Patents by Inventor Baik-soon Choi
Baik-soon Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10894935Abstract: Compositions for removing silicone resins and methods of thinning a substrate by using the same, as well as related methods, apparatus and systems for facilitating the removal of silicone resins are provided. The compositions for removing silicone resins, may include a heterocyclic solvent and an alkyl ammonium fluoride salt represented by a formula, (R)4N+F?, wherein R is a C1 to C4 linear alkyl group. Silicone resins may be effectively removed by using the compositions since the compositions exhibit an excellent decomposition rate with respect to the silicone resins that remain on a semiconductor substrate in a process of backside grinding of the semiconductor substrate, backside electrode formation, or the like.Type: GrantFiled: May 18, 2018Date of Patent: January 19, 2021Assignees: SAMSUNG ELECTRONICS CO., LTD., DONGWOO FINE-CHEM CO., LTD.Inventors: In-goo Kang, Sung-bae Kim, Baik-soon Choi, Sue-ryeon Kim, Young-taek Hong, Sang-tae Kim, Kyong-ho Lee, Hyung-pyo Hong, Seong-min Kim
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Publication number: 20180265819Abstract: Disclosed herein are compositions for removing silicone resins and methods of thinning a substrate by using the same, as well as related methods, apparatus and systems for facilitating the removal of silicone resins. More particularly, disclosed herein are compositions for removing silicone resins, the compositions including a heterocyclic solvent and an alkyl ammonium fluoride salt represented by a formula, (R)4N+F?, wherein R is a C1 to C4 linear alkyl group. Silicone resins may be effectively removed by using the compositions since the compositions exhibit an excellent decomposition rate with respect to the silicone resins that remain on a semiconductor substrate in a process of backside grinding of the semiconductor substrate, backside electrode formation, or the like.Type: ApplicationFiled: May 18, 2018Publication date: September 20, 2018Applicants: SAMSUNG ELECTRONICS CO., LTD., Dongwoo Fine-Chem Co., Ltd.Inventors: In-goo KANG, Sung-bae KIM, Baik-soon CHOI, Sue-ryeon KIM, Young-taek HONG, Sang-tae KIM, Kyong-ho LEE, Hyung-pyo HONG, Seong-min KIM
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Patent number: 9840785Abstract: A tin plating solution and a method for fabricating a semiconductor device are provided. The tin plating solution comprises tin ions supplied from a soluble tin electrode, an aliphatic sulfonic acid having a carbon number of 1 to 10, an anti-oxidant, a wetting agent, and a grain refiner that is an aromatic carbonyl compound.Type: GrantFiled: December 22, 2014Date of Patent: December 12, 2017Assignee: Samsung Electronics Co., Ltd.Inventors: Myung-Beom Park, Jin-Hee Lee, Baik-Soon Choi, Jung-Sik Choi
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Publication number: 20170158888Abstract: Disclosed herein are compositions for removing silicone resins and methods of thinning a substrate by using the same, as well as related methods, apparatus and systems for facilitating the removal of silicone resins. More particularly, disclosed herein are compositions for removing silicone resins, the compositions including a heterocyclic solvent and an alkyl ammonium fluoride salt represented by a formula, (R)4N+F?, wherein R is a C1 to C4 linear alkyl group. Silicone resins may be effectively removed by using the compositions since the compositions exhibit an excellent decomposition rate with respect to the silicone resins that remain on a semiconductor substrate in a process of backside grinding of the semiconductor substrate, backside electrode formation, or the like.Type: ApplicationFiled: December 5, 2016Publication date: June 8, 2017Applicant: Dongwoo Fine-Chem Co., Ltd.Inventors: In-goo KANG, Sung-bae KIM, Baik-soon CHOI, Sue-ryeon KIM, Young-taek HONG, Sang-tae KIM, Kyong-ho LEE, Hyung-pyo HONG, Seong-min KIM
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Publication number: 20150308007Abstract: A tin plating solution and a method for fabricating a semiconductor device are provided. The tin plating solution comprises tin ions supplied from a soluble tin electrode, an aliphatic sulfonic acid having a carbon number of 1 to 10, an anti-oxidant, a wetting agent, and a grain refiner that is an aromatic carbonyl compound.Type: ApplicationFiled: December 22, 2014Publication date: October 29, 2015Inventors: Myung-Beom Park, Jin-Hee Lee, Baik-Soon Choi, Jung-Sik Choi
