Abstract: A printed circuit board includes a ground plane, a power plane having a first main surface and a second main surface opposite to the first main surface, wherein the second main surface faces the ground plane and a shielding structure partially covering the power plane. The shielding structure includes a metal structure covering a peripheral area of the first main surface from a direction facing the first main surface and a plurality of vias electrically and mechanically coupling the metal structure to the ground plane.

Abstract: In one embodiment, an AC ionic blower apparatus includes a housing defining a hole through the housing, a first electrode formed around the hole, a second electrode formed around the hole, and a dielectric material between the first electrode and the second electrode. The center of the second electrode is offset from the center of the first electrode.

Abstract: The speaker coil in a dynamic speaker in a mobile computing device can be used to generate radio frequency (RF) signals having a frequency of about 100 kHz or greater. A speaker amplifier drives the dynamic speaker to produce sound and RF circuitry drives the speaker amplifier to generate the RF signals having a frequency of about 100 kHz or greater. The speaker coil can comprise a tap at an appropriate point between the ends of the coil to cause the coil to operate at resonance over a desired RF frequency band. A low-pass filter can be positioned at the speaker amplifier output to protect the speaker amplifier from RF energy generated by the RF circuitry and a high-pass filter can be positioned at the output of the RF circuitry to protect the RF circuitry from audio energy generated by the speaker amplifier.

Abstract: Electrically conductive compressible gaskets can be employed to ground a heat solution and provide electromagnetic interference (EMI) shielding. A plurality of gaskets may be arranged around the perimeter of an integrated circuit package such as a processor or system on a chip. Each of the gaskets is in contact with a ground plane in the package, and upon contact with a heat sink or cold plate, creates an electrical path that grounds the heat sink or cold plate and thereby minimizes the emission of spurious radio signals. Other embodiments may be described and/or claimed.

Abstract: A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.