Abstract: A power supply system capable of smoothing photovoltaic generation output, and enabling time shift is provided. A power supply system including a DC power supply string in which a storage battery is connected in parallel to a DC power supply; and a DC/AC power conversion device for connecting the DC power supply string to a power system or a load is provided. A switch is connected between the DC power supply and the storage battery, where an output power of the DC power supply or a combined output power of the DC power supply and the storage battery is switched and supplied to the DC/AC power conversion device by the switch. The photovoltaic generation output is thereby smoothed, and time shift is enabled.

Abstract: A power supply system capable of smoothing photovoltaic generation output, and enabling time shift is provided. A power supply system including a DC power supply string in which a storage battery is connected in parallel to a DC power supply; and a DC/AC power conversion device for connecting the DC power supply string to a power system or a load is provided. A switch is connected between the DC power supply and the storage battery, where an output power of the DC power supply or a combined output power of the DC power supply and the storage battery is switched and supplied to the DC/AC power conversion device by the switch. The photovoltaic generation output is thereby smoothed, and time shift is enabled.

Abstract: A semiconductor laser device includes a package having a front surface, a rear surface and an outer peripheral surface; a semiconductor laser element and a light receiving element provided on the front surface; a plurality of leads arranged in spaced relation on the front surface as extending outward from the package; and an optical element supported above the front surface with its optical axis perpendicular to the front surface for guiding a laser beam emitted from the semiconductor laser element toward an object and guiding light reflected on the object to the light receiving element; wherein the outer peripheral surface is configured so as to be fitted in a cylindrical hole having an axis parallel to the optical axis of the optical element, and has a recess extending from the front surface to the rear surface, and the leads are bent as extending from the front surface and passing through the recess with distal portions thereof extending along the optical axis of the optical element and with proximal ends

Abstract: A semiconductor laser device, with which a compact and thin optical pickup can be realized, is provided. On the top surface of a supporting member, there is formed an element mounting area for mounting a series of elements including a semiconductor laser element, and a light detecting element which detects a laser beam emitted from the semiconductor laser element and reflected by a surface of an outside optical disc so as to be re-entered. An optical path from the semiconductor laser element to the surface of the optical disc includes a vertical optical path advancing from the element mounting area of the supporting member in an approximately vertical upward direction. On a pair of right and left opposing ends of the supporting member, arcuate curved outer surfaces are formed, respectively, so as to fit the supporting member into an installation hole, for a semiconductor laser device, having arcuate curved inner surfaces.

Abstract: A semiconductor laser apparatus of the present invention is composed of an insulating frame 11 in which at least a semiconductor laser device and a light receiving device are mounted. A plurality of leads 10 pass through each of two opposite faces 63A, 63B of the insulating frame 11 and extend from inside to outside of the insulating frame. The insulating frame 11 has external faces 61A, 61B that are parallel to a mounting face 30a on which the semiconductor laser device 1 is mounted. According to the present invention, it is possible to provide a semiconductor laser apparatus that has good productivity and that facilitates position adjustment such as optical axis adjustment and an optical pickup apparatus using the same.

Abstract: A semiconductor laser device that is suitable for mass production, that permits an improved wire layout, and that permits miniaturization includes leads disposed through each of two side faces of an insulating frame member so as to run from outside to inside the insulating frame member, an LD and a light-receiving element mounted inside the insulating frame member, and wires laid inside the insulating frame member so as to connect the leads to the electrodes of the LD and the light-receiving element. Inside the insulating frame member, the tip of one lead is extended farther inward than the edge of an element mount portion that faces the tip of another lead that is disposed through the same side face of the insulating frame member.

Abstract: A semiconductor laser device includes a package having a front surface, a rear surface and an outer peripheral surface; a semiconductor laser element and a light receiving element provided on the front surface; a plurality of leads arranged in spaced relation on the front surface as extending outward from the package; and an optical element supported above the front surface with its optical axis perpendicular to the front surface for guiding a laser beam emitted from the semiconductor laser element toward an object and guiding light reflected on the object to the light receiving element; wherein the outer peripheral surface is configured so as to be fitted in a cylindrical hole having an axis parallel to the optical axis of the optical element, and has a recess extending from the front surface to the rear surface, and the leads are bent as extending from the front surface and passing through the recess with distal portions thereof extending along the optical axis of the optical element and with proximal ends

Abstract: A semiconductor laser device, with which a compact and thin optical pickup can be realized, is provided. On the top surface of a supporting member, there is formed an element mounting area for mounting a series of elements including a semiconductor laser element, and a light detecting element which detects a laser beam emitted from the semiconductor laser element and reflected by a surface of an outside optical disc so as to be re-entered. An optical path from the semiconductor laser element to the surface of the optical disc includes a vertical optical path advancing from the element mounting area of the supporting member in an approximately vertical upward direction. On a pair of right and left opposing ends of the supporting member, arcuate curved outer surfaces are formed, respectively, so as to fit the supporting member into an installation hole, for a semiconductor laser device, having arcuate curved inner surfaces.

Abstract: Provided is a semiconductor laser device capable of being easily accurately mounted on the mounting portion of an optical pickup device. A semiconductor laser element is mounted on a side surface of a heat sink of a base via a submount, and a light-receiving element is mounted on an upper surface of the heat sink. A stem constructed by arranging two resin lead blocks on both sides of the base is covered with a cap, and a hologram element is arranged in an opening provided at an upper surface of the cap. Skirt portions constructed by partially extending peripheral surfaces of a long side of the cap are inserted into recess portions of the stem, and tip portions of projections projecting in the recess portions and inner surfaces of the skirt portions are joined to each other by resistance welding.

Abstract: A semiconductor laser apparatus of the present invention is composed of an insulating frame 11 in which at least a semiconductor laser device and a light receiving device are mounted. A plurality of leads 10 pass through each of two opposite faces 63A, 63B of the insulating frame 11 and extend from inside to outside of the insulating frame. The insulating frame 11 has external faces 61A, 61B that are parallel to a mounting face 30a on which the semiconductor laser device 1 is mounted. According to the present invention, it is possible to provide a semiconductor laser apparatus that has good productivity and that facilitates position adjustment such as optical axis adjustment and an optical pickup apparatus using the same.

Abstract: A semiconductor laser device that is suitable for mass production, that permits an improved wire layout, and that permits miniaturization includes leads disposed through each of two side faces of an insulating frame member so as to run from outside to inside the insulating frame member, an LD and a light-receiving element mounted inside the insulating frame member, and wires laid inside the insulating frame member so as to connect the leads to the electrodes of the LD and the light-receiving element. Inside the insulating frame member, the tip of one lead is extended farther inward than the edge of an element mount portion that faces the tip of another lead that is disposed through the same side face of the insulating frame member.

Abstract: Provided is a semiconductor laser device capable of being easily accurately mounted on the mounting portion of an optical pickup device. A semiconductor laser element is mounted on a side surface of a heat sink of a base via a submount, and a light-receiving element is mounted on an upper surface of the heat sink. A stem constructed by arranging two resin lead blocks on both sides of the base is covered with a cap, and a hologram element is arranged in an opening provided at an upper surface of the cap. Skirt portions constructed by partially extending peripheral surfaces of a long side of the cap are inserted into recess portions of the stem, and tip portions of projections projecting in the recess portions and inner surfaces of the skirt portions are joined to each other by resistance welding.