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Patent number: 8227182Abstract: In a thinner composition and a method of forming a photosensitive film, the thinner composition includes about 50 to about 90% by weight of propylene glycol monomethyl ether acetate, about 1 to about 20% by weight of propylene glycol monomethyl ether, about 1 to about 10% by weight of ?-butyrolactone, and about 1 to about 20% by weight of n-butyl acetate. The thinner composition may have a proper volatility and an improved ability to dissolve various types of photosensitive materials, and thus the thinner composition may be usefully employed in an edge bead rinse process, a rework process or a pre-wetting process.Type: GrantFiled: August 11, 2009Date of Patent: July 24, 2012Assignees: Samsung Electronics Co., Ltd., Dongwoo Fine-Chem Co., Ltd.Inventors: Ahn-Ho Lee, Baik-Soon Choi, Seung-Hyun Ahn, Sang-Tae Kim, Yong-Il Kim, Shi-Jin Sung, Kyong-Ho Lee
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Patent number: 7863231Abstract: A thinner composition includes propylene glycol ether acetate, methyl 2-hydroxy-2-methyl propionate, and an ester compound such as ethyl lactate, ethyl 3-ethoxy propionate or a mixture thereof.Type: GrantFiled: May 12, 2008Date of Patent: January 4, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Seung-Hyun Ahn, Eun-Mi Bae, Baik-Soon Choi, Sang-Mun Chon, Dae-Joung Kim, Kwang-sub Yoon, Sang-Kyu Park, Jae-Ho Kim, Shi-Yong Yi, Kyoung-Mi Kim, Yeu-Young Youn
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Publication number: 20100034962Abstract: In a thinner composition and a method of forming a photosensitive film, the thinner composition includes about 50 to about 90% by weight of propylene glycol monomethyl ether acetate, about 1 to about 20% by weight of propylene glycol monomethyl ether, about 1 to about 10% by weight of ?-butyrolactone, and about 1 to about 20% by weight of n-butyl acetate. The thinner composition may have a proper volatility and an improved ability to dissolve various types of photosensitive materials, and thus the thinner composition may be usefully employed in an edge bead rinse process, a rework process or a pre-wetting process.Type: ApplicationFiled: August 11, 2009Publication date: February 11, 2010Inventors: Ahn-Ho LEE, Baik-Soon CHOI, Seung-Hyun AHN, Sang-Tae KIM, Yong-II KIM, Shi-Jin SUNG, Kyong-Ho LEE
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Publication number: 20080214422Abstract: A thinner composition includes propylene glycol ether acetate, methyl 2-hydroxy-2-methyl propionate, and an ester compound such as ethyl lactate, ethyl 3-ethoxy propionate or a mixture thereof.Type: ApplicationFiled: May 12, 2008Publication date: September 4, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seung-Hyun AHN, Eun-Mi BAE, Baik-Soon CHOI, Sang-Mun CHON, Dae-Joung KIM, Kwang-sub YOON, Sang-Kyu PARK, Jae-Ho KIM, Shi-Yong YI, Kyoung-Mi KIM, Yeu-Young YOUN
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Patent number: 7387988Abstract: A thinner composition includes propylene glycol ether acetate, methyl 2-hydroxy-2-methyl propionate, and an ester compound such as ethyl lactate, ethyl 3-ethoxy propionate or a mixture thereof.Type: GrantFiled: February 4, 2005Date of Patent: June 17, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Seung-Hyun Ahn, Eun-Mi Bae, Baik-Soon Choi, Sang-Mun Chon, Dae-Joung Kim, Kwang-Sub Yoon, Sang-Kyu Park, Jae-Ho Kim, Shi-Yong Yi, Kyoung-Mi Kim, Yeu-Young Youn
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Publication number: 20080026585Abstract: A film (e.g., silicon polymer film, photoresist film) may be removed by applying a composition including a quaternary ammonium hydroxide, a sulfoxide compound, a dialkylene glycol alkyl ether, and/or water to the film. A silicon polymer film (e.g., hard mask layer) and a photoresist film, for example, may be removed by the composition using an in-situ process. Additionally, the composition may remove the silicon polymer film and the photoresist film while preventing or reducing damage to an underlying layer and the generation of particle-type etch residue.Type: ApplicationFiled: June 19, 2007Publication date: January 31, 2008Inventors: Eun-Jeong Kim, Seung-Hyun Ahn, Jung-Eun Kim, Young-Im Na, Baik-Soon Choi, Dong-Jun Lee
