Patents by Inventor Azizuddin
Azizuddin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9057801Abstract: A geophysical data acquisition system includes at least one geophysical sensor. The at least one geophysical sensor has associated therewith a signal generator configured to generate a signal corresponding to a type of the at least one geophysical sensor. The system includes at least one signal acquisition unit having a plurality of input channels. The at least one geophysical sensor is in signal communication with one of the plurality of input channels. The plurality of input channels each includes a detector for receiving and identifying the signal generated by the signal generator. The at least one signal acquisition unit includes amplification, filtering and digitizing circuits automatically configurable in response to the type of sensor identified by the detected signal.Type: GrantFiled: January 11, 2012Date of Patent: June 16, 2015Assignee: KJT ENTERPRISES, INC.Inventors: John Jiang, Azizuddin Abdul Aziz, Ying Liu, Kurt-M. Strack
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Patent number: 8828480Abstract: The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 ??m or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.Type: GrantFiled: March 12, 2013Date of Patent: September 9, 2014Assignee: The Penn State Research FoundationInventors: Susan Trolier McKinstry, Clive A. Randall, Hajime Nagata, Pascal G. Pinceloup, James J. Baeson, Daniel J. Skamser, Michael S. Randall, Azizuddin Tajuddin
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Patent number: 8717774Abstract: A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.Type: GrantFiled: November 9, 2011Date of Patent: May 6, 2014Assignee: Kemet Electronics CorporationInventors: Michael S. Randall, Garry Renner, John D. Prymak, Azizuddin Tajuddin
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Publication number: 20130176821Abstract: A geophysical data acquisition system includes at least one geophysical sensor. The at least one geophysical sensor has associated therewith a signal generator configured to generate a signal corresponding to a type of the at least one geophysical sensor. The system includes at least one signal acquisition unit having a plurality of input channels. The at least one geophysical sensor is in signal communication with one of the plurality of input channels. The plurality of input channels each includes a detector for receiving and identifying the signal generated by the signal generator. The at least one signal acquisition unit includes amplification, filtering and digitizing circuits automatically configurable in response to the type of sensor identified by the detected signal.Type: ApplicationFiled: January 11, 2012Publication date: July 11, 2013Applicant: KJT Enterprises, Inc.Inventors: John JIANG, Azizuddin Abdul AZIZ, Ying LIU, Kurt-M. STRACK
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Patent number: 8414962Abstract: The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO3 multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO3 dielectric layers and LaNiO3 internal electrodes are prepared, enabling dielectric layer thicknesses of 1 ?m or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.Type: GrantFiled: October 28, 2005Date of Patent: April 9, 2013Assignee: The Penn State Research FoundationInventors: Susan Trolier McKinstry, Clive A. Randall, Hajime Nagata, Pascal I. Pinceloup, James J. Beeson, Daniel J. Skamser, Michael S. Randall, Azizuddin Tajuddin
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Patent number: 8389501Abstract: Azadirachta indica cell suspension culture is used to metabolize dianabol to yield potent anticarcinogenic 17?-hydroxy-17?-methyl-5?-androst-1-en-3-one, which can also be synthesized.Type: GrantFiled: July 17, 2011Date of Patent: March 5, 2013Inventors: Saifullah, Saifullah Khan, Azizuddin, Muhammad Kashif, Ahsana Dar, Muhammad Iqbal Choudhary
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Publication number: 20130018025Abstract: Azadirachta indica cell suspension culture is used to metabolize dianabol to yield potent anticarcinogenic 17?-hydroxy-17?-methyl-5?-androst-1-en-3-one, which can also be synthesized.Type: ApplicationFiled: July 17, 2011Publication date: January 17, 2013Applicant: HEJ Research Institute of ChemistryInventors: Saifullah, Saifullah Khan, Azizuddin, Muhammad Kashif, Ahsana Dar, Muhammad Iqbal Choudhary
