Abstract: A silica-alumina based composite material for making hydroprocessing catalysts, is disclosed. The silica-alumina composite material generally comprises at least two silica-aluminas, the first being a modified first silica-alumina, and the second being a second silica-alumina that is unmodified or modified. The first silica-alumina is modified to comprise silica and alumina domains and a silica-alumina interphase. The second silica-alumina may also be modified at the same time or separately to comprise silica and alumina domains and a silica-alumina interphase. The first silica-alumina and the second silica-alumina differ in one or more physical and/or chemical characteristics, e.g., the ratio of silica to alumina, surface area, pore size, pore volume, silica domain size, or alumina domain size. The invention can be used for making catalyst base materials and catalysts useful for upgrading hydrocarbon feedstocks to produce fuels, lubricants, chemicals and other hydrocarbonaceous compositions.

Abstract: An electrical connector assembly includes a connector body that is formed of a first dielectric material defining a terminal cavity configured to receive an electrical terminal. The connector body defines a chamber that is separate from the terminal cavity. The chamber contains a second dielectric material that has a lower dielectric constant property than the first dielectric material, such as air. The connector body may be formed by as additive manufacturing process, such as 3D printing, stereolithography, digital light processing, fused deposition modeling, fused filament fabrication, selective laser sintering, selecting heat sintering, multi-jet modeling, multi-jet fusion, electronic beam melting, and laminated object manufacturing.

Abstract: An electrical connector assembly includes a connector body that is formed of a first dielectric material defining a terminal cavity configured to receive an electrical terminal. The connector body defines a chamber that is separate from the terminal cavity. The chamber contains a second dielectric material that has a lower dielectric constant property than the first dielectric material, such as air. The connector body may be formed by as additive manufacturing process, such as 3D printing, stereolithography, digital light processing, fused deposition modeling, fused filament fabrication, selective laser sintering, selecting heat sintering, multi-jet modeling, multi-jet fusion, electronic beam melting, and laminated object manufacturing.

Abstract: A method of manufacturing an electrical assembly includes the step of forming an electrical circuit assembly having at least two terminating elements. The method further includes the step of forming a casing by overprinting a dielectric material over the electrical circuit assembly using an additive manufacturing process, thereby encapsulating a portion of the electrical circuit assembly. The terminating elements extend from the casing. The terminating elements are not overprinted with the dielectric material. The additive manufacturing process may be 3stereolithography, digital light processing, fused deposition modeling, fused filament fabrication, selective laser sintering, selecting heat sintering, multi-jet modeling, multi-jet fusion, electronic beam melting, laminated object manufacturing, or 3D printing.

Abstract: An electrical connector assembly includes a connector body having a plurality of terminal receiving cavities formed therein and a plurality of flexible retaining arms integrally formed with a cavity wall and projecting from the cavity wall into the terminal receiving cavity toward a centerline of the terminal receiving cavity. The retaining arm defining a lock surface extending from a first free end of the retaining arm in a direction toward the centerline of the terminal receiving cavity. The assembly also includes a plurality of terminals having an end configured to connect with a corresponding mating terminal and a second end configured to be secured to a wire. The end defines a lock edge. The terminal is received in the terminal receiving cavity such that the first lock surface and the second lock surface engages the lock edge, thereby inhibiting the terminal from being withdrawn from the terminal receiving cavity.

Abstract: A wire connector assembly configured to provide a hermetic seal between two distinct environments and a method of constructing same is presented. The assembly includes insulated wire cables having ends that are spaced apart and joined by a wire splice element within a connector body, thereby interrupting a fluid leak path through the strands of the wire cables. The connector body formed of a fiberglass filled epoxide epoxy material may be over-molded the wire splice elements having a matte tin plated finish. A portion of connector body or the wire splice element may be disposed intermediate to the ends of the wire cables, providing an additional physical barrier to the fluid leak path. The materials selected and the shape of the wire splice elements are selected to mitigate the formation of microcracks between the connector body and splice elements that could allow the infiltration of gases through the connector assembly.

Abstract: A wire connector assembly includes a connector body and at least one wire arrangement that communicates with the connector body. The wire arrangement includes at least one electrically-conductive element formed of a continuous solid mass of material throughout. The at least one solid mass element defines a plurality of bores in which at least a portion of the solid mass element separates at least one of the bores from the other bores in the plurality of bores. A plurality of wire cables is received in the plurality of bores and respectively electrically and mechanically connected to the solid mass element. The portion, grooves defined along the portion, and O-ring seals surroundingly disposed on the connector body combine to prevent fluid flow through the assembly when the assembly is disposed in a fluid environment. A pair of methods to construct the wire connector assembly are also presented.

Abstract: A flexible circuit includes a plurality of electrical traces and a plurality of probe tips directly formed thereto. The electrical traces are made of a first electrically conductive material and the probe tips are made of a second electrically conductive material that is harder than the first electrically conductive material. The first material is copper or a copper alloy and the second material is nickel or a nickel alloy, where the second material may be plated with gold. Portions of the probe tips are exposed to facilitate electrical contact with contact pads of another electrical circuit. The flexible circuit may also include a ground layer to facilitate electrical correction with another electrical circuit at relatively high frequencies.

Abstract: A Multi-Chip-Module or MCM (66) is mounted on a supporting motherboard (64). A plurality of first contact pads (99) are formed on the module (66) adjacent to its peripheral edge for interconnection with microelectronic components (70,72,74,76,78) mounted on the module (66). Second contact pads (94) are formed on the motherboard (64) adjacent to respective first contact pads (99). A flexible cable (96) includes controlled impedance microstrip or stripline conductor (98) with first and second gold dots (100,102) at their ends. A frame (104) resiliently presses the first and second gold dots (100, 102) into connection with respective first and second contacts (99,94) for interconnection thereof.