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Publication number: 20060014391Abstract: A metal-containing pattern structure is formed on a semiconductor substrate, and a cleaning composition is applied to the semiconductor substrate. The cleaning composition includes, based on a total weight of the cleaning composition, about 78 wt % to about 99.98 wt % of an acidic aqueous solution, about 0.01 wt % to about 11 wt % of a first chelating agent, and about 0.01 wt % to about 11 wt % of a second chelating agent. The metal-containing pattern structure includes an exposed first surface portion and a second surface portion covered with a polymer. Application of the cleaning solution forms a first corrosion-inhibition layer on the first surface portion of the metal-containing pattern structure, and removes the polymer from the second surface portion of the metal-containing pattern structure.Type: ApplicationFiled: July 8, 2005Publication date: January 19, 2006Inventors: Kyung-Jin Lee, Seung-Hyun Ahn, Baik-Soon Choi, Kui-Jong Baek, Woong Hahn
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Publication number: 20050176607Abstract: A thinner composition includes propylene glycol ether acetate, methyl 2-hydroxy-2-methyl propionate, and an ester compound such as ethyl lactate, ethyl 3-ethoxy propionate or a mixture thereof.Type: ApplicationFiled: February 4, 2005Publication date: August 11, 2005Inventors: Seung-Hyun Ahn, Eun-Mi Bae, Baik-Soon Choi, Sang-Mun Chon, Dae-Joung Kim, Kwang-Sub Yoon, Sang-Kyu Park, Jae-Ho Kim, Shi-Yong Yi, Kyoung-Mi Kim, Yeu-Young Youn
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Patent number: 6740169Abstract: A conditioning disk and a conditioner for a chemical mechanical polishing (CMP) pad, and a method of fabricating, reworking, and cleaning the conditioning disk, are utilized to improve conditioning efficiency, and to reduce production expenses. The conditioning disk for a CMP pad is divided into regions defined by a size difference of abrasive grains formed on the body surface in each region of the conditioning disk. The method of fabricating the conditioning disk is performed by forming adhesive films for attaching the abrasive grains onto the body surface multiple times. In addition, a used conditioning disk may be reworked by detaching the abrasive grains from the body, and attaching new abrasive grains. A used conditioning disk can also be cleaned of by-products of the conditioning process by a cleaning method using a HF solution or BOE (buffered oxide etch) solution.Type: GrantFiled: June 4, 2003Date of Patent: May 25, 2004Assignee: Samsung Electronics Co., Ltd.Inventors: Sung-bum Cho, Baik-soon Choi, Jin-sung Kim, Kyue-sang Choi
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Patent number: 6682876Abstract: A thinner composition is effective in removing a variety of photoresists, and includes propylene glycol mono-methyl ether acetate, ethyl 3-ethoxy propionate and at least one of &ggr;-butyro lactone and propylene glycol mono-methyl ether. The thinner composition can selectively strip a photoresist coated on a backside and at an edge portion of a substrate, as well as a photoresist coated on a whole front surface of the substrate.Type: GrantFiled: March 5, 2003Date of Patent: January 27, 2004Assignee: Samsung Electronics Co., Ltd.Inventors: Seung-Hyun Ahn, Sang-Mun Chon, Hoe-Sik Chung, Mi-Sook Jeon, Eun-Mi Bae, Baik-Soon Choi, Ok-Seok Jang, Young-Cheul Lim
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Patent number: 6664119Abstract: There is provided a method of optimizing recipe of in-situ cleaning process for process chamber after a specific process on semiconductor wafers by using Residual Gas Analyzer Quadrupole Mass Spectrometer (RGA-QMS) According to the present invention, a Chemical Vapor Deposition (CVD) apparatus for manufacturing semiconductor devices comprises: a process chamber; process gas supply line for supplying process gas into the process chamber; a waste-gas exhaust line for removing the waste-gas from the process chamber after process; a supply line for supplying a ClF3 gas into the process chamber; a sampling manifold for sampling the gas inside process chamber by using pressure difference; and RGA-QMS for analyzing the sampling gas, and the optimization of the end points according to gas flow, pressure, and temperature of the cleaning process for the process chamber is achieved through the analysis by above RGA-QMS.Type: GrantFiled: March 9, 2001Date of Patent: December 16, 2003Assignee: Samsung Electronics Co., Ltd.Inventors: Baik-soon Choi, Jung-il An, Jin-sung Kim, Jung-ki Kim
