Patents by Inventor Babu Triplicane Gopikrishnan

Babu Triplicane Gopikrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal dissipation in dual-chassis devices
    Patent number: 11755080
    Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: September 12, 2023
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
  • MODULE WITH IMPROVED THERMAL COOLING PERFORMANCE
    Publication number: 20220117122
    Abstract: An apparatus is described. The apparatus includes a semiconductor chip package having a semiconductor chip therein. The semiconductor chip package to communicate a temperature of the semiconductor chip. The apparatus includes a heat sink that is thermally coupled to the semiconductor chip package. The heat sink has fins. The apparatus includes a fan. The apparatus includes a temperature sensing device. The temperature sensing device is to sense a temperature of an ambient before the ambient is warmed by the fins. A rotational speed of the fan is to be determined from the temperature of the semiconductor chip and the temperature of the ambient.
    Type: Application
    Filed: December 17, 2021
    Publication date: April 14, 2022
    Inventors: Ali KALANTARIAN, Malcolm GUTENBURG, Andrew RANDELL, Mirui WANG, Tejas SHAH, Tamara J. LOW FOON, Jason LEE PACK, Yvan LARGE, Shahin AMIRI, Saanjali MAHARAJ, Srinivasarao KONAKALLA, Feroze KHAN, Nagaraj K, Babu TRIPLICANE GOPIKRISHNAN, Yogesh CHANNAIAH
  • THERMAL DISSIPATION IN DUAL-CHASSIS DEVICES
    Publication number: 20220113759
    Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 14, 2022
    Applicant: Intel Corporation
    Inventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
  • Thermal dissipation in dual-chassis devices
    Patent number: 11231757
    Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: January 25, 2022
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
  • HEAT PIPE WITH IN-PLANE HEAT SPREADER AND LOADING MECHANISM
    Publication number: 20210112684
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 15, 2021
    Applicant: Intel Corporation
    Inventors: Penchala Pratap Binni Boyina, Kathiravan D, Babu Triplicane Gopikrishnan, Prakash Kurma Raju, Deepak Sekar, Hari Shanker Thakur
  • THERMAL DISSIPATION IN DUAL-CHASSIS DEVICES
    Publication number: 20190041922
    Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
    Type: Application
    Filed: August 1, 2018
    Publication date: February 7, 2019
    Applicant: Intel Corporation
    Inventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Doddi Raghavendra, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
  • Convertible electronic device
    Patent number: D933059
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: October 12, 2021
    Assignee: Intel Corporation
    Inventors: Babu Triplicane Gopikrishnan, Kathiravan D, Prakash Kurma Raju, Prasanna Pichumani