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Publication number: 20120081870Abstract: A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.Type: ApplicationFiled: November 9, 2011Publication date: April 5, 2012Applicant: Kemet Electronics CorporationInventors: Michael S. Randall, Garry Renner, John D. Prymak, Azizuddin Tajuddin
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Patent number: 8111524Abstract: A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates.Type: GrantFiled: February 12, 2008Date of Patent: February 7, 2012Assignee: Kemet Electronics CorporationInventors: Michael S. Randall, Garry Renner, John D. Prymak, Azizuddin Tajuddin
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Publication number: 20110096521Abstract: A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates.Type: ApplicationFiled: February 12, 2008Publication date: April 28, 2011Inventors: Michael Randall, Renner Garry, John D. Prymak, Tajuddin Azizuddin
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Patent number: 7923395Abstract: A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula: {[(CaO)t(SrO)1-t]m[(ZrO2)v(TiO2)1-v]}1-s-xAsEx wherein: A is a transition metal oxide; E is an oxide of an element selected from the group consisting of Ge, Si, Ga and combination thereof; m is 0.98 to 1.02; t is 0.50 to 0.90; v is 0.8 to 1.0; s and x are selected from the group consisting of: a) 0?x?0.08, 0.0001?s?0.043 and x?1.86s; and b) 0?0.0533, 0.0001?s?0.08 and x?0.667s.Type: GrantFiled: October 22, 2007Date of Patent: April 12, 2011Assignee: Kemet Electronics CorporationInventors: Michael S. Randall, Corey Antoniades, Daniel E. Barber, Xilin Xu, James Beeson, Pascal Pinceloup, Abhijit Gurav, Thomas Poole, Azizuddin Tajuddin, Ian Burn
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Patent number: 7916451Abstract: A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula: {[(CaO)t(SrO)1-t]m[(ZrO2)v(TiO2)1-v]}1-s-xAsEx wherein: A is a transition metal oxide; E is an oxide of an element selected from the group consisting of Ge, Si, Ga and combinations thereof; m is 0.98 to 1.02; t is 0.50 to 0.90; v is 0.8 to 1.0; s and x are selected from the group consisting of: a) 0?x?0.08, 0.0001?s?0.043 and x?1.86s; and b) 0?x?0.0533, 0.0001?s?0.08 and x?0.667s.Type: GrantFiled: June 11, 2009Date of Patent: March 29, 2011Assignee: Kemet Electronics CorporationInventors: Michael S. Randall, Corey Antoniades, Daniel E. Barber, Xilin Xu, James Beeson, Pascal Pinceloup, Abhijit Gurav, Thomas Poole, Azizuddin Tajuddin, Ian Burn
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Patent number: 7670981Abstract: A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula: {[(CaO)t(SrO)1-t]m[(ZrO2)v(TiO2)1-v]}1-s-xAsEx wherein: A is a transition metal oxide; E is an oxide of an element selected from the group consisting of Ge, Si, Ga and combinations thereof; m is 0.98 to 1.02; t is 0.50 to 0.90; v is 0.8 to 1.0; s and x are selected from the group consisting of: a) 0?x?0.08, 0.0001?s?0.043 and x?1.86s; and b) 0?x?0.0533, 0.0001?s?0.08 and x?0.667s.Type: GrantFiled: October 24, 2008Date of Patent: March 2, 2010Assignee: Kemet Electronics CorporationInventors: Michael S. Randall, Corey Antoniades, Daniel E. Barber, Xilin Xu, James Beeson, Pascal Pinceloup, Abhijit Gurav, Thomas Poole, Azizuddin Tajuddin, Ian Burn
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Publication number: 20090244804Abstract: A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula: {[(CaO)t(SrO)1-t]m[(ZrO2)v(TiO2)1-v]}1-s-xAsEx wherein: A is a transition metal oxide; E is an oxide of an element selected from the group consisting of Ge, Si, Ga and combinations thereof; m is 0.98 to 1.02; t is 0.50 to 0.90; v is 0.8 to 1.0; s and x are selected from the group consisting of: a) 0?x?0.08, 0.0001?s?0.043 and x?1.86s; and b) 0?x?0.0533, 0.0001?s?0.08 and x?0.667s.Type: ApplicationFiled: June 11, 2009Publication date: October 1, 2009Inventors: Michael S. Randall, Corey Antoniades, Daniel E. Barber, Xilin Xu, James Beeson, Pascal Pinceloup, Abhijit Gurav, Thomas Poole, Azizuddin Tajuddin, Ian Burn
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Publication number: 20090046411Abstract: A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula: {[(CaO)t(SrO)1-t]m[(ZrO2)v(TiO2)1-v]}1-s-xAsEx wherein: A is a transition metal oxide; E is an oxide of an element selected from the group consisting of Ge, Si, Ga and combinations thereof; m is 0.98 to 1.02; t is 0.50 to 0.90; v is 0.8 to 1.0; s and x are selected from the group consisting of: a) 0?x?0.08, 0.0001?s?0.043 and x?1.86s; and b) 0?x?0.0533, 0.0001?s?0.08 and x?0.667s.Type: ApplicationFiled: October 24, 2008Publication date: February 19, 2009Inventors: Michael S. Randall, Corey Antoniades, Daniel E. Barber, Xilin Xu, James Beeson, Pascal Pinceloup, Abhijit Gurav, Thomas Poole, Azizuddin Tajuddin, Ian Burn
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Publication number: 20080236717Abstract: A process for forming a multilayer ceramic capacitor. The process includes depositing a ceramic precursor on a substrate and an electrode ink in a predetermined pattern on the ceramic precursor to form a green sheet. The electrode ink has an adhesion promoter incorporated therein. The green sheet is overlayed with at least one second green sheet to form a layered green sheet which is then fused under pressure.Type: ApplicationFiled: May 7, 2008Publication date: October 2, 2008Inventors: Abhijit Gurav, Azizuddin Tajuddin, Daniel Skamser, Garry Renner, March Maguire, Michael S. Randall, Randal Vaughan
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Publication number: 20080239621Abstract: A capacitor with a multiplicity of first plates and second plates in parallel relationship wherein the first plates terminate at a first face and the second plates terminate at a second face. A dielectric is between the first plates and the second plates. A first external termination is in electrical contact with the first plates and a second external termination is in electrical contact with the second plates. A first lead terminal is in electrical contact with the first external termination and the first lead terminal has a first foot below the first external termination and a first solder stop coated on the first foot between the first foot and the first external termination. A second lead terminal is in electrical contact with the second external termination wherein the second lead terminal comprises a second foot below the second external termination and a second solder stop is coated on the second foot between the second foot and the second external termination.Type: ApplicationFiled: March 29, 2007Publication date: October 2, 2008Inventors: Azizuddin Tajuddin, Michael S. Randall, Roy Grace, Mark R. Laps
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Publication number: 20080192452Abstract: A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates.Type: ApplicationFiled: February 12, 2007Publication date: August 14, 2008Inventors: Michael S. Randall, Garry Renner, John D. Prymak, Azizuddin Tajuddin
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Publication number: 20080123251Abstract: A process for forming a capacitive couple. The process includes forming a highly porous body of a conducting material with interior struts and voids in electrical contact. A dielectric layer is formed in the voids on the struts with a material having a dielectric constant above 100. An insulating layer is formed on the struts not covered by the dielectric layer. A conductive layer is formed on the dielectric layer and on the insulating layer.Type: ApplicationFiled: November 28, 2006Publication date: May 29, 2008Inventors: Michael S. Randall, Peter Blais, Pascal Pinceloup, Daniel J. Skamser, Abhijit Gurav, Azizuddin Tajuddin, John T. Kinard, Philip Lessner
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Publication number: 20080107800Abstract: A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula: {[(CaO)t(SrO)1-t]m[(ZrO2)v(TiO2)1-v]}1-s-xAsEx wherein: A is a transition metal oxide; E is an oxide of an element selected from the group consisting of Ge, Si, Ga and combination thereof; m is 0.98 to 1.02; t is 0.50 to 0.90; v is 0.8 to 1.0; s and x are selected from the group consisting of: a) 0?x?0.08, 0.0001?s?0.043 and x?1.86s; and b) 0?0.0533, 0.0001?s?0.08 and x?0.667s.Type: ApplicationFiled: October 22, 2007Publication date: May 8, 2008Inventors: Michael Randall, Corey Antoniades, Daniel Barber, Xilin Xu, James Beeson, Pascal Pinceloup, Abhijit Gurav, Thomas Poole, Azizuddin Tajuddin, Ian Burn