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Publication number: 20030205239Abstract: A conditioning disk and a conditioner for a chemical mechanical polishing (CMP) pad, and a method of fabricating, reworking, and cleaning the conditioning disk, are utilized to improve conditioning efficiency, and to reduce production expenses. The conditioning disk for a CMP pad is divided into regions defined by a size difference of abrasive grains formed on the body surface in each region of the conditioning disk. The method of fabricating the conditioning disk is performed by forming adhesive films for attaching the abrasive grains onto the body surface multiple times. In addition, a used conditioning disk may be reworked by detaching the abrasive grains from the body, and attaching new abrasive grains. A used conditioning disk can also be cleaned of by-products of the conditioning process by a cleaning method using a HF solution or BOE (buffered oxide etch) solution.Type: ApplicationFiled: June 4, 2003Publication date: November 6, 2003Inventors: Sung-Burn Cho, Baik-Soon Choi, Jin-Sung Kim, Kyue-Sang Choi
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Publication number: 20030157441Abstract: A thinner composition is effective in removing a variety of photoresists, and includes propylene glycol mono-methyl ether acetate, ethyl 3-ethoxy propionate and at least one of &ggr;-butyro lactone and propylene glycol mono-methyl ether. The thinner composition can selectively strip a photoresist coated on a backside and at an edge portion of a substrate, as well as a photoresist coated on a whole front surface of the substrate.Type: ApplicationFiled: March 5, 2003Publication date: August 21, 2003Inventors: Seung-Hyun Ahn, Sang-Mun Chon, Hoe-Sik Chung, Mi-Sook Jeon, Eun-Mi Bae, Baik-Soon Choi, Ok-Seok Jang, Young-Cheul Lim
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Patent number: 6596087Abstract: A conditioning disk and a conditioner for a chemical mechanical polishing (CMP) pad, and a method of fabricating, reworking, and cleaning the conditioning disk, are utilized to improve conditioning efficiency, and to reduce production expenses. The conditioning disk for a CMP pad is divided into regions defined by a size difference of abrasive grains formed on the body surface in each region of the conditioning disk. The method of fabricating the conditioning disk is performed by forming adhesive films for attaching the abrasive grains onto the body surface multiple times. In addition, a used conditioning disk may be reworked by detaching the abrasive grains from the body, and attaching new abrasive grains. A used conditioning disk can also be cleaned of by-products of the conditioning process by a cleaning method using a HF solution or BOE (buffered oxide etch) solution.Type: GrantFiled: February 6, 2001Date of Patent: July 22, 2003Assignee: Samsung Electronics Co., Ltd.Inventors: Sung-bum Cho, Baik-soon Choi, Jin-sung Kim, Kyue-sang Choi
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Patent number: 6589719Abstract: A photoresist stripper composition is made up of a mixture of an acetic acid ester, &ggr;-butyrolactone (GBL), and a non-acetate ester or a poly alkyl alcohol derivative. The acetic acid ester may be at least one of n-butyl acetate, amyl acetate, ethyl aceto-acetate, and isopropyl acetate. The non-acetate ester may be at least one of ethyl lactate (EL), ethyl-3-ethoxy propionate (EEP) and methyl-3-methoxy (MMP). The poly alkyl alcohol derivative may be at least one of propylene glycol monomethyl ester (PGME) and propylene glycol monomethyl ester acetate (PGMEA).Type: GrantFiled: April 5, 2002Date of Patent: July 8, 2003Assignee: Samsung Electronics Co., Ltd.Inventors: Seung-Hyun Ahn, Sang-Mun Chon, Hoe-Sik Chung, Mi-Sook Jeon, Eun-Mi Bae, Baik-Soon Choi, Ok-Seok Jang