Abstract: An example flow cell includes a patterned substrate having an active region and a bonding region that at least partially surrounds the active region. The active region includes first depressions defined in a layer of the patterned substrate, surface chemistry positioned in the first depressions, and first interstitial regions surrounding the first depressions. The bonding region includes second depressions defined in the layer and second interstitial regions surrounding the second depressions. An adhesive is positioned over the second depressions and over the second interstitial regions. A cover is attached to the adhesive such that a flow channel is defined between a portion of the cover and the active region.

Abstract: An imprinting apparatus includes a silicon master and an anti-stick layer coating the silicon master. The silicon master includes a plurality of features positioned at an average pitch of less than about 425 nm, each of the plurality of features comprises a depression having an opening with its largest opening dimension being less than about 300 nm. The anti-stick layer includes a crosslinked silane polymer network.

Abstract: An imprinting apparatus includes a silicon master and an anti-stick layer coating the silicon master. The silicon master includes a plurality of features positioned at an average pitch of less than about 425 nm, each of the plurality of features comprises a depression having an opening with its largest opening dimension being less than about 300 nm. The anti-stick layer includes a crosslinked silane polymer network.

Abstract: Described herein are improved methods of forming polymer films, the polymer films formed thereby, and electronic devices formed form the polymer films. The methods generally include contacting a polymer with a solvent to at least partially solvate the polymer in the solvent, exposing the at least partially solvated polymer and solvent to ultrasonic energy for a duration effective to form a plurality of ordered assemblies of the polymer in the solvent, and forming a solid film of the polymer, wherein the solid film comprises the plurality of ordered assemblies of the polymer.

Abstract: Described herein are improved methods of forming polymer films, the polymer films formed thereby, and electronic devices formed form the polymer films. The methods generally include contacting a polymer with a solvent to at least partially solvate the polymer in the solvent, exposing the at least partially solvated polymer and solvent to ultrasonic energy for a duration effective to form a plurality of ordered assemblies of the polymer in the solvent, and forming a solid film of the polymer, wherein the solid film comprises the plurality of ordered assemblies of the polymer.

Abstract: Described herein are improved methods of forming polymer films, the polymer films formed thereby, and electronic devices formed form the polymer films. The methods generally include contacting a polymer with a solvent to at least partially solvate the polymer in the solvent, exposing the at least partially solvated polymer and solvent to ultrasonic energy for a duration effective to form a plurality of ordered assemblies of the polymer in the solvent, and forming a solid film of the polymer, wherein the solid film comprises the plurality of ordered assemblies of the polymer.

Abstract: Described herein are improved methods of forming polymer films, the polymer films formed thereby, and electronic devices formed form the polymer films. The methods generally include contacting a polymer with a solvent to at least partially solvate the polymer in the solvent, exposing the at least partially solvated polymer and solvent to ultrasonic energy for a duration effective to form a plurality of ordered assemblies of the polymer in the solvent, and forming a solid film of the polymer, wherein the solid film comprises the plurality of ordered assemblies of the polymer.