Patents by Inventor Bahgat Sammakia

Bahgat Sammakia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090323463
    Abstract: The invention provides devices and methods for increasing the degree of mixing of fluids, including under conditions of laminar flow and turbulent flow. In one embodiment, mixing of fluids using the invention's devices and methods is increased by splitting the flow of at least one of the fluids into two or more inlet channels. This is optionally followed by further splitting and merging (e.g., using one or more split and merge (SAM) mixer) the fluids.
    Type: Application
    Filed: May 27, 2009
    Publication date: December 31, 2009
    Inventors: Siddharth Bhopte, Bruce Murray, Bahgat Sammakia
  • Publication number: 20090301770
    Abstract: A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution, sufficient to protect the conductive portion from corrosion by the solution, and drive formation of a film on the substrate, controlling a pH of the solution while limiting a production of hydrogen by electrolysis of the solution proximate to the conductive portion; and maintaining the voltage potential for a sufficient duration to produce a film on the conductive portion. An electrode may be formed over the film to produce an electrical device. The film may be, for example, insulating, dielectric, resistive, semiconductive, magnetic, or ferromagnetic.
    Type: Application
    Filed: June 10, 2009
    Publication date: December 10, 2009
    Inventors: Junghyun Cho, Bahgat Sammakia, Mark D. Poliks, Roy Magnuson, Biplab Kumar Roy
  • Publication number: 20090269604
    Abstract: A method of manufacturing a thermal interface material, comprising providing a sheet comprising nano-scale fibers, the sheet having at least one exposed surface; and stabilizing the fibers with a stabilizing material disposed in at least a portion of a void space between the fibers in the sheet. The fibers may be CNT's or metallic nano-wires. Stabilizing may include infiltrating the fibers with a polymerizable material. The polymerizable material may be mixed with nano- or micro-particles. The composite system may include two films, with the fibers in between, to create a sandwich. Each capping film may include two sub films: a palladium film closer to the stabilizing material to improve adhesion; and a nano-particle film for contact with a device to be cooled or a heat sink.
    Type: Application
    Filed: March 12, 2009
    Publication date: October 29, 2009
    Applicant: The Research Foundation of State University of New York
    Inventors: Hao Wang, Bahgat Sammakia, Yayong Liu, Kaikun Yang
  • Publication number: 20090232991
    Abstract: A method of manufacturing a thermal interface material, comprising providing a sheet comprising nano-scale fibers, the sheet having at least one exposed surface; and stabilizing the fibers with a stabilizing material disposed in at least a portion of a void space between the fibers in the sheet. The fibers may be CNT's or metallic nano-wires. Stabilizing may include infiltrating the fibers with a polymerizable material. The polymerizable material may be mixed with nano- or micro-particles. The composite system may include two films, with the fibers in between, to create a sandwich. Each capping film may include two sub films: a palladium film closer to the stabilizing material to improve adhesion; and a nano-particle film for contact with a device to be cooled or a heat sink.
    Type: Application
    Filed: March 12, 2009
    Publication date: September 17, 2009
    Applicant: The Research Foundation of State University of New York
    Inventors: Hao Howard Wang, Bahgat Sammakia, Yayong Liu, Kaikun Yang
  • Patent number: 7282254
    Abstract: A bi- or multi-layer coating is deposited upon a substrate using a low temperature process. The bi-layer is a lower layer of a SAM coating, which is overlaid with a hard coating. The hard coating can be made of materials such as: polymer, Si3N4, BN, TiN, SiO2, Al2O3, ZrO2, YSZ, and other ceramic materials, and the underlying, compliant, SAM coating can comprise substances containing long chain molecules that chemically bond to the substrate. This bi-layer provides both environmental and hermetical protection to electronic hardware and MEMS systems, without employing expensive packaging materials and processes. Multiple bi-layers may be combined to form multi-layer coatings. A protective polymer or other material may optionally be formed as an outside layer.
    Type: Grant
    Filed: February 23, 2004
    Date of Patent: October 16, 2007
    Assignee: The Research Foundation of State University of New York
    Inventors: Junghyun Cho, Scott Oliver, Wayne Jones, Bahgat Sammakia