Patents by Inventor Avanti Jain

Avanti Jain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Abrasive article and method of forming
    Patent number: 9254552
    Abstract: An abrasive article including a substrate having an elongated body, a tacking layer overlying the substrate, and a first type of abrasive particle overlying the tacking layer and defining a first abrasive particle concentration at least about 10 particles per mm of substrate.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: February 9, 2016
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventors: Yinggang Tian, Paul W. Rehrig, Arup K. Khaund, Avanti Jain, Wei Che, Susanne Liebelt, Vincent Tési
  • ABRASIVE ARTICLE AND METHOD OF FORMING
    Publication number: 20140150766
    Abstract: A method of conducting a cutting operation on a workpiece including providing an abrasive article having a substrate having an elongated body, a tacking layer overlying the substrate, and a first type of abrasive particle contained in the tacking layer, the method further including moving the abrasive article and a workpiece relative to each other, the workpiece including a material selected from the group consisting of a ceramic, a semiconductive material, an insulating material, a glass, a natural material, organic material, and a combination thereof.
    Type: Application
    Filed: June 28, 2013
    Publication date: June 5, 2014
    Inventors: Wei Che, Avanti Jain, Christopher Arcona, Yinggang Tian, Paul W. Rehrig
  • Abrasive Article and Method Of Forming
    Publication number: 20140013675
    Abstract: An abrasive article including a substrate having an elongated body, a tacking layer overlying the substrate, and a first type of abrasive particle overlying the tacking layer and defining a first abrasive particle concentration at least about 10 particles per mm of substrate.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 16, 2014
    Inventors: Yinggang Tian, Paul W. Rehrig, Arup K. Khaund, Avanti Jain, Wei Che, Susanne Liebelt, Vincent Tesi