface to intercept and be moved by a terminal as the terminal is inserted and a contact surface for engaging the terminal said surfaces of one pair of springs being relatively closer to the entry end of the body opening than said surfaces of the other pair of springs, thereby requiring lesser terminal insertion forces.