Patents by Inventor Ayman Kanan

Ayman Kanan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9887773
    Abstract: A wavelength division multiplexing (WDM) transistor-outline (TO)-can assembly is provided that is capable of transmitting optical data signals having multiple wavelengths. The WDM TO-can assembly can be packaged in a relatively small package without requiring a large amount of plant retooling or capital investment, and that can be made available in the market relatively quickly. A plurality of the WDM TO-can assemblies can be incorporated into a small form factor or C form factor pluggable-type optical communications module to achieve high data rates.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: February 6, 2018
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Kou-Wei Wang, Ayman Kanan, Chih-Chi Lin
  • Publication number: 20170093488
    Abstract: A wavelength division multiplexing (WDM) transistor-outline (TO)-can assembly is provided that is capable of transmitting optical data signals having multiple wavelengths. The WDM TO-can assembly can be packaged in a relatively small package without requiring a large amount of plant retooling or capital investment, and that can be made available in the market relatively quickly. A plurality of the WDM TO-can assemblies can be incorporated into a small form factor or C form factor pluggable-type optical communications module to achieve high data rates.
    Type: Application
    Filed: September 19, 2016
    Publication date: March 30, 2017
    Inventors: Kou-Wei Wang, Ayman Kanan, Chih-Chi Lin
  • Publication number: 20170031118
    Abstract: Various types of optoelectronic components are housed inside a standard TO-can package. In a first exemplary embodiment, a sub-assembly is mounted on a substrate of a TO-can package such that a major surface of the sub-assembly is oriented orthogonal to a major surface of the substrate. The sub-assembly includes a light emitter and a light directing element that is arranged at a fixed distance from the light emitter prior to mounting of the sub-assembly on the substrate. The fixed distance is based on a first mounted distance formed between the light directing element and an optical window of the TO-can package when the sub-assembly is mounted on the substrate. In a second exemplary embodiment, a planar lightwave circuit incorporating an optical waveguide combiner, is mounted on the substrate of a TO-can package. The planar lightwave circuit includes two light emitters emitting light at different wavelengths into the optical waveguide combiner.
    Type: Application
    Filed: July 31, 2015
    Publication date: February 2, 2017
    Inventors: Ayman Kanan, Kou-Wei Wang, Nicholas Jordache