Abstract: A system for testing semiconductor modules may include a first testing unit, a second testing unit, a classifying unit and a transferring unit. The first testing unit may test functions of the semiconductor modules mounted on a main board. The second testing unit may test the semiconductor modules tested by the first testing unit using a terminal. The classifying unit may classify the semiconductor modules tested by the second testing unit into normal semiconductor modules and abnormal semiconductor modules, or pass/fail. The transferring unit may be connected in-line between the first testing unit and the second testing unit, and between the second testing unit and the classifying unit to transfer the semiconductor modules from the first testing unit to the second testing unit and the classifying unit. Thus, the semiconductor modules may be automatically transferred to the units, so that a test time may be reduced.

Abstract: A system for testing semiconductor modules may include a first testing unit, a second testing unit, a classifying unit and a transferring unit. The first testing unit may test functions of the semiconductor modules mounted on a main board. The second testing unit may test the semiconductor modules tested by the first testing unit using a terminal. The classifying unit may classify the semiconductor modules tested by the second testing unit into normal semiconductor modules and abnormal semiconductor modules, or pass/fail. The transferring unit may be connected in-line between the first testing unit and the second testing unit, and between the second testing unit and the classifying unit to transfer the semiconductor modules from the first testing unit to the second testing unit and the classifying unit. Thus, the semiconductor modules may be automatically transferred to the units, so that a test time may be reduced.

Abstract: An apparatus to test a semiconductor device includes a chamber defining an inner space to receive a plurality of semiconductor devices, a temperature control apparatus connected to the chamber and configured to heat or cool the chamber to a predetermined level, and a control module to transmit an electrical signal to the temperature control apparatus to heat or cool an inner space of the chamber. As a result, the semiconductor devices can be exposed to heating and cooling environments having set test temperature values to selectively perform a test.

Abstract: A socket type module test apparatus can eliminate the problems which are related to the unstable contact between pins and a module in a pin type module test apparatus. At the same time, the socket type module apparatus increases the module test productivity, in comparison with a manual module test using sockets. An embodiment of the present invention comprises a transportation unit for transporting modules; a test unit where the modules are loaded by the transportation unit and tested; and a main control unit for supervising a test procedure by providing test signals to the modules and sorting the module according